Patents by Inventor Steven A. Webster

Steven A. Webster has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMBINATION OF CHIP PACKAGE UNITS
    Publication number: 20090166837
    Abstract: A combination includes a first chip package unit and a second chip package unit on which the first chip package unit is placed. Each of the first and second chip package units includes a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces. The bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the surface of the second chip package unit. The chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces are configured as interface terminals of the combination.
    Type: Application
    Filed: March 31, 2008
    Publication date: July 2, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: STEVEN WEBSTER, YING-CHENG WU, CHAO-YUAN CHAN, SHIH-MIN LO
  • Image sensor chip package
    Patent number: 7554184
    Abstract: A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area (222). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space (32) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: June 30, 2009
    Assignee: Altus Technology Inc.
    Inventors: Steven Webster, Ying-Cheng Wu
  • IMAGING MODULE PACKAGE
    Publication number: 20090153706
    Abstract: An imaging module package includes a substrate, an imaging sensor chip, a functional unit, a housing, and a lens module positioned in the housing. The substrate defines an upper chamber extending through a top surface thereof, and a lower chamber extending through a bottom surface thereof. The imaging sensor chip is positioned in the upper chamber and is electrically connected to the substrate. The functional unit is positioned in the lower chamber and is electrically connected to the substrate. The housing is mounted on the top surface of the substrate and is disposed above the imaging sensor chip.
    Type: Application
    Filed: April 9, 2008
    Publication date: June 18, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: STEVEN WEBSTER, YING-CHENG WU, SHUO-WEI HUANG, SHIH-MIN LO
  • Digital still camera module
    Patent number: 7540672
    Abstract: A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: June 2, 2009
    Assignee: Altus Technology Inc.
    Inventors: Steven Webster, Ying-Cheng Wu, Kun-Hsieh Liu, Po-Chih Hsu
  • Testing system for digital camera modules
    Patent number: 7538862
    Abstract: A testing system (200) for digital camera modules (100) includes a first testing module (50), an assembling mechanism (60), a focusing module (62), a second testing module (70), a carrying mechanism (80), and a main processor (90). The carrying mechanism supports and transports subassemblies of the digital camera modules and the digital camera modules between the first testing module, the assembling mechanism, the focusing module and the second testing module. The first testing module, the assembling mechanism, the focusing module, the carrying mechanism, and the second testing module are all electronically connected with the main processor.
    Type: Grant
    Filed: November 3, 2006
    Date of Patent: May 26, 2009
    Assignee: Altus Technology Inc.
    Inventors: Steven Webster, Ying-Cheng Wu, Yuan-Po Wang
  • Camera module with window mechanical attachment
    Publication number: 20080308717
    Abstract: An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.
    Type: Application
    Filed: August 8, 2008
    Publication date: December 18, 2008
    Inventors: Thomas P. Glenn, Steven Webster
  • Digital camera module with improved image quality
    Patent number: 7460317
    Abstract: A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.
    Type: Grant
    Filed: June 9, 2006
    Date of Patent: December 2, 2008
    Assignee: Altus Technology Inc.
    Inventors: Steven Webster, Ying-Cheng Wu, Ching-Lung Jao
  • Snap lid camera module
    Patent number: 7425750
    Abstract: An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.
    Type: Grant
    Filed: August 17, 2005
    Date of Patent: September 16, 2008
    Assignee: Amkor Technology, Inc.
    Inventors: Thomas P. Glenn, Steven Webster
  • Image sensor chip package
    Publication number: 20080203512
    Abstract: A chip package includes a carrier (32), an image sensor chip (34), a plurality of wires (36), an adhesive means (3262) and a transparent cover (38). The carrier has a cavity (321) therein. The image sensor chip is received in the cavity, and the image sensor has a photosensitive area (344). Each wire electronically connects the image sensor chip and the carrier. The adhesive means is applied to the image sensor chip around the photosensitive area and covers at least one portion of all the wires adjacent to the photosensitive area. The adhesive means surrounds an enclosing body (3264) around the photosensitive area. The transparent cover is mounted to the carrier, and the cover is adhered to the carrier with the adhesive means. The cover with the enclosing body defines a sealing space (37) for enclosing the photosensitive area of the image sensor chip therein.
    Type: Application
    Filed: May 6, 2008
    Publication date: August 28, 2008
    Inventors: Steven Webster, Ying-Cheng Wu
  • IC chip package with cover
    Patent number: 7417327
    Abstract: An IC (integrated circuit) chip package includes a substrate (2), a chip (3), a plurality of bonding wires (32), and a cover (5). The substrate has a top surface, a bottom surface, a receiving chamber (23) defined therein, a plurality of solder pads (24) arranged around the top surface and the bottom surface, and a plurality of vias (25) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: August 26, 2008
    Assignee: Altus Technology Inc.
