Patents by Inventor Steven L. Peace
Steven L. Peace has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20040112738Abstract: A system for processing semiconductor wafers has process units on a deck of a frame. The process units and the deck have precision locating features, such as tapered pins, for precisely positioning the process units on the deck. Process units can be removed and replacement process units installed on the deck, without the need for recalibrating the load/unload robot. This reduces the time needed to replace process units and restart processing operations. Liquid chemical consumption during processing is reduced by drawing unused liquid out of supply lines and pumping it back to storage.Type: ApplicationFiled: October 22, 2003Publication date: June 17, 2004Inventors: Raymon F. Thompson, Jeffry A. Davis, Randy Harris, Dana R. Scranton, Ryan Pfeifle, Steven L. Peace, Brian Aegerter
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Publication number: 20040079403Abstract: A system and method for processing a workpiece, includes workpiece processors. A robot is moveable within an enclosure to load and unload workpieces into and out of the processors. A processor includes an upper rotor having a central air flow opening. The upper rotor is magnetically driven into engagement with a lower rotor to form a workpiece processing chamber. A moveable drain mechanism aligns different drain paths with the processing chamber so that different processing fluids may be removed from the processing chamber via different drain paths. A moveable nozzle positioned in the air flow opening distributes processing fluid to the workpiece. The processing fluid is distributed across the workpiece surface, via centrifugal force generated by spinning the processing chamber, and removed from the processing chamber via the moveable drain mechanism.Type: ApplicationFiled: October 21, 2003Publication date: April 29, 2004Inventors: Kyle M. Hanson, Eric Lund, Coby Grove, Steven L. Peace, Paul Z. Wirth, Scott Bruner, Jonathan Kuntz
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Patent number: 6692613Abstract: A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location.Type: GrantFiled: August 20, 2002Date of Patent: February 17, 2004Assignee: Semitool, Inc.Inventors: Steven L. Peace, Gary L. Curtis, Raymon F. Thompson, Brian Aegerter, Curt T. Dundas
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Patent number: 6680253Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into contact with the liquid. The head spins the workpiece during or after contact with the liquid. The upper and lower rotors have side openings for loading and unloading a workpiece into the head. The rotors are axially moveable to align the side openings.Type: GrantFiled: July 16, 2001Date of Patent: January 20, 2004Assignee: Semitool, Inc.Inventors: Paul Z. Wirth, Steven L. Peace
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Publication number: 20030217929Abstract: A method and apparatus for regulating fluid flows, such as flows of electrochemical processing fluids for processing microelectronic workpieces. The apparatus includes a valve body having an entrance port, an exit port, and a flow passage between the entrance and exit ports through which a first fluid flows. The valve body further includes a pressure chamber coupleable to a second fluid source and at least partially isolated from the flow passage. A regulator, movably disposed in the flow passage to change a flow area of the flow passage, has a first surface with a first projected area and a second surface with a second, larger, projected area, both of which are operatively coupled to the first fluid. A third surface of the regulator is operatively coupled to the second fluid. The regulator can adjust its position to maintain a constant or nearly constant first fluid flow rate as the fluid pressure at the entrance port changes.Type: ApplicationFiled: May 8, 2002Publication date: November 27, 2003Inventor: Steven L. Peace
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Publication number: 20030178297Abstract: A reactor assembly for electrochemically processing a microelectronic workpiece is set forth. The reactor assembly includes a processing bowl having one or more fluid inlets through which a flow of processing fluid is received. An electrode assembly is located within the process bowl in a fluid flow path of the fluid provided through the one or more fluid inlets. The electrode assembly includes a mesh electrode and a diffuser disposed in the fluid flow path prior to the mesh electrode to tailor the flow of processing fluid received from the one or more fluid inlets through the mesh electrode in a predetermined manner.Type: ApplicationFiled: March 4, 2003Publication date: September 25, 2003Inventor: Steven L. Peace
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Publication number: 20030176067Abstract: A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vertically above the bowl, to a second position where the workpiece is at least partially positioned in the bowl. The bowl has a contour section with a sidewall having a radius of curvature which increases adjacent to a drain outlet in the bowl, to help rapid draining of liquid from the bowl. The head has a load position, where the rotors are spaced apart by a first amount, and a process position, where the rotors are engaged and sealed against each other. For rapid evacuation of fluid, the head also has a fast drain position, where the rotors are moved apart sufficiently to create an annular drain gap.Type: ApplicationFiled: April 14, 2003Publication date: September 18, 2003Applicant: Semitool, Inc.Inventors: Paul Z. Wirth, Steven L. Peace, Erik Lund
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Patent number: 6548411Abstract: A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vertically above the bowl, to a second position where the workpiece is at least partially positioned in the bowl. The bowl has a contour section with a sidewall having a radius of curvature which increases adjacent to a drain outlet in the bowl, to help rapid draining of liquid from the bowl. The head has a load position, where the rotors are spaced apart by a first amount, and a process position, where the rotors are engaged and sealed against each other. For rapid evacuation of fluid, the head also has a fast drain position, where the rotors are moved apart sufficiently to create an annular drain gap.Type: GrantFiled: July 16, 2001Date of Patent: April 15, 2003Assignee: Semitool, Inc.Inventors: Paul Z. Wirth, Steven L. Peace, Erik Lund
