Abstract: Semiconductor dies and methods to mold lock a semiconductor die are disclosed. A disclosed example semiconductor die includes a top surface, a bottom surface, and a plurality of sides joining the top surface and the bottom surface. At least one of the sides includes an interference structure to mold lock the die in a package.

Abstract: Methods for packaging light-sensitive semiconductor devices in packages are described in which a transparent window aligned with light-sensitive surfaces of the devices are provided. The methods of the invention include steps for affixing a transparent body to a light-sensitive surface of the semiconductor device, affixing the device to a leadframe, and placing the assembled leadframe, device, and transparent body into a mold configured for contacting the transparent body. The assembled leadframe and device are encapsulated and removed from the mold, forming a package encased in encapsulant and having a transparent window aligned with the light-sensitive surface of the device.

Abstract: An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.

Abstract: A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The ribbon wire (104) is bonded to the workpiece (106) along a bonding surface (112) of the bond capillary (102) and penetrated, at least partially, between the bonding surface and the engagement surface (120) of the bond capillary by a cutting tool (124). The cutting tool (124) may comprise an elongate member (126) positioned between the bonding surface (112) and engagement surface (120), and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool (124) may further comprise a ring cutter (132), wherein the ribbon wire passes through a ring (134) having a cutting surface (138) defined about an inner diameter thereof.