Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: Examples techniques to communicate human field activities (HFA) requests to field operators are described. In an example, an HFA request corresponding to an operation to be performed by a field operator on an equipment in a facility is received. Based on the HFA request, an HFA command is generated using a pre-defined template. The HFA command specifies attributes of the equipment in a format compatible with a workflow management system that is implemented to manage standard operating procedures (SOPs) of the facility. The HFA command is transmitted to an application executing on a communication device of the field operator.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: A glass touch screen protector for a portable electronic device having a front face including a touch screen portion and an outer perimeter. The touch screen protector can include a glass sheet having front and back sides, an outer perimeter that corresponds to that of the device, and a transparent window portion; and a spacer provided along the outer perimeter of the glass sheet surrounding the transparent window portion, having a thickness sufficient to space the glass sheet near but not in contact with the touch screen portion, and an exposed adhesive for removably mounting the protector upon the outer perimeter of the front face to form an enclosed air space between the transparent window portion of the plastic film, the spacer and the touch screen portion of the device. The glass sheet can be convex in shape with respect to the touch screen portion of the portable electronic device.

Abstract: A transportable jack system includes a jack disposed on a base. The base includes a base plate with a plurality of wheel openings formed therein, and a biasing member disposed between a wheel and the base plate. The biasing member is configured from a single piece of material consisting of a top horizontal portion, a bottom horizontal portion, and an angled middle portion disposed between the top horizontal portion and the bottom horizontal portion. The biasing member biases the base away from a ground surface when a load applied to the jack is below a predetermined threshold and deforms when the load is above the predetermined threshold, wherein the deformation allows the base plate to contact the ground surface.

Abstract: A transportable jack system includes a jack disposed on a base. The base includes a base plate with a plurality of wheel openings formed therein, and a biasing member disposed between a wheel and the base plate. The biasing member is configured from a single piece of material consisting of a top horizontal portion, a bottom horizontal portion, and an angled middle portion disposed between the top horizontal portion and the bottom horizontal portion. The biasing member biases the base away from a ground surface when a load applied to the jack is below a predetermined threshold and deforms when the load is above the predetermined threshold, wherein the deformation allows the base plate to contact the ground surface.

Abstract: The invention relates to a touch screen protector for a hand held electronic device having a front face that includes a touch screen portion and a non-functional band. The touch screen protector of the invention comprises a plastic film having front and back sides, an outer perimeter that corresponds to that of the device, and a transparent window; a spacer provided along the outer perimeter of the plastic film surrounding the transparent window, having a thickness sufficient to space the plastic film near but not in contact with the touch screen portion; an exposed adhesive for removably mounting the protector upon the outer perimeter of the front face to form an enclosed air space between the transparent window of the plastic film, the spacer and the touch screen portion of the device; and a joining adhesive for adhering the spacer to the back side of the plastic film.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: Embodiments of vehicle lifts and swivel mounts are disclosed. A lifting system for a vehicle comprises a vehicle lift and a mount configured to attach to the vehicle lift. The mount has a saddle comprising a horizontal plate and first and second side plates extending from opposing sides of the horizontal plate; a pair of raceways disposed atop the horizontal plate defining a channel; a plurality of ball bearings disposed within the channel; a tray rotatably secured to the horizontal plate, the tray being freely rotatable atop the ball bearings; and at least one tie down secured to the saddle. A vehicle is positioned atop the mount and is rotatable via the tray. Rotation of the vehicle is temporarily impeded by strapping the vehicle to the tie down.

Abstract: Disclosed herein are novel charge mode readout circuits and associated methods of signal processing. The devices and methods of the invention allow for the improved processing of stored signals by a charge mode readout amplifier, wherein the readout level may be shifted to a desired range and wherein a fully differential output swing may be imparted. The invention advantageously employs a single pair of capacitors to serve the dual roles of modulating amplifier gain and level shifting the output.

Abstract: Ping-pong readout architecture allows for faster frame rates in CMOS image sensors. However, various problems are created by this architecture due to cross-talk between components. Provided herein are novel ping-pong readout layouts which better isolate components to reduce crosstalk issues. Also provided herein are novel timing schemes for operating ping-pong readout circuits which prevent crosstalk signal spikes or readout corruption.

Abstract: A stitched image sensor array on a semiconductor substrate with identical blocks that have wherein said first configuration includes enable inputs, which vary a function of the block depending on the connection to the enable inputs. The enable inputs can set an SRAM to receive different numbers of inputs.

Abstract: The invention relates to a touch screen protector for a hand held electronic device having a front face that includes a touch screen portion and a non-functional band. The touch screen protector of the invention comprises a plastic film having front and back sides, an outer perimeter that corresponds to that of the device, and a transparent window; a spacer provided along the outer perimeter of the plastic film surrounding the transparent window, having a thickness sufficient to space the plastic film near but not in contact with the touch screen portion; an exposed adhesive for removably mounting the protector upon the outer perimeter of the front face to form an enclosed air space between the transparent window of the plastic film, the spacer and the touch screen portion of the device; and a joining adhesive for adhering the spacer to the back side of the plastic film.

Abstract: The invention relates to a method for protecting a touch screen of a hand held electronic device having a front face that includes a touch screen portion and a non-functional band. The method of the invention comprises providing a touch screen protector comprising a film having front and back sides, an outer perimeter that corresponds to that of the device, and a transparent window; and an exposed adhesive along the outer perimeter of the film surrounding the transparent window; and removably attaching the protector upon the outer perimeter of the front face of the device via the exposed adhesive to form an enclosed air space between the transparent window of the film, the adhesive and the touch screen portion of the device.