Patents by Inventor Steve Lang

Steve Lang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6662319
    Abstract: A multi-processor system in which each processor receives a message from another processor in the system. The message may contain corrupted data that was corrupted during transmission from the preceding processor. Upon receiving the message, the processor detects that a portion of the message contains corrupted data. The processor then replaces the corrupted portion with a predetermined bit pattern known or otherwise programmed into all other processors in the system. The predetermined bit pattern indicates that the associated portion of data was corrupted. The processor that detects the error in the message preferably alerts the system that an error has been detected. The message now containing the predetermined bit pattern in place of the corrupted data is retransmitted to another processor. The predetermined bit pattern will indicate that an error in the message was detected by the previous processor.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: December 9, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David Arthur James Webb, Jr., Richard E. Kessler, Steve Lang
  • Patent number: 6584521
    Abstract: A scaleable bandwidth interconnect (SBI) for interconnection of physical layer devices with link layer devices which includes an ADD BUS interface operative to receive data from one of the link layer devices and direct it to one of the physical layer devices and a DROP BUS interface operative to receive data from one of the physical layer devices and direct it to one of the link layer devices. By utilizing buses to access each of the physical layer devices and the link layer devices permits interfacing between a high density of physical layer devices and a high density of link layer devices.
    Type: Grant
    Filed: December 27, 1999
    Date of Patent: June 24, 2003
    Assignee: PMC-Sierra, Inc.
    Inventors: Jeff D. Dillabough, Steve Lang, Winston Mok
  • Publication number: 20020063145
    Abstract: Selectively reinforced blanks are used in a hydroforming process to produce completed components having a predetermined shape and sufficient structural integrity to perform their desired function. To reinforce those components, reinforcing patches are added to the blank prior to hydroforming. Planar patches can be bonded to planar blanks or arcuate patches can be bonded to tubular blanks. In so doing, the hydroforming process produces a complete component, which does not require additional manufacturing steps to reinforce it. Additionally, by selectively using the reinforcing patches, the overall weight of the component is not unduly increased.
    Type: Application
    Filed: November 29, 2000
    Publication date: May 30, 2002
    Inventors: Steven R. Lotspaih, Robert Broman, Steve Lang, Muammer Koc