Abstract: A plasma processing method and system including an apparatus and method for securing semiconductor hardware without the use of exposed threaded hardware. Consistent mechanical and electrical contact between parts in the assembled condition can also be achieved.

Abstract: The present invention provides a disposable component for a plasma processing system, wherein the component includes a non-refractory ceramic fiber, refractory ceramic fiber, alumina, alumina-silica, or zirconia, or any combination of two or more thereof in the form of a rigid material, flexible material, paper, cloth, felt, mat, screen, sheet, tape, blanket, fiber, woven fiber, or nonwoven fiber, or any combination of two or more thereof.

Abstract: An upper electrode assembly (UEL) is supported in an insulator in an opening in the top of an etch chamber in which large diameter substrates are processed with a flange of the UEL overlying the chamber wall around the opening with the insulator in between so that the insulator experiences primarily compressive and minimal shear loads. The electrode nonetheless fills the otherwise vacuum space between the UEL and the chamber wall above a shield ring that covers the insulator and portions of the adjacent UEL face and chamber wall.

Abstract: An apparatus for processing semiconductors includes a processing chamber including a plurality of chamber walls, a substrate holder, positioned within the processing chamber and configured to support the substrate, and a linear displacement device, coupled between a base wall of the plurality of walls and the substrate holder and configured to move the substrate holder relative to the base wall. A shielding part extending from the substrate holder to be in close parallel relation with at least one of the plurality of walls such that a first area of the processing chamber is substantially shielded from a processing environment to which the substrate is exposed.

Abstract: A vacuum processing apparatus including a process chamber having a plurality of pumping ports, and a plurality of pumping cells each connected to a respective pumping port of the plurality of pumping ports. The plurality of pumping ports is preferably located on a lower wall of the process chamber adjacent to a process chamber volume. A process chamber is also provided that includes a lower wall and a side wall, where the side wall has a height of about four inches. The vacuum processing apparatus further includes a chamber liner configured to displace open volume within the process chamber.

Abstract: The present invention presents a baffle assembly located in a plasma processing system, comprising a baffle carrier attached to the plasma processing system, and at least two baffle inserts having a plurality of passages therethrough, the at least two baffle inserts being supported by the baffle carrier.

Abstract: A viewing port for a processing chamber is provided that includes a viewing window cleaning apparatus, a viewing window, and a mounting, where the viewing window cleaning apparatus is coupled to the mounting and disposed between the viewing window and the process chamber, and is configured to form a cleaning plasma in a cleaning plasma region of the mounting. In addition, the mounting can be configured to reduce a number of by-products from a process chamber on the viewing window by preventing them from propagating to the window.

Abstract: A system for monitoring a condition of a consumable component in a substrate processing system that includes a tapered plug having a first axis, a second axis that intersects the first axis, a top portion with first width, a bottom portion with a second width, and sidewalls joining said top and bottom portions respectively. The tapered plug has a cross sectional profile that is substantially parallel to the top and bottom portions and a cross sectional width that varies according to a location where the cross sectional profile intersects the second axis. At least one of the tapered plugs is inserted into at least one consumable component of the substrate processing system such that the top portion of the tapered plug is exposed to a processing environment of a plasma processing system.

Abstract: An apparatus related to plasma chambers used for processing semiconductor substrates and specifically to improvements in pumping baffle plates used in plasma sources. An apparatus and method for making a baffle plate assembly formed from a modified baffle plate blank wherein a variety of pumping features are formed in the baffle plate blank and opened in a planar material removal operation.

Abstract: A plasma processing system includes a chamber containing a plasma processing region and a chuck constructed and arranged to support a substrate within the chamber in the processing region. The plasma processing system further includes at least one gas injection passage in communication with the chamber and configured to facilitate removal of particles from the chamber by passing purge gas therethrough. In one embodiment, the plasma processing system can include an electrode configured to attract or repel particles in the chamber by electrostatic force when the electrode is biased with DC or RF power. A method of processing a substrate in a plasma processing system includes removing particles in a chamber of the plasma processing system by supplying purge gas through at least one gas injection passage in communication with the chamber.

Abstract: A plasma apparatus which includes a vacuum chamber provided with an exhaust port and a chuck assembly disposed inside the vacuum chamber. The plasma apparatus also includes a plasma confinement and pressure control apparatus disposed proximate to the substrate. The plasma confinement and pressure control apparatus includes a plurality of ring members disposed adjacent to each other in a superposed fashion and a plurality of lift assemblies disposed along a circumference of the plurality of ring members. The plurality of lift assemblies are arranged to support the plurality of ring members. The plasma confinement apparatus further includes at least one lift mechanism connected to the lift assemblies. The lift mechanism is configured to translate at least one of the plurality of ring members relative to a reference plane and to tilt at least one of the plurality of the ring members relative to the reference plane.

