Abstract: Cooling module includes a mounting element, a force application member, a lever, and a cold plate movably coupled to the mounting element. The mounting element having engagement members, is coupled to a receptacle of an electronic device that is configured to receive a removable electronic device at the receptacle. The force application member having spring fingers, is disposed between the mounting element and the cold plate, and movable relative to the mounting element. The lever is connected to the mounting element and the force application member and shiftable between actuated and unactuated states. In the actuated state, the lever pushes the force application member along a first direction causing the engagement members to move the force application member along a second direction perpendicular to the first direction and urge the cold plate to compress the spring fingers and establish thermal contact between the cold plate and the removable electronic module.

Abstract: Example implementations relate to a cooling assembly of a host circuit device, a circuit assembly including the host circuit device and a removable circuit device, and a method for thermal management of the removable circuit device removably connected to the host circuit device. The cooling assembly includes a cooling component and a thermal gap pad having an elastomer component movably connected to the cooling component and a plurality of beams embedded in the elastomer component. Each beam includes a first end portion, a second end portion, and a body portion extended between the first and second end portions. The first end portion of each of one or more beams is disposed in a first thermal contact with the cooling component and a second end portion of each of the one or more beams is disposed in a second thermal contact with a heat sink of the removable circuit device.

Abstract: A heat removal apparatus may comprise a vapor chamber device and a cover coupled to the vapor chamber device. The vapor chamber device comprises a base, a folded fin structure coupled to the base, with the base and folded fin structure defining a vapor chamber containing a wick and a working fluid. The cover and the vapor chamber device define a liquid chamber configured to receive liquid coolant. The folded fin structure comprises a plurality of folded fins defining a first plurality of grooves on a first side of the folded fin structure and defining a second plurality of grooves on a second side of the folded fin structure. The first plurality of grooves are part of the vapor chamber. The second plurality of grooves are part of the liquid chamber.

Abstract: Examples described herein relate to compact and replaceable accumulator to be utilized in a chassis-level cooling device. The accumulator is a low pressurized device having a housing, a bladder, and a compressible fluid. The housing has an inner surface defining a volume and an opening. The bladder is disposed within a volume portion and attached to the opening. The bladder includes a plurality of elongated wall sections foldably coupled to each other and defining a bladder volume therebetween. The bladder inflates by unfolding the plurality of elongated wall sections to increase the bladder volume in response to an increase in a pressure of a working fluid inside the bladder volume. The compressible fluid is contained in a remaining volume portion between the inner surface of the housing and the bladder. The compressible fluid is compressed to an offset pressure in response to inflation of the plurality of elongated wall sections.

Abstract: Cooling module includes a mounting element, a force application member, a lever, and a cold plate movably coupled to the mounting element. The mounting element having engagement members, is coupled to a receptacle of an electronic device that is configured to receive a removable electronic device at the receptacle. The force application member having spring fingers, is disposed between the mounting element and the cold plate, and movable relative to the mounting element. The lever is connected to the mounting element and the force application member and shiftable between actuated and unactuated states. In the actuated state, the lever pushes the force application member along a first direction causing the engagement members to move the force application member along a second direction perpendicular to the first direction and urge the cold plate to compress the spring fingers and establish thermal contact between the cold plate and the removable electronic module.

Abstract: Example implementations relate to a cooling assembly of a host circuit device, a circuit assembly including the host circuit device and a removable circuit device, and a method for thermal management of the removable circuit device removably connected to the host circuit device. The cooling assembly includes a cooling component and a thermal gap pad having an elastomer component movably connected to the cooling component and a plurality of beams embedded in the elastomer component. Each beam includes a first end portion, a second end portion, and a body portion extended between the first and second end portions. The first end portion of each of one or more beams is disposed in a first thermal contact with the cooling component and a second end portion of each of the one or more beams is disposed in a second thermal contact with a heat sink of the removable circuit device.

Abstract: A first electronic device may comprise a chassis and first fins. The chassis may be configured to removably couple with a second electronic device. The first fins are configured to interleave with second fins of the second electronic device in a coupled state of the first and second electronic devices. A corrugated thermal interface device comprises folded fins. The folded fins are coupled to the first fins and are also removably couplable to the second fins in the coupled state of the first and second electronic devices. Each folded fin comprises one or more lateral walls, and the corrugated thermal interface device further comprises a plurality of spring fingers coupled to and extending at least partially in a lateral direction from the lateral walls. The spring finger contacts may be contacted and displaced by the second fins in the coupled state of the first and second electronic devices.

Abstract: An energy storage and electricity generating system for alternately storing energy and producing electricity includes a framework, which is positionable proximate to a surface of a body of water and to which a motor and a turbine are attached. A cable is operationally engaged to the motor by a pair of guide pulleys. A pair of tanks is attached singly to opposed ends of the cable, positioning the motor to selectively raise one of the tanks while the other is being lowered. Actuated valves and release valves on the tanks allow pressurized air to be selectively generated within the tanks and pressurized water to be forced from the tanks, respectively, as the tanks are lowered and raised. The water is forced through a hose onto blades of the turbine to generate an electrical current.

Abstract: A first electronic device may comprise a chassis and first fins. The chassis may be configured to removably couple with a second electronic device. The first fins are configured to interleave with second fins of the second electronic device in a coupled state of the first and second electronic devices. A corrugated thermal interface device comprises folded fins. The folded fins are coupled to the first fins and are also removably couplable to the second fins in the coupled state of the first and second electronic devices. Each folded fin comprises one or more lateral walls, and the corrugated thermal interface device further comprises a plurality of spring fingers coupled to and extending at least partially in a lateral direction from the lateral walls. The spring finger contacts may be contacted and displaced by the second fins in the coupled state of the first and second electronic devices.

Abstract: Example implementations relate to a cooling assembly of a host circuit device, a circuit assembly including the host circuit device and a removable circuit device, and a method for thermal management of the removable circuit device removably connected to the host circuit device. The cooling assembly includes a cooling component and a thermal gap pad having an elastomer component movably connected to the cooling component and a plurality of beams embedded in the elastomer component. Each beam includes a first end portion, a second end portion, and a body portion extended between the first and second end portions. The first end portion of each of one or more beams is disposed in a first thermal contact with the cooling component and a second end portion of each of the one or more beams is disposed in a second thermal contact with a heat sink of the removable circuit device.

Abstract: A first electronic device may comprise a chassis and first fins. The chassis may be configured to removably couple with a second electronic device. The first fins are configured to interleave with second fins of the second electronic device in a coupled state of the first and second electronic devices. A corrugated thermal interface device comprises folded fins. The folded fins are coupled to the first fins and are also removably couplable to the second fins in the coupled state of the first and second electronic devices. Each folded fin comprises one or more lateral walls, and the corrugated thermal interface device further comprises a plurality of spring fingers coupled to and extending at least partially in a lateral direction from the lateral walls. The spring finger contacts may be contacted and displaced by the second fins in the coupled state of the first and second electronic devices.

Abstract: A heat removal apparatus may comprise a vapor chamber device and a cover coupled to the vapor chamber device. The vapor chamber device comprises a base, a folded fin structure coupled to the base, with the base and folded fin structure defining a vapor chamber containing a wick and a working fluid. The cover and the vapor chamber device define a liquid chamber configured to receive liquid coolant. The folded fin structure comprises a plurality of folded fins defining a first plurality of grooves on a first side of the folded fin structure and defining a second plurality of grooves on a second side of the folded fin structure. The first plurality of grooves are part of the vapor chamber. The second plurality of grooves are part of the liquid chamber.

Abstract: Systems and methods described herein make previously stranded power capacity (power that is provisioned for a data center according to a computing system's nameplate power consumption but is currently not useable) available to the data center. Systems described herein generate empirical power profiles that specify expected upper bounds for the power consumption levels that applications trigger. Using the upper bounds for application power-consumption levels, a computing system described herein can reliably release part of its provisioned nameplate power for other systems or data center consumers, reducing the amount of stranded power in a data center. The method described herein avoids performance penalties for most jobs by using sensor measurements made at a rapid rate explained herein to ensure that a system power cap based on running application's measured peak power consumption is reliable with reference to the power capacitance inherent in the computing system.

Abstract: Examples described herein relate to compact and replaceable accumulator to be utilized in a chassis-level cooling device. The accumulator is a low pressurized device having a housing, a bladder, and a compressible fluid. The housing has an inner surface defining a volume and an opening. The bladder is disposed within a volume portion and attached to the opening. The bladder includes a plurality of elongated wall sections foldably coupled to each other and defining a bladder volume therebetween. The bladder inflates by unfolding the plurality of elongated wall sections to increase the bladder volume in response to an increase in a pressure of a working fluid inside the bladder volume. The compressible fluid is contained in a remaining volume portion between the inner surface of the housing and the bladder. The compressible fluid is compressed to an offset pressure in response to inflation of the plurality of elongated wall sections.

Abstract: Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

Abstract: Examples described herein relate to a cooling assembly. In some examples, the cooling assembly includes a cooling component and a thermal gap pad disposed in thermal contact with the cooling component. The thermal gap pad includes thermally conductive fabric that is curved at a plurality of locations along one or both of its length or its breadth, wherein a first side of the thermal gap pad is disposed in thermal contact with the cooling component and a second side of the thermal gap pad is disposable in thermal contact with a heat generating component. Certain examples described herein also relate to an electronic circuit module having the cooling assembly.

Abstract: Systems and methods described herein make previously stranded power capacity (power that is provisioned for a data center according to a computing system's nameplate power consumption but is currently not useable) available to the data center. Systems described herein generate empirical power profiles that specify expected upper bounds for the power consumption levels that applications trigger. Using the upper bounds for application power-consumption levels, a computing system described herein can reliably release part of its provisioned nameplate power for other systems or data center consumers, reducing the amount of stranded power in a data center. The method described herein avoids performance penalties for most jobs by using sensor measurements made at a rapid rate explained herein to ensure that a system power cap based on running application's measured peak power consumption is reliable with reference to the power capacitance inherent in the computing system.

Abstract: A flexible input/output (I/O) expansion card connection and communication technique are provided. The flexible I/O expansion card is, in some examples, a mezzanine expansion card that may be a single width mezzanine expansion card, a double width expansion card, or a quad width expansion card. Multiple connectors on a mainboard provide a slot to receive plug in (insertion) of an expansion card. A slot is associated with a communication bus (e.g., Peripheral Component Interconnect (PCI)) established between the expansion card and an associated processor. The expansion card (or more than one expansion card) may be inserted in multiple orientations with respect to the multiple connectors. Automatic adjustment of communication on the communication bus may be implemented via one or more hardware level and/or software assisted translations to allow the mezzanine expansion card to function in a normal or a reverse (180 degrees relative to normal) orientation.

Abstract: An optical network on chip comprises a first optical communication link and a second communication optical link. The first communication optical link comprises a plurality of first wavelength division multiplexers (WDMs) coupled to a first processor, a plurality of second WDMs coupled to a second processor, and a plurality of first optical interconnects coupled between the plurality of first WDMs and the plurality of second WDMs. The second optical communication link comprises a plurality of first serializer-deserializers (SerDes) coupled to the first processor at one end and coupled to a plurality third WDMs at the other end, a plurality of second SerDes coupled to a memory component at one end and coupled to a plurality of fourth WDMs at the other end, and a plurality of second optical interconnects coupled between the plurality of third WDMs and the plurality of fourth WDMs.

Abstract: A photonic node includes a first circuit disposed on a first substrate and a second circuit disposed on a second substrate different from the first substrate. The first circuit is configured to route light signals originated from the photonic node to local nodes of a local group in which the photonic node is a member. The second circuit is configured to route light signals received from a node of an external group in which the photonic node is not a member, to one of the local nodes.