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Patent number: 6544391Abstract: A reactor assembly for electrochemically processing a microelectronic workpiece is set forth. The reactor assembly includes a processing bowl having one or more fluid inlets through which a flow of processing fluid is received. An electrode assembly is located within the process bowl in a fluid flow path of the fluid provided through the one or more fluid inlets. The electrode assembly includes a mesh electrode and a diffuser disposed in the fluid flow path prior to the mesh electrode to tailor the flow of processing fluid received from the one or more fluid inlets through the mesh electrode in a predetermined manner.Type: GrantFiled: October 17, 2000Date of Patent: April 8, 2003Assignee: Semitool, Inc.Inventor: Steven L. Peace
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Publication number: 20030020928Abstract: A method and apparatus for processing a microelectronic workpiece using metrology. The apparatus can include one or more processing or transport units, a metrology unit, and a control unit coupled to the metrology unit and at least one of the processing or transport units. The control unit can modify a process recipe or a process sequence of the processing unit based on a feed forward or a feed back signal from the metrology unit. The control unit can also provide instructions to the transport unit to move the workpiece to a selected processing unit. The processing unit can include, inter alia, a seed layer deposition unit, a process layer electrochemical deposition unit, a seed layer enhancement unit, a chemical mechanical polishing unit, and/or an annealing chamber arranged for sequential processing of a workpiece. The processing units can be controlled as an integrated system using one or more metrology units, or a separate metrology unit can provide input to the processing units.Type: ApplicationFiled: July 9, 2001Publication date: January 30, 2003Inventors: Thomas L. Ritzdorf, Steve L. Eudy, Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver, Brian Aegerter, Curt Dundas, Steven L. Peace
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Patent number: 6511914Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A sonic energy source, such as a megasonic transducer, provides sonic energy into a liquid in the bowl. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into the liquid. Sonic energy is provided to the workpiece through the liquid, optionally while the head spins the workpiece. The liquid may include de-ionized water and an etchant.Type: GrantFiled: July 16, 2001Date of Patent: January 28, 2003Assignee: Semitool, Inc.Inventors: Paul Z. Wirth, Steven L. Peace
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Publication number: 20020189652Abstract: A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location.Type: ApplicationFiled: August 20, 2002Publication date: December 19, 2002Applicant: Semitool, Inc.Inventors: Steven L. Peace, Gary L. Curtis, Raymon F. Thompson, Brian Aegerter, Curt T. Dundas
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Patent number: 6494984Abstract: A machine for processing the front side of a flat media workpiece, such as a silicon wafer, seals the backside of the wafer from processing chemicals. A rotor has an inside ring and an outside ring protruding from the rotor face. The inside ring and outside ring are separated by an annular groove in the rotor. A O-ring is positioned between the inside ring and the outside ring. A membrane extends from the inside ring, over the annular groove and the O-ring, to the outside ring. The membrane and face of the rotor form a sealable wafer back face chamber between them. Vacuum is applied to the back face chamber to hold the wafer against the membrane. The back surface of the wafer is sealed from processing chemicals, which are allowed to contact only the front surface and edges of the wafer.Type: GrantFiled: January 14, 1999Date of Patent: December 17, 2002Assignee: Semitool, Inc.Inventor: Steven L. Peace
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Publication number: 20020185163Abstract: An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.Type: ApplicationFiled: July 23, 2002Publication date: December 12, 2002Applicant: Semitool, Inc.Inventors: Steven L. Peace, Gary L. Curtis, Raymon F. Thompson, Brian Aegerter, Curt T. Dundas
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Patent number: 6492284Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into contact with the liquid. Sonic energy is introduced into the liquid and acts on the workpiece to improve processing. The head spins the workpiece during or after contact with the liquid. The upper and lower rotors have side openings for loading and unloading a workpiece into the head. The rotors are axially moveable to align the side openings.Type: GrantFiled: July 16, 2001Date of Patent: December 10, 2002Assignee: Semitool, Inc.Inventors: Steven L. Peace, Paul Z. Wirth, Eric Lund
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Publication number: 20020168863Abstract: In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.Type: ApplicationFiled: June 26, 2002Publication date: November 14, 2002Applicant: Semitool, Inc.Inventors: Brian Aegerter, Curt T. Dundas, Michael Jolley, Tom L. Ritzdorf, Steven L. Peace, Gary L. Curtis, Raymon F. Thompson
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Publication number: 20020144973Abstract: In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.Type: ApplicationFiled: May 17, 2002Publication date: October 10, 2002Applicant: Semitool, Inc.Inventors: Brian Aegerter, Curt T. Dundas, Michael Jolley, Tom L. Ritzdorf, Steven L. Peace, Gary L. Curtis, Raymon F. Thompson
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Patent number: 6447633Abstract: A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location.Type: GrantFiled: November 9, 2000Date of Patent: September 10, 2002Assignee: Semitdol, Inc.Inventors: Steven L. Peace, Gary L. Curtis, Raymon F. Thompson, Brian Aegerter, Curt T. Dundas
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Patent number: 6423642Abstract: A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location.Type: GrantFiled: November 10, 1999Date of Patent: July 23, 2002Assignee: Semitool, Inc.Inventors: Steven L. Peace, Gary L. Curtis, Raymon F. Thompson, Brian Aegerter, Curt T. Dundas
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Publication number: 20020083960Abstract: A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vertically above the bowl, to a second position where the workpiece is at least partially positioned in the bowl. The bowl has a contour section with a sidewall having a radius of curvature which increases adjacent to a drain outlet in the bowl, to help rapid draining of liquid from the bowl. The head has a load position, where the rotors are spaced apart by a first amount, and a process position, where the rotors are engaged and sealed against each other. For rapid evacuation of fluid, the head also has a fast drain position, where the rotors are moved apart sufficiently to create an annular drain gap.Type: ApplicationFiled: July 16, 2001Publication date: July 4, 2002Applicant: Semitool, Inc.Inventors: Paul Z. Wirth, Steven L. Peace, Erik Lund