Patents by Inventor Steven Molesa
Steven Molesa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11372143Abstract: Fingerprint sensors include a plurality of optical sensor elements, a collimator filter disposed above the plurality of optical sensor elements, and a display disposed above the collimator filter, wherein the display is a fingerprint imaging light source. The collimator filter has a plurality of apertures, and the plurality of optical sensor elements is configured to receive light transmitted through one aperture of the plurality of apertures.Type: GrantFiled: May 19, 2020Date of Patent: June 28, 2022Assignee: WILL SEMICONDUCTOR (SHANGHAI) CO. LTD.Inventors: Patrick Smith, Paul Wickboldt, Patrick A. Worfolk, Steven Molesa, Young Lee, Richard Klenkler
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Publication number: 20200278482Abstract: Fingerprint sensors include a plurality of optical sensor elements, a collimator filter disposed above the plurality of optical sensor elements, and a display disposed above the collimator filter, wherein the display is a fingerprint imaging light source. The collimator filter has a plurality of apertures, and the plurality of optical sensor elements is configured to receive light transmitted through one aperture of the plurality of apertures.Type: ApplicationFiled: May 19, 2020Publication date: September 3, 2020Applicant: WILL SEMICONDUCTOR (SHANGHAI) CO. LTD.Inventors: Patrick Smith, Paul Wickboldt, Patrick A. Worfolk, Steven Molesa, Young Lee, Richard Klenkler
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Patent number: 10705272Abstract: Systems and methods for optical imaging are disclosed. The optical fingerprint sensor includes an image sensor array; a collimator filter layer disposed above the image sensor array, the collimator filter layer having an array of apertures; and an illumination layer disposed above the collimator filter layer. The collimator filter layer filters reflected light such that only certain of the reflected light beams reach optical sensing elements in the image sensor array. Employing the collimator filter layer prevents blurring while allowing for a lower-profile image sensor.Type: GrantFiled: November 27, 2017Date of Patent: July 7, 2020Assignee: WILL SEMICONDUCTOR (SHANGHAI) CO., LTD.Inventors: Patrick Smith, Paul Wickboldt, Patrick A. Worfolk, Steven Molesa, Young Lee, Richard Klenkler
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Patent number: 10049254Abstract: A biometric imager may comprise a plurality of sensor element traces formed in or on a sensor substrate which may comprise at least a portion of a display screen defining a biometric sensing area and forming in-active pixel locations; an auxiliary active circuit formed in or on the sensor substrate on the periphery of the biometric sensing area and in direct or indirect electrical contact with the sensor element traces; and providing a signal processing interface to a remotely located controller integrated circuit. The sensor element traces may form a portion of one dimensional linear sensor array or pixel locations in a two dimensional grid array capacitive gap biometric imaging sensor. The auxiliary circuit may provide pixel location selection or pixel signal amplification. The auxiliary circuit may be mounted on a surface of the display screen. The auxiliary circuit further comprising a separate pixel location selection controller circuit.Type: GrantFiled: December 19, 2016Date of Patent: August 14, 2018Assignee: Synaptics IncorporatedInventors: Paul Wickboldt, Gregory Lewis Dean, Erik Jonathon Thompson, Jaswinder Jandu, Patrick Smith, Steven Molesa
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Publication number: 20180081098Abstract: Systems and methods for optical imaging are disclosed. The optical fingerprint sensor includes an image sensor array; a collimator filter layer disposed above the image sensor array, the collimator filter layer having an array of apertures; and an illumination layer disposed above the collimator filter layer. The collimator filter layer filters reflected light such that only certain of the reflected light beams reach optical sensing elements in the image sensor array. Employing the collimator filter layer prevents blurring while allowing for a lower-profile image sensor.Type: ApplicationFiled: November 27, 2017Publication date: March 22, 2018Inventors: Patrick Smith, Paul Wickboldt, Patrick A. Worfolk, Steven Molesa, Young Lee, Richard Klenkler
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Publication number: 20170098115Abstract: A biometric imager may comprise a plurality of sensor element traces formed in or on a sensor substrate which may comprise at least a portion of a display screen defining a biometric sensing area and forming in-active pixel locations; an auxiliary active circuit formed in or on the sensor substrate on the periphery of the biometric sensing area and in direct or indirect electrical contact with the sensor element traces; and providing a signal processing interface to a remotely located controller integrated circuit. The sensor element traces may form a portion of one dimensional linear sensor array or pixel locations in a two dimensional grid array capacitive gap biometric imaging sensor. The auxiliary circuit may provide pixel location selection or pixel signal amplification. The auxiliary circuit may be mounted on a surface of the display screen. The auxiliary circuit further comprising a separate pixel location selection controller circuit.Type: ApplicationFiled: December 19, 2016Publication date: April 6, 2017Inventors: Paul WICKBOLDT, Gregory Lewis DEAN, Erik Jonathon THOMPSON, Jaswinder JANDU, Patrick SMITH, Steven MOLESA
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Publication number: 20160034740Abstract: A biometric imager may comprise a plurality of sensor element traces formed in or on a sensor substrate which may comprise at least a portion of a display screen defining a biometric sensing area and forming in-active pixel locations; an auxiliary active circuit formed in or on the sensor substrate on the periphery of the biometric sensing area and in direct or indirect electrical contact with the sensor element traces; and providing a signal processing interface to a remotely located controller integrated circuit. The sensor element traces may form a portion of one dimensional linear sensor array or pixel locations in a two dimensional grid array capacitive gap biometric imaging sensor. The auxiliary circuit may provide pixel location selection or pixel signal amplification. The auxiliary circuit may be mounted on a surface of the display screen. The auxiliary circuit further comprising a separate pixel location selection controller circuit.Type: ApplicationFiled: October 12, 2015Publication date: February 4, 2016Inventors: Paul WICKBOLDT, Gregory Lewis DEAN, Erik Jonathon THOMPSON, Steven MOLESA, Jaswinder JANDU, Patrick SMITH
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Patent number: 9158958Abstract: A biometric imager may comprