Abstract: A titanium alloy composition is provided. In weight percent (wt. %), the alloy includes 5.7 to 8.0% vanadium, 0.5 to 1.75% aluminum, 0.25 to 1.5% iron, 0.1 to 0.2% oxygen, up to 0.15% silicon, up to 0.1% carbon and less than 0.03% nitrogen is provided. In one form, the titanium alloy has a 0.2% yield strength between 600 to 850 MPa, an ultimate tensile strength between 700 to 950 MPa, a percent elongation to failure between 20 to 30%, a percent reduction in area between 40 to 80%, a Charpy U-notch impact energy between 30 to 70 J, and/or a Charpy V-notch impact energy between 40 to 150 J.

Abstract: Titanium alloys formed into a part or component used in applications where a key design criterion is the energy absorbed during deformation of the part when exposed to impact, explosive blast, and/or other forms of shock loading is described. The titanium alloys generally comprise a titanium base with added amounts of aluminum, an isomorphous beta stabilizing element such as vanadium, a eutectoid beta stabilizing element such as silicon and iron, and incidental impurities. The titanium alloys exhibit up to 70% or more improvement in ductility and up to a 16% improvement in ballistic impact resistance over a Ti-6Al-4V alloy, as well as absorbing up to 50% more energy than the Ti-6Al-4V alloy in Charpy impact tests. A method of forming a part that incorporates the titanium alloys and uses a combination of recycled materials and new materials is also described.

Abstract: A titanium alloy composition is provided. In weight percent (wt. %), the alloy includes 5.7 to 8.0% vanadium, 0.5 to 1.75% aluminum, 0.25 to 1.5% iron, 0.1 to 0.2% oxygen, up to 0.15% silicon, up to 0.1% carbon and less than 0.03% nitrogen is provided. In one form, the titanium alloy has a 0.2% yield strength between 600 to 850 MPa, an ultimate tensile strength between 700 to 950 MPa, a percent elongation to failure between 20 to 30%, a percent reduction in area between 40 to 80%, a Charpy U-notch impact energy between 30 to 70 J, and/or a Charpy V-notch impact energy between 40 to 150 J.

Abstract: Titanium alloys formed into a part or component used in applications where a key design criterion is the energy absorbed during deformation of the part when exposed to impact, explosive blast, and/or other forms of shock loading is described. The titanium alloys generally comprise a titanium base with added amounts of aluminum, an isomorphous beta stabilizing element such as vanadium, a eutectoid beta stabilizing element such as silicon and iron, and incidental impurities. The titanium alloys exhibit up to 70% or more improvement in ductility and up to a 16% improvement in ballistic impact resistance over a Ti-6Al-4V alloy, as well as absorbing up to 50% more energy than the Ti-6Al-4V alloy in Charpy impact tests. A method of forming a part that incorporates the titanium alloys and uses a combination of recycled materials and new materials is also described.

Abstract: Titanium alloys formed into a part or component used in applications where a key design criterion is the energy absorbed during deformation of the part when exposed to impact, explosive blast, and/or other forms of shock loading is described. The titanium alloys generally comprise a titanium base with added amounts of aluminum, an isomorphous beta stabilizing element such as vanadium, a eutectoid beta stabilizing element such as silicon and iron, and incidental impurities. The titanium alloys exhibit up to 70% or more improvement in ductility and up to a 16% improvement in ballistic impact resistance over a Ti-6Al-4V alloy, as well as absorbing up to 50% more energy than the Ti-6Al-4V alloy in Charpy impact tests. A method of forming a part that incorporates the titanium alloys and uses a combination of recycled materials and new materials is also described.

Abstract: Titanium alloys formed into a part or component used in applications where a key design criterion is the energy absorbed during deformation of the part when exposed to impact, explosive blast, and/or other forms of shock loading is described. The titanium alloys generally comprise a titanium base with added amounts of aluminum, an isomorphous beta stabilizing element such as vanadium, a eutectoid beta stabilizing element such as silicon and iron, and incidental impurities. The titanium alloys exhibit up to 70% or more improvement in ductility and up to a 16% improvement in ballistic impact resistance over a Ti-6Al-4V alloy, as well as absorbing up to 50% more energy than the Ti-6Al-4V alloy in Charpy impact tests. A method of forming a part that incorporates the titanium alloys and uses a combination of recycled materials and new materials is also described.

