Abstract: A scaleable bandwidth interconnect (SBI) for interconnection of physical layer devices with link layer devices which includes an ADD BUS interface operative to receive data from one of the link layer devices and direct it to one of the physical layer devices and a DROP BUS interface operative to receive data from one of the physical layer devices and direct it to one of the link layer devices. By utilizing buses to access each of the physical layer devices and the link layer devices permits interfacing between a high density of physical layer devices and a high density of link layer devices.

Abstract: Selectively reinforced blanks are used in a hydroforming process to produce completed components having a predetermined shape and sufficient structural integrity to perform their desired function. To reinforce those components, reinforcing patches are added to the blank prior to hydroforming. Planar patches can be bonded to planar blanks or arcuate patches can be bonded to tubular blanks. In so doing, the hydroforming process produces a complete component, which does not require additional manufacturing steps to reinforce it. Additionally, by selectively using the reinforcing patches, the overall weight of the component is not unduly increased.