Patents by Inventor Stephen T. Connor

Stephen T. Connor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10807162
    Abstract: A system for additive metal manufacturing, including a deposition mechanism, a translation mechanism mounting the deposition mechanism to the working volume, and a stage. A method for additive metal manufacturing including: selectively depositing a material carrier within the working volume; removing an additive from the material carrier; and treating the resultant material.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: October 20, 2020
    Assignee: Mantle Inc.
    Inventors: Stephen T. Connor, Theodore C. Sorom, James R. Groves
  • Patent number: 10696851
    Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: June 30, 2020
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Brian E. Hardin, Erik Sauar, Dhea Suseno, Jesse J. Hinricher, Jennifer Huang, Tom Yu-Tang Lin, Stephen T. Connor, Daniel J. Hellebusch, Craig H. Peters
  • Publication number: 20200147687
    Abstract: A system for additive metal manufacturing, including a deposition mechanism, a translation mechanism mounting the deposition mechanism to the working volume, and a stage. A method for additive metal manufacturing including: selectively depositing a material carrier within the working volume; removing an additive from the material carrier; and treating the resultant material.
    Type: Application
    Filed: January 16, 2020
    Publication date: May 14, 2020
    Inventors: Stephen T. Connor, Theodore C. Sorom, James R. Groves
  • Publication number: 20200096971
    Abstract: A method for facilitating part fabrication, such as by automated toolpath generation, can include one or more of: receiving a virtual part; modifying the virtual part; and/or determining toolpaths to fabricate the target part. The toolpaths preferably define an ordered series of additive and subtractive toolpaths, more preferably wherein the additive and subtractive toolpaths are interleaved, which can function to achieve high manufacturing efficiency and/or performance. The method can additionally or alternatively include: generating machine instructions based on the toolpaths; fabricating the target part based on the machine instructions; calibrating the fabrication system; and/or any other suitable elements.
    Type: Application
    Filed: November 26, 2019
    Publication date: March 26, 2020
    Inventors: Stephen T. Connor, Alex S. Goldenberg, Jonathan Hsu, Benjamin D. Voiles, Theodore Charles Sorom
  • Publication number: 20200098938
    Abstract: Metallization pastes for use with semiconductor devices are disclosed. The pastes contain silver particles, low-melting-point base-metal particles, organic vehicle, and optional crystallizing agents. Specific formulations have been developed that produce stratified metal films that contain less silver than conventional pastes and that have high peel strengths. Such pastes can be used to make high contact resistance metallization layers on silicon.
    Type: Application
    Filed: August 8, 2019
    Publication date: March 26, 2020
    Inventors: Brian E. Hardin, Stephen T. Connor, James Randy Groves, Craig H. Peters
  • Patent number: 10550291
    Abstract: Oxidation-resistant electrically-conductive metal particles (ORCMP) are disclosed. ORCMPs are comprised of a base-metal core, an oxidation-resistant first shell, and an optional conductive second shell. ORCMPs are low cost alternatives to silver particles in metal fillers for low-temperature, electrically-conductive adhesives. Adhesives including ORCMPs, organic vehicles, and optional conductive metal particles such as silver were formulated to yield conductive films upon curing at low temperatures. Such films can be used in many electronic devices where low-temperature, low cost films are needed.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: February 4, 2020
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Brian E. Hardin, Stephen T. Connor, Craig H. Peters
  • Patent number: 10520923
    Abstract: A method for facilitating part fabrication, such as by automated toolpath generation, can include one or more of: receiving a virtual part; modifying the virtual part; and/or determining toolpaths to fabricate the target part. The toolpaths preferably define an ordered series of additive and subtractive toolpaths, more preferably wherein the additive and subtractive toolpaths are interleaved, which can function to achieve high manufacturing efficiency and/or performance. The method can additionally or alternatively include: generating machine instructions based on the toolpaths; fabricating the target part based on the machine instructions; calibrating the fabrication system; and/or any other suitable elements.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: December 31, 2019
    Assignee: Mantle Inc.
