Abstract: Nanochannel arrays that enable high-throughput macromolecular analysis are disclosed. Also disclosed are methods of preparing nanochannel arrays and nanofluidic chips. Methods of analyzing macromolecules, such as entire strands of genomic DNA, are also disclosed, as well as systems for carrying out these methods.

Abstract: Microstructures and nanostructures (100) consisting of a substrate (110), an array of pillars (120) capped by metallic disc (130), metallic dots (clusters or granules) (140) disposed on the sidewalls of the pillars, and a metallic backplane (150) that can interact to enhance a local electric field, the absorption of the light, and the radiation of the light are disclosed. Methods to fabricate the structures (100) are also disclosed. Applications of the structures to enhance the optical signals in the detection of molecules and other materials on a structure surface, such as fluorescence, photoluminescence and surface enhanced Raman Scattering (SERS) are also disclosed.

Abstract: A mold for imprinting a patterned region by imprint lithography is provided with a peripheral groove around the patterned region. The groove is connected, as by channels through the mold, to a switchable source for gas removal to prevent bubbles and for the application of pressurized gas to separate the mold and substrate. In use, the mold is disposed adjacent the moldable surface and gas is withdrawn from the patterned region through the groove as the mold is pressed toward and into the moldable surface. At or near the end of the imprinting, the process is switched from removal of gas to the application of pressurized gas. The pressurized gas passes through the groove and separates or facilitates separation of the mold and the moldable surface.

Abstract: The invention is directed to new nanoimprint resist and thin-film compositions for use in nanoimprinting lithography. The compositions permit economical high-throughput mass production, using nanoimprint processes, of patterns having sub-200 nm, and even sub-50 nm features.

Abstract: In imprint lithography, a mold having a pattern of projecting and recessed regions is pressed into a moldable surface on a substrate. The thus-imprinted moldable surface is permitted to at least partially harden to retain the imprint, and the substrate and mold are separated. In accordance with the invention, the substrate is separated from the mold by bending laterally distal regions (regions away from the center toward the edges) of the mold transversely away from the interface and transversely restraining the substrate. The mold can then be easily separated from the substrate by transverse displacement. The separation can be facilitated by providing a mold having a lateral dimension that on at least two sides extends beyond the corresponding lateral dimension of the substrate. Alternatively, the substrate can have a greater lateral extent than the mold, and the mold can be restrained. The distal regions of the substrate can be bent in the transverse direction.

Abstract: In imprint lithography, the mold is coated with a surface release layer for a non-sticking separation. Bonding strength of the release layer to the mold depends on the cleanness of the surface and the process of release layer deposition. In accordance with the invention, the mold is disposed in an evacuable chamber, cleaned to remove surface organic contamination and coated with the surface release layer in a chamber, all without relocation or undesired time delay. The chamber encloses a support chuck for the mold or substrate, a surface cleaner unit adjacent the support, a heating source adjacent the support, and advantageously, sensors of measuring chamber pressure, vapor partial pressure and moisture concentration. A vapor source connected to the chamber supplies release surfactant vapor. The mold is cleaned, and the cleaning is followed by vapor phase deposition of the surfactant. The mold is advantageously heated. Typical ways of cleaning include exposure to ozone or plasma ion etch.

Abstract: A mold for imprinting a patterned region by imprint lithography is provided with a peripheral groove around the patterned region. The groove is connected, as by channels through the mold, to a switchable source for gas removal to prevent bubbles and for the application of pressurized gas to separate the mold and substrate. In use, the mold is disposed adjacent the moldable surface and gas is withdrawn from the patterned region through the groove as the mold is pressed toward and into the moldable surface. At or near the end of the imprinting, the process is switched from removal of gas to the application of pressurized gas. The pressurized gas passes through the groove and separates or facilitates separation of the mold and the moldable surface.

Abstract: This invention relates to the fabrication of large area nanoimprint molds having complex patterns with minimal or no use of direct-writing, such as electron beam lithography, ion, laser beam, or mechanical beam lithography. This can be accomplished by forming a pattern of simple nanoscale features and converting the simple features into more complex nanoscale features by a process comprising shadow deposition. The process may also include steps of uniform deposition, etching and smoothing depending on the shape of the complex features.

Abstract: In accordance with the invention, a lateral dimension of a microscale device on a substrate is reduced or adjusted by the steps of providing the device with a soft or softened exposed surface; placing a guiding plate adjacent the soft or softened exposed surface; and pressing the guiding plate onto the exposed surface. Under pressure, the soft material flows laterally between the guiding plate and the substrate. Such pressure induced flow can reduce the lateral dimension of line spacing or the size of holes and increase the size of mesas. The same process also can repair defects such as line edge roughness and sloped sidewalls. This process will be referred to herein as pressed self-perfection by liquefaction or P-SPEL.

Abstract: In accordance with the invention, a lateral dimension of a microscale device on a substrate is reduced or adjusted by the steps of providing the device with a soft or softened exposed surface; placing a guiding plate adjacent the soft or softened exposed surface; and pressing the guiding plate onto the exposed surface. Under pressure, the soft material flows laterally between the guiding plate and the substrate. Such pressure induced flow can reduce the lateral dimension of line spacing or the size of holes and increase the size of mesas. The same process also can repair defects such as line edge roughness and sloped sidewalls. This process will be referred to herein as pressed self-perfection by liquefaction or P-SPEL.

