Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

Abstract: Implementations described and claimed herein provide systems and methods for configuring one or more components of a converged infrastructure for a customer. In one implementation, a survey including configuration parameters for the one or more components of the converged infrastructure is received. The configuration parameters are collected in the survey using a survey tool accessible with a user device over a network. The configuration parameters are based on input from the customer including customer specifications for the converged infrastructure. The configuration parameters are validated, and at least one script for the one or more components is generated. The script includes instructions for configuring the one or more components based on the validated configuration parameters.

Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

Abstract: In exemplary implementations of this invention, a nozzle sprays foam, layer by layer, to fabricate a fabricated object according to a CAD model, and a subtractive fabrication tool removes material from the fabricated object according to a CAD model. The fabricated object comprises a mold or an interior form. The foam may be low-density, high strength and fast-curing. The foam may be used for large-scale 3D printing. For example, the foam may be used to 3D print molds for walls of homes. The foam molds may be left in place, after casting concrete in the molds, to serve as insulation. Or for example, the foam may be used to 3D print on site an internal form for a large wind turbine blade. The wind turbine blade may then be produced on site by depositing fiberglass on the outside of the internal form.

Abstract: A systems and methods for determining a position of a medical tube within a patient is provided. In one example, systems and methods are provided for a self- detection positioning system that is capable of determining a location of a distal end of a medical tube placed within a patient, and notifying a physician of the location of the distal end of the medical tube.

Abstract: A reconfigurable device comprises flexible bladder that encloses a jammable material. The geometry of the device can be altered by unjamming the jammable material (making it flexible), changing the shape of the device while it is flexible, and then jamming the jammable material (making it rigid). In some applications of this invention, a joint connects rigid arms. The ends of the rigid arms are enclosed in the bladder. By varying the stiffness of the jammable material in the bladder, the stiffness of the joint can be controlled.

Abstract: In exemplary implementations of this invention, a nozzle sprays foam, layer by layer, to fabricate a fabricated object according to a CAD model, and a subtractive fabrication tool removes material from the fabricated object according to a CAD model. The fabricated object comprises a mold or an interior form. The foam may be low-density, high strength and fast-curing. The foam may be used for large-scale 3D printing. For example, the foam may be used to 3D print molds for walls of homes. The foam molds may be left in place, after casting concrete in the molds, to serve as insulation. Or for example, the foam may be used to 3D print on site an internal form for a large wind turbine blade. The wind turbine blade may then be produced on site by depositing fiberglass on the outside of the internal form.

Abstract: In exemplary implementations of this invention, a nozzle sprays foam, layer by layer, to fabricate a fabricated object according to a CAD model, and a subtractive fabrication tool removes material from the fabricated object according to a CAD model. The fabricated object comprises a mold or an interior form. The foam may be low-density, high strength and fast-curing. The foam may be used for large-scale 3D printing. For example, the foam may be used to 3D print molds for walls of homes. The foam molds may be left in place, after casting concrete in the molds, to serve as insulation. Or for example, the foam may be used to 3D print on site an internal form for a large wind turbine blade. The wind turbine blade may then be produced on site by depositing fiberglass on the outside of the internal form.

Abstract: In exemplary implementations of this invention, a nozzle sprays foam, layer by layer, to fabricate a fabricated object according to a CAD model, and a subtractive fabrication tool removes material from the fabricated object according to a CAD model. The fabricated object comprises a mold or an interior form. The foam may be low-density, high strength and fast-curing. The foam may be used for large-scale 3D printing. For example, the foam may be used to 3D print molds for walls of homes. The foam molds may be left in place, after casting concrete in the molds, to serve as insulation. Or for example, the foam may be used to 3D print on site an internal form for a large wind turbine blade. The wind turbine blade may then be produced on site by depositing fiberglass on the outside of the internal form.

Abstract: A method of patterning a metal (141, 341, 841) on a vertical sidewall (132, 332, 832) of an excavated feature (130, 330, 830) includes placing a material (350) in the excavated feature such that a portion (435) of the metal is exposed in the excavated feature above the material, etching the exposed portion of the metal away from the vertical sidewall using a first wet etch chemistry, and removing the material from the excavated feature by etching it away using a second wet etch chemistry. The described method may be used to produce a MIM capacitor (800) suitable for an eDRAM device.

Abstract: In exemplary implementations of this invention, a nozzle sprays foam, layer by layer, to fabricate a fabricated object according to a CAD model, and a subtractive fabrication tool removes material from the fabricated object according to a CAD model. The fabricated object comprises a mold or an interior form. The foam may be low-density, high strength and fast-curing. The foam may be used for large-scale 3D printing. For example, the foam may be used to 3D print molds for walls of homes. The foam molds may be left in place, after casting concrete in the molds, to serve as insulation. Or for example, the foam may be used to 3D print on site an internal form for a large wind turbine blade. The wind turbine blade may then be produced on site by depositing fiberglass on the outside of the internal form.

Abstract: A method of patterning a metal (141, 341, 841) on a vertical sidewall (132, 332, 832) of an excavated feature (130, 330, 830) includes placing a material (350) in the excavated feature such that a portion (435) of the metal is exposed in the excavated feature above the material, etching the exposed portion of the metal away from the vertical sidewall using a first wet etch chemistry, and removing the material from the excavated feature by etching it away using a second wet etch chemistry. The described method may be used to produce a MIM capacitor (800) suitable for an eDRAM device.