    Inventors: Stephen T. Connor, Alex S. Goldenberg, Jonathan Hsu, Benjamin D. Voiles, Theodore Charles Sorom
  • Publication number: 20190361426
    Abstract: A method for facilitating part fabrication, such as by automated toolpath generation, can include one or more of: receiving a virtual part; modifying the virtual part; and/or determining toolpaths to fabricate the target part. The toolpaths preferably define an ordered series of additive and subtractive toolpaths, more preferably wherein the additive and subtractive toolpaths are interleaved, which can function to achieve high manufacturing efficiency and/or performance. The method can additionally or alternatively include: generating machine instructions based on the toolpaths; fabricating the target part based on the machine instructions; calibrating the fabrication system; and/or any other suitable elements.
    Type: Application
    Filed: May 20, 2019
    Publication date: November 28, 2019
    Inventors: Stephen T. Connor, Alex S. Goldenberg, Jonathan Hsu, Benjamin D. Voiles, Theodore Charles Sorom
  • Patent number: 10418497
    Abstract: Metallization pastes for use with semiconductor devices are disclosed. The pastes contain silver particles, low-melting-point base-metal particles, organic vehicle, and optional crystallizing agents. Specific formulations have been developed that produce stratified metal films that contain less silver than conventional pastes and that have high peel strengths. Such pastes can be used to make high contact resistance metallization layers on silicon.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: September 17, 2019
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Brian E. Hardin, Stephen T. Connor, James Randy Groves, Craig H. Peters
  • Patent number: 10233338
    Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: March 19, 2019
    Assignee: PLANT PV, Inc.
    Inventors: Brian E. Hardin, Erik Sauar, Dhea Suseno, Jesse J. Hinricher, Jennifer Huang, Tom Yu-Tang Lin, Stephen T. Connor, Daniel J. Hellebusch, Craig H. Peters
  • Publication number: 20190016904
    Abstract: A material and method are disclosed such that the material can be used to form functional metal pieces by producing an easily sintered layered body of dried metal paste. On a microstructural level, when dried, the metal paste creates a matrix of porous metal scaffold particles with infiltrant metal particles, which are positioned interstitially in the porous scaffold's interstitial voids. For this material to realize mechanical and processing benefits, the infiltrant particles are chosen such that they pack in the porous scaffold piece in a manner which does not significantly degrade the packing of the scaffold particles and so that they can also infiltrate the porous scaffold on heating. The method of using this paste provides a technique with high rate and resolution of metal part production due to a hybrid deposition/removal process.
    Type: Application
    Filed: September 18, 2018
    Publication date: January 17, 2019
    Applicant: NanoCore Technologies
    Inventors: Stephen T. Connor, James R. Groves, Theodore C. Sorom
  • Publication number: 20180345367
    Abstract: A system for additive metal manufacturing, including a deposition mechanism, a translation mechanism mounting the deposition mechanism to the working volume, and a stage. A method for additive metal manufacturing including: selectively depositing a material carrier within the working volume; removing an additive from the material carrier; and treating the resultant material.
    Type: Application
    Filed: August 13, 2018
    Publication date: December 6, 2018
    Inventors: Stephen T. Connor, Theodore C. Sorom, James R. Groves
  • Patent number: 10087332
    Abstract: A material and method are disclosed such that the material can be used to form functional metal pieces by producing an easily sintered layered body of dried metal paste. On a microstructural level, when dried, the metal paste creates a matrix of porous metal scaffold particles with infiltrant metal particles, which are positioned interstitially in the porous scaffold's interstitial voids. For this material to realize mechanical and processing benefits, the infiltrant particles are chosen such that they pack in the porous scaffold piece in a manner which does not significantly degrade the packing of the scaffold particles and so that they can also infiltrate the porous scaffold on heating. The method of using this paste provides a technique with high rate and resolution of metal part production due to a hybrid deposition/removal process.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: October 2, 2018
    Assignee: NANOCORE TECHNOLOGIES
    Inventors: Stephen T. Connor, James R. Groves, Theodore C. Sorom
  • Patent number: 10000645
    Abstract: A method of forming a fired multilayer stack are described. The method involves the steps of a) applying a wet metal particle layer on at least a portion of a surface of a substrate, b) drying the wet metal particle layer to form a dried metal particle layer, c) applying a wet intercalation layer directly on at least a portion of the dried metal particle layer to form a multilayer stack, d) drying the multilayer stack, and e) co-firing the multilayer stack to form the fired multilayer stack. The intercalating layer may include one or more of low temperature base metal particles, crystalline metal oxide particles, and glass frit particles. The wet metal particle layer may include aluminum, copper, iron, nickel, molybdenum, tungsten, tantalum, titanium, steel or combinations thereof.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: June 19, 2018
    Assignee: PLANT PV, Inc.