Abstract: An apparatus for monitoring film deposition on a chamber wall in a process chamber. The apparatus includes a surface acoustic wave device provided on the chamber wall. The surface acoustic wave device is actuated to achieve a resonance frequency, and the resonance frequency produced is detected to determine whether a critical thickness of film on the wall of the chamber has been achieved, where an amount of decrease in the resonance frequency is proportional to a thickness of film on the chamber wall. The process chamber is cleaned when the resonance frequency detected falls within a first predetermined range.

Abstract: An optical window deposition shield including a backing plate having a through hole, and a honeycomb structure having a plurality of adjacent cells configured to allow optical viewing through the honeycomb structure. Each cell of the honeycomb structure has an aspect ratio of length to diameter sufficient to impede a processing plasma from traveling through the full length of the cell. A coupling device configured to couple the honeycomb core structure to the backing plate such that the honeycomb structure is aligned with at least a portion of the through hole in the backing plate. The optical window deposition shield shields the optical viewing window of a plasma processing apparatus from contact with the plasma.

Abstract: A fastening component for fastening together a first component and a second component used in a plasma processing tool. The fastening component includes a first surface configured to be exposed to plasma processing performed in the plasma processing tool, and a second surface configured to contact the first component. Also included is a stem extending from the second surface and configured to at least partially protrude through the first component and the second component. The fastening component further includes a locking pin extending from at least one side of the stem and configured to contact the second component. The first surface, the second surface, the stem, and/or the locking pin are made of or coated with a material that is highly resistant to erosion resulting from plasma processing.

Abstract: A sensing device for sensing a condition of a plasma processing system component. The sensing device includes a main body configured to contain a material, an emitter contained in the main body and configured to emit light when exposed to a plasma, and a mating feature connected to the main body and configured to be mated with a receiving feature of an object in the plasma processing system such that the emitter material is exposed to a processing environment of the plasma processing system. When the emitter material is exposed to a plasma, the light emitted from the emitter can be monitored to determine at least one of material accumulation on the system component and erosion of the system component.

Abstract: A go no-go gauge and method for verifying whether a process kit part used within a plasma chamber of a plasma processing tool has accumulated excessive wear or deposits. The gauge includes a component for verifying whether a dimension of a process kit part feature violates a prescribed size tolerance, the violation indicating that the process kit part has accumulated excessive wear or deposits.

Abstract: A plasma processing system and a method for processing a substrate with a plasma processing system. An aspect of the invention provides a plasma processing system that comprises a chamber, including a processing region and an opening, a plasma generating system, constructed and arranged to produce a plasma during a plasma process in the processing region, a chuck, constructed and arranged to support a substrate within the chamber in the processing region, a ring member arranged in the chamber and a moving assembly, constructed and arranged to move the ring member, wherein the ring member is mounted on a periphery of the chuck such that when the substrate is being processed the ring member seals the opening.

Abstract: A multi-stop mechanism for providing multiple stop positions between first and second objects that are movable into and out of contact with one another. The multi-stop mechanism of the present invention includes a housing which secures the multi stop mechanism to the first object and/or the second object, a rotatble shaft rotatably mounted to the housing, and plurality of stops located on the rotatable shaft. When the shaft is rotated within the housing, the stops are rotated to different positions relative to the housing. As such, the rotatable shaft positions one of the stops to contact the first or second object that the multi-stop mechanism is not attached to.

Abstract: An animated toy effectively mimics human dance steps such as the Hokey Pokey with upper and lower halves of the torso pivoting about a diagonal waist laterally upwardly sloping to the left so that a left arm may be put forward and back. A spin/shake drive mechanism in a left leg selectively rotates the toy about a spin disk when activated in one direction and rotating a shake cam against the upper half of the torso when activated in another direction, thereby achieving each portion of the dance.

Abstract: An electrode plate, configured to be coupled to an electrode in a plasma processing system, comprises a plurality of gas injection holes configured to receive gas injection devices. The electrode plate comprises three or more mounting holes, wherein the electrode plate is configured to be coupled with an electrode in the plasma processing system by aligning and coupling the three or more mounting holes with three or more mounting screws attached to the electrode.