Abstract: A method to forming a pattern on a surface of a substrate, including the steps of providing a mold having a molding surface comprised of one or more protruding features and one or more recessed features for imprinting a pattern. The pattern comprising at least one feature having a lateral dimension of about 2000 nanometer or less. Providing a monomolecular anti-adhesive layer on the mold which is either continuous or discontinuous, prior to depositing a hardenable, flowable material onto the mold and recessed features. The mold and substrate are pressed together, while the flowable material hardens and adheres to the moldable material and the substrate. Upon separation of the mold and the substrate, the hardened material remains on the substrate.

Abstract: In imprint lithography, a mold having a pattern of projecting and recessed regions is pressed into a moldable surface on a substrate. The thus-imprinted moldable surface is permitted to at least partially harden to retain the imprint, and the substrate and mold are separated. In accordance with the invention, the substrate is separated from the mold by bending laterally distal regions (regions away from the center toward the edges) of the mold transversely away from the interface and transversely restraining the substrate. The mold can then be easily separated from the substrate by transverse displacement. The separation can be facilitated by providing a mold having a lateral dimension that on at least two sides extends beyond the corresponding lateral dimension of the substrate. Alternatively, the substrate can have a greater lateral extent than the mold, and the mold can be restrained. The distal regions of the substrate can be bent in the transverse direction.

Abstract: In accordance with the invention, step-and-repeat imprint lithography is effected by applying balanced pressing forces from both sides of a substrate. The pressing forces are substantially equal in amplitude and opposite in direction. With the pressing forces thus balanced, the fixture that steps and holds the substrate does not bear the load of imprinting. The balance allows use of a high resolution aligning stage to carry the substrate and to maintain high accuracy of positioning without being shifted by change of load. With this method, sufficient imprint pressure can be used to obtain high quality patterning, a thin and uniform residual layer, and a high fidelity pattern.

Abstract: The invention disclosed apparatuses and methods to do nanoimprint lithography using a deformable mold. Generally, the apparatus has a chamber with a transparent section on its top wall, which is capable of vacuuming and pressurizing. The deformable mold fixed firmly onto a hollow mold holder around its full periphery is attached to top inner surface of the chamber and positioned underneath the transparent section. The central area of the mold is freely accessible from underneath through the opening of the mold holder. An enclosed volume referring to mold mini-chamber is formed between the mold/holder and top wall of the chamber. Inside chamber, a stage assembly is installed. A chuck to vacuumly hold a substrate is mounted on top of the stage assembly. At beginning of the imprinting, the substrate with a layer of resist is positioned underneath the mold at a predetermined gap between them. Then, the substrate is moved up to contact with the mold either under vacuum or under atmosphere.

Abstract: A surface coating apparatus for preparing a work piece having a working surface for imprint lithography, wherein the work piece comprises either a mold or a substrate. The apparatus includes a vacuum chamber and a generator to produce chemical reaction radicals for cleaning the working surface. The generator may be located inside said vacuum chamber and connected to an inner surface of said vacuum chamber or external to the vacuum chamber and connected thereto via suitable couplings. A fixture within the vacuum chamber is configured to hold the work piece with the working surface accessible by the chemical reaction radicals, and a means is provided for depositing a molecular layer of surfactant on the working surface inside the vacuum chamber.

Abstract: An improved method of imprint lithography involves using field-induced pressure from electric or magnetic fields to press a mold onto a substrate having a moldable surface. In essence, the method comprises the steps of providing a substrate having a moldable surface, providing a mold having a molding surface and pressing the molding surface and the moldable surface together by field-induced pressure from electric or magnetic fields to imprint the molding surface onto the moldable surface. The molding surface advantageously comprises a plurality of projecting features of nanoscale extent or separation, but the molding surface can also be a smooth planar surface, as for planarization. The improved method can be practiced without mechanical presses and without sealing the region between the mold and the substrate.

Abstract: An improved method of imprint lithography involves using fluid-induced pressure from electric or magnetic fields to press a mold onto a substrate having a moldable surface. In essence, the method comprises the steps of providing a substrate having a moldable surface, providing a mold having a molding surface and pressing the molding surface and the moldable surface together by electric or magnetic fields to imprint the molding surface onto the moldable surface. The molding surface advantageously comprises a plurality of projecting features of nanoscale extent or separation, but the molding surface can also be a smooth planar surface, as for planarization. The improved method can be practiced without mechanical presses and without sealing the region between the mold and the substrate.

Abstract: In accordance with the invention, step-and-repeat imprint lithography is effected by applying balanced pressing forces from both sides of a substrate. The pressing forces are substantially equal in amplitude and opposite in direction. With the pressing forces thus balanced, the fixture that steps and holds the substrate does not bear the load of imprinting. The balance allows use of a high resolution aligning stage to carry the substrate and to maintain high accuracy of positioning without being shifted by change of load. With this method, sufficient imprint pressure can be used to obtain high quality patterning, a thin and uniform residual layer, and a high fidelity pattern.

Abstract: The present invention provides methods and apparatus that can manipulate, detect, and/or analyze single molecules, single small particles or single small samples of matter passing through a nanoscale gap within a nanofluidic channel of a detector.

Abstract: A mold for imprinting a patterned region by imprint lithography is provided with a peripheral groove around the patterned region. The groove is connected, as by channels through the mold, to a switchable source for gas removal to prevent bubbles and for the application of pressurized gas to separate the mold and substrate. In use, the mold is disposed adjacent the moldable surface and gas is withdrawn from the patterned region through the groove as the mold is pressed toward and into the moldable surface. At or near the end of the imprinting, the process is switched from removal of gas to the application of pressurized gas. The pressurized gas passes through the groove and separates or facilitates separation of the mold and the moldable surface.