Abstract: A muffler mechanism that reduces the volume of an acoustic piano without altering the feel of the piano to a human pianist. One embodiment includes a highly configurable piano muffler kit that may be mounted into pianos of various models. The muffler mechanism includes a cushioning member, which muffles the sound of the hammer striking the string and reduces the volume of the sound made by the string's vibration. The muffler mechanism also includes shims that may be used to position the cushioning member between a hammer let-off position and the string. This may allow for muffled piano playing without a noticeable change in the resistance of the keys. The muffler mechanism is mounted using brackets with a relatively small footprint. This allows the piano muffler to be installed without removing all of the dampers.

Abstract: According to a preferred embodiment of the present invention, a clutch is applied when the vehicle comes to a stop. The application of this clutch locks the output shaft with energy stored therein. When the shift selector is then moved to the park position, the clutch releases the stored energy in a controlled manner by slipping the clutch plates. The controlled slipping reduces the noise as the park pawl tooth contracts an output gear tooth.

Abstract: A system for fabricating semiconductor components includes mating mold cavity plates having mold cavities configured to mold body segments of the semiconductor components on either side of a leadframe. The mold cavity plates also include runners configured to direct molding compound between the mold cavities and into the corners of the mold cavities. The runners prevent trapped air from accumulating in the corners of the mold cavities, and eliminate the need for air vents in the corners. The mold cavity plates also include dummy mold cavities configured to form dummy segments on the leadframe, and air vents in flow communication with the dummy segments. The dummy mold cavities are configured to collect trapped air, and to direct the trapped air through the air vents to atmosphere. Each dummy mold cavity has only a single associated air vent, such that cleaning is facilitated, and flash particles from the air vents are reduced.

Abstract: A system for fabricating semiconductor components includes mating mold cavity plates having mold cavities configured to mold body segments of the semiconductor components on either side of a leadframe. The mold cavity plates also include runners configured to direct molding compound between the mold cavities and into the corners of the mold cavities. The runners prevent trapped air from accumulating in the corners of the mold cavities, and eliminate the need for air vents in the corners. The mold cavity plates also include dummy mold cavities configured to form dummy segments on the leadframe, and air vents in flow communication with the dummy segments. The dummy mold cavities are configured to collect trapped air, and to direct the trapped air through the air vents to atmosphere. Each dummy mold cavity has only a single associated air vent, such that cleaning is facilitated, and flash particles from the air vents are reduced.

Abstract: Sealed packages of foodstuffs which are biological materials, particularly fruit, are vented by a temperature-sensitive control unit. The control unit covers an aperture in a wall of the package. The control unit includes a barrier member which is secured over the aperture by a layer of temperature sensitive adhesive, and a force member which lifts the barrier member away from the aperture when an increase in temperature weakens the adhesive. The force member is preferably elastically deformed.

Abstract: A desoldering tool has a removable heater cartridge and a base unit having an assembly interior including a solder collection chamber and a removable vacuum source for developing a vacuum in and above the chamber and a removable porous solder retention pad located between the vacuum source and the solder collection chamber, the cartridge having a temperature self-regulating heater therein, a tail pipe extending from a hollow tip of the cartridge to a position above the solder collection chamber, and a vacuum seal between the cartridge and the base unit to maintain the vacuum and reduce transfer of heat from the tip. The tool is readily converted to a soldering iron or a hot air gun.

Abstract: A desoldering tool has a removable cartridge and a base unit having an assembly interior including a solder collection chamber and a removable vacuum source for developing a vacuum in the bottom of the chamber under a removable porous solder retention pad, the cartridge having a temperature self-regulating heater therein and a tail pipe extending from a tip of the cartridge to a position above the solder collection chamber, and a vacuum seal between the cartridge and the base unit to maintain the vacuum and reduce transfer of heat from the tip.