    Inventors: Brian E. Hardin, Erik Sauar, Dhea Suseno, Jesse J. Hinricher, Jennifer Huang, Tom Yu-Tang Lin, Stephen T. Connor, Daniel J. Hellebusch, Craig H. Peters
  • Publication number: 20180071819
    Abstract: A system for additive metal manufacturing, including a deposition mechanism, a translation mechanism mounting the deposition mechanism to the working volume, and a stage. A method for additive metal manufacturing including: selectively depositing a material carrier within the working volume; removing an additive from the material carrier; and treating the resultant material.
    Type: Application
    Filed: September 15, 2017
    Publication date: March 15, 2018
    Inventors: Stephen T. Connor, Theodore C. Sorom, James R. Groves
  • Publication number: 20170327701
    Abstract: A material and method are disclosed such that the material can be used to form functional metal pieces by producing an easily sintered layered body of dried metal paste. On a microstructural level, when dried, the metal paste creates a matrix of porous metal scaffold particles with infiltrant metal particles, which are positioned interstitially in the porous scaffold's interstitial voids. For this material to realize mechanical and processing benefits, the infiltrant particles are chosen such that they pack in the porous scaffold piece in a manner which does not significantly degrade the packing of the scaffold particles and so that they can also infiltrate the porous scaffold on heating. The method of using this paste provides a technique deposition/removal process.
    Type: Application
    Filed: May 12, 2017
    Publication date: November 16, 2017
    Applicant: NanoCore Technologies
    Inventors: Stephen T. Connor, James R. Groves, Theodore C. Sorom
  • Patent number: 9741878
    Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: August 22, 2017
    Assignee: PLANT PV, Inc.
    Inventors: Brian E. Hardin, Erik Sauar, Dhea Suseno, Jesse J. Hinricher, Jennifer Huang, Tom Yu-Tang Lin, Stephen T. Connor, Daniel J. Hellebusch, Craig H. Peters
  • Patent number: 9698283
    Abstract: Materials and methods for fabrication of rear tabbing, front busbar, and fine grid line layers for silicon based photovoltaic cells are disclosed. Materials include conductive metallization pastes that contain core-shell nickel based particles.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: July 4, 2017
    Assignee: PLANT PV, Inc.
    Inventors: Brian E. Hardin, Stephen T. Connor, James Randy Groves, Craig H. Peters
  • Publication number: 20170145224
    Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.
    Type: Application
    Filed: November 23, 2016
    Publication date: May 25, 2017
    Inventors: Brian E. Hardin, Erik Sauar, Dhea Suseno, Jesse J. Hinricher, Jennifer Huang, Tom Yu-Tang Lin, Stephen T. Connor, Daniel J. Hellebusch, Craig H. Peters
  • Publication number: 20170148944
    Abstract: A method of forming a fired multilayer stack are described. The method involves the steps of a) applying a wet metal particle layer on at least a portion of a surface of a substrate, b) drying the wet metal particle layer to form a dried metal particle layer, c) applying a wet intercalation layer directly on at least a portion of the dried metal particle layer to form a multilayer stack, d) drying the multilayer stack, and e) co-firing the multilayer stack to form the fired multilayer stack. The intercalating layer may include one or more of low temperature base metal particles, crystalline metal oxide particles, and glass frit particles. The wet metal particle layer may include aluminum, copper, iron, nickel, molybdenum, tungsten, tantalum, titanium, steel or combinations thereof.
    Type: Application
    Filed: November 23, 2016
    Publication date: May 25, 2017
    Inventors: Brian E. Hardin, Erik Sauar, Dhea Suseno, Jesse J. Hinricher, Jennifer Huang, Tom Yu-Tang Lin, Stephen T. Connor, Daniel J. Hellebusch, Craig H. Peters