Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).

Abstract: A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.

Abstract: A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.

Abstract: A steamer container system is provided having a container body, a lid assembly and a steamer basket. The lid assembly is removably connected to the container body to close the opening to the cavity of the container body. The lid assembly includes a vent aperture and a vent tab having a protrusion extending therefrom that is adapted to engage and selectively close the vent aperture. The lid assembly may also have a viewing window to view the food being cooked in the container. The steamer basket is sized to fit within the cavity of the container body for cooking food thereon.

Abstract: A steamer container system is provided having a container body, a lid assembly and a steamer basket. The lid assembly is removably connected to the container body to close the opening to the cavity of the container body. The lid assembly includes a vent aperture and a vent tab having a protrusion extending therefrom that is adapted to engage and selectively close the vent aperture. The lid assembly may also have a viewing window to view the food being cooked in the container. The steamer basket is sized to fit within the cavity of the container body for cooking food thereon.

Abstract: A steamer container system is provided having a container body, a lid assembly and a steamer basket. The lid assembly is removably connected to the container body to close the opening to the cavity of the container body. The lid assembly includes a vent aperture and a vent tab having a protrusion extending therefrom that is adapted to engage and selectively close the vent aperture. The lid assembly may also have a viewing window to view the food being cooked in the container. The steamer basket is sized to fit within the cavity of the container body for cooking food thereon.