Abstract: Disclosed is a method of browsing a collection of sortable items (201) stored in a digital system. A plurality of grouping hierarchies (207, 217) are provided, each comprising a sort order and zero or more grouping levels (204-206, 214-216) forming groups with which the items are associable. At least one grouping hierarchy comprises a sort order and at least one grouping level. One item (203) in the collection is set to be a focus item (208, 218) thereby establishing a current focus group (209, 219) of a current grouping hierarchy. The focus item is then maintained upon selection of a new grouping hierarchy (210-220) from one of the plurality. A displaying of the collection of items may be performed by arranging the items in a list sorted according to one sort order of a plurality of sort orders associable with the items.

Abstract: An image sensor chip package method includes the following steps: firstly, a plurality of shaped conductors are provided. Secondly, plastics are injected to partially enclose the conductors, thereby forming a base. Some of the conductors are exposed outside of the base. Thirdly, a ring-like middle portion is further formed on the base by means of injection. The base and the middle portion cooperatively form a space. Fourthly, an image sensor having a plurality of pads is disposed in the space. Fifthly, a number of bonding wires are provided to connect the pads and the conductors. Finally, a cover is secured to the top of the middle portion via an adhesive glue, thereby hermetically sealing the space and allowing light beams to pass therethrough.

Abstract: A digital camera module (200) includes a carrier (20), an image sensor chip (30), a number of wires (50), a holder (60), and a lens module (70). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a number of conductive leads (233) spaced from each other. Each lead has a first terminal portion (235), a second terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301). The wires electrically connect the chip and the leadframe. The holder is mounted to the carrier to close the cavity. The lens module is received in the holder and guides light to the active area of the chip.

Abstract: An image sensor chip packaging method includes: first, providing a carrier (20). The carrier includes a base (21) and a lead frame (23). The base has a chamber (214) defined therein. The lead frame has a plurality of conduction pieces (233). The conduction pieces of the lead frame are embedded in the base and are spaced from each other. An image sensor chip (30) is then mounted in the chamber. The image sensor has a photosensitive area (301) and a plurality of chip pads (302). A plurality of bonding wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one of the exposed ends of a corresponding conduction piece of the carrier. A holder (50) having a holding cavity (54) is then provided. Finally, the carrier is then mounted in the holding cavity of the holder.

Abstract: An image sensor chip package (200) includes a carrier (20), an image sensor chip (30), a number of wires (50) and a holder (60). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a plurality of conductive leads (233) spaced from each other. Each lead has a first terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301) and a number of contacts (302). The wires electrically connect the contacts of the chip and the first terminal portions of the leadframe. The holder is mounted to the carrier to close the cavity, and allows light to pass therethrough to reach the active area of the chip.

Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Abstract: A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.

Abstract: A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip package. The image sensor chip package has a number of outer pads. The outer pads are positioned in the receiving portion of the holder. The conductive elements are received in the receiving portion. One end of each of the conductive elements is connected to the inner pads, the other end of each of the conductive elements is connected to the circuit board.

Abstract: An image sensor package method includes the steps of first, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an image sensor chip on the base and received in the cavity, the image sensor having a photosensitive area. Third, providing a plurality of wires, each electrically connects the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourth, applying an adhesive means around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover on the carrier, where an adhesive means fixes the cover in place.

Abstract: A digital camera module includes a barrel (10), a seat (20) and an image sensor chip package (30) in accordance with a preferred embodiment is shown. The image sensor chip package includes a carrier (32), a chip (34), a number of bonding wires (36) and a cover (38). The carrier includes a base (24). The chip is mounted on the base and has an active area. The second conductive means electronically connects the chip and the conductive means. An adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover adheres to the carrier with the adhesive means and defines a sealing space (37) for sealing the active area of the chip therein. The active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

Abstract: A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area (222). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space (32) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Abstract: A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.

Abstract: A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.

Abstract: An image sensor chip package (200) includes a base (20), an image sensor chip (23), a plurality of wires (24), an adhesive means (26) and a cover (28). The base has a top surface (201) and a plurality of top pads (204) arranged on the top surface. The image sensor chip is mounted on the top surface of the base and includes a photosensitive area (231) and a plurality of chip pads (232) around the photosensitive area. The wires electrically connect the chip pads of image sensor chip and the top pads of the base. The adhesive means is applied on peripheral edge of the image sensor chip, over the wires and covers areas where the wires connecting with the chip pads. The cover is transparent and is mounted to the image sensor chip via the adhesive means. The cover seals the photosensitive area of the image sensor chip.

Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Abstract: A method is disclosed for creating a user interface for a spreadsheet-based software application. The method includes providing a spreadsheet having a plurality of standard cells displayable as standard spreadsheet cells, and a plurality of user interface cells displayable only as a window superimposed upon the standard spreadsheet cells; and providing at least one control function adapted to create the window superimposed upon the standard spreadsheet cells. Also disclosed is a user interface for a spreadsheet-based software application that includes a spreadsheet having a plurality of standard cells displayable as standard spreadsheet cells; and at least one custom view control function adapted to create a window superimposed upon the standard spreadsheet cells, the window displaying a subset of the standard cells. This invention substantially simplifies the task of programming a user interface using a spreadsheet environment.

Abstract: A method of forming an optical module includes mounting an image sensor to a base of a substrate and bonding a lens housing to a sidewall of the substrate. A mounting surface of the lens housing includes a locking feature having a horizontal surface and a vertical surface. The sidewall of the substrate includes a joint surface. To bond the lens housing to the sidewall of the substrate, a bond is formed between the horizontal surface of the locking feature of the lens housing and the joint surface of the sidewall. Further, a bond is formed between the vertical surface of the locking feature of the lens housing and an interior surface of the sidewall.

Abstract: The present invention is directed to facilitating communication within an automation system having a plurality of networks and network protocols. Specifically, a Modbus network is operably connected to a network. A fieldbus coupler operably connected to both networks having a program facilitates communication within the automation system wherein devices connected to the network can be accessed for monitoring and/or controlling via Modbus commands. The fieldbus coupler (FBC) program accepts a Modbus function code containing one or more embedded message of varying types. The FBC program using additional information contained in the Modbus function code and the message type reads or writes only the required information to and from the field devices. This specific read or write request of the information and the embedding of more than one message type reduces overhead and bandwidth usage, thus improving bus response time and efficiency.

Abstract: An IC (integrated circuit) chip package includes a substrate (2), a chip (3), a plurality of bonding wires (32), and a cover (5). The substrate has a top surface, a bottom surface, a receiving chamber (23) defined therein, a plurality of solder pads (24) arranged around the top surface and the bottom surface, and a plurality of vias (25) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.