    Inventors: Steven Webster, Ying-Cheng Wu, Kun-Hsieh Liu, Po-Chih Hsu
  • Digital camera module
    Patent number: 7408205
    Abstract: A digital camera module (200) includes a carrier (20), an image sensor chip (30), a number of wires (50), a holder (60), and a lens module (70). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a number of conductive leads (233) spaced from each other. Each lead has a first terminal portion (235), a second terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301). The wires electrically connect the chip and the leadframe. The holder is mounted to the carrier to close the cavity. The lens module is received in the holder and guides light to the active area of the chip.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: August 5, 2008
    Assignee: Altus Technology Inc.
    Inventors: Steven Webster, Ying-Cheng Wu
  • Method of using a camera module
    Publication number: 20080106624
    Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
    Type: Application
    Filed: December 21, 2007
    Publication date: May 8, 2008
    Inventor: Steven Webster
  • LENS MODULE AND DIGITAL CAMERA MODULE USING SAME
    Publication number: 20080100934
    Abstract: A digital camera module (100) includes a lens module (20) and a chip package (50) mounted in a light path of the lens module. The lens module includes a first lens assembly (21) and a second lens assembly (23). The first lens assembly includes a first fixture (211) having a through hole (212) defined therein and at least one lens (218) received in the through hole. The second assembly includes a second fixture (23) having a through hole (232) defined therein and at least one lens (238) attached therein. One of the first fixture and the second fixture has a slotted annular ring (213) protruding therefrom with an annular slot (214) defined therein. The other has a male annular ring (235) extending therefrom, and the slotted annular ring and the male annular ring matingly engage with each other to fix the first lens assembly and second assembly together.
    Type: Application
    Filed: March 5, 2007
    Publication date: May 1, 2008
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: STEVEN WEBSTER, YING-CHENG WU, CHUN-HUNG LIN
  • IC chip package with isolated vias
    Patent number: 7365421
    Abstract: An IC chip package includes a substrate (2), a chip (5), a plurality of bonding wires (52), and a cover (6). The substrate has a top surface, a receiving chamber (23) having an opening at the top surface, a plurality of solder pads (3) arranged around the top surface and respectively corresponding to the solder pads arranged at a bottom surface opposite to the top surface, and a plurality of vias (4) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads (51) arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate, and covers the opening.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: April 29, 2008
    Assignee: Altus Technology Inc.
    Inventors: Steven Webster, Ying-Cheng Wu, Kun-Hsieh Liu, Po-Chih Hsu
  • Digital camera module for detachably mounting with flex printed circuit board
    Patent number: 7361880
    Abstract: A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip package. The image sensor chip package has a number of outer pads. The outer pads are positioned in the receiving portion of the holder. The conductive elements are received in the receiving portion. One end of each of the conductive elements is connected to the inner pads, the other end of each of the conductive elements is connected to the circuit board.
    Type: Grant
    Filed: June 28, 2006
    Date of Patent: April 22, 2008
    Assignee: Altus Technology Inc.
    Inventor: Steven Webster
  • DIGITAL CAMERA MODULE AND ASSEMBLING METHOD WITH SAME
    Publication number: 20080075456
    Abstract: A portable electronic device (400) includes a housing (402) and a digital camera module (200). The housing has at least one arcuate housing surface section (4024) at one end thereof. The digital camera module is received in the housing proximate the one end thereof. The digital camera module includes at least one contact portion. Each contact portion has an arcuate contact surface (6400), and each such contact portion tightly engages a corresponding arcuate housing surface section. Owing to the tight engagement of such arcuate surfaces, the top surface of the digital camera module may fit closely against the housing so as to more fully use the space in the portable electronic device. This would help satisfy the miniaturization requirement of the portable electronic device.
    Type: Application
    Filed: March 16, 2007
    Publication date: March 27, 2008
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: STEVEN WEBSTER, YU-CHIEH CHENG
  • Digital camera module package fabrication method
    Patent number: 7342215
    Abstract: A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.
    Type: Grant
    Filed: June 14, 2006
    Date of Patent: March 11, 2008
    Assignee: Altus Technology Inc.
    Inventors: Steven Webster, Ying-Cheng Wu, Kun-Hsieh Liu
  • Camera module fabrication method including the step of removing a lens mount and window from the mold
    Patent number: 7332712
    Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: February 19, 2008
    Assignee: Amkor Technology, Inc.
    Inventor: Steven Webster
  • Camera module fabrication method
    Publication number: 20070152147
    Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
    Type: Application
    Filed: February 14, 2007
    Publication date: July 5, 2007
    Inventor: Steven Webster
  • Testing system for digital camera modules
    Publication number: 20070146486
    Abstract: A testing system (200) for digital camera modules (100) includes a first testing module (50), an assembling mechanism (60), a focusing module (62), a second testing module (70), a carrying mechanism (80), and a main processor (90). The carrying mechanism supports and transports subassemblies of the digital camera modules and the digital camera modules between the first testing module, the assembling mechanism, the focusing module and the second testing module. The first testing module, the assembling mechanism, the focusing module, the carrying mechanism, and the second testing module are all electronically connected with the main processor.
    Type: Application
    Filed: November 3, 2006
    Publication date: June 28, 2007
    Applicant: ALTUS TECHNOLOGY INC.
    Inventors: Steven Webster, Ying-Cheng Wu, Yuan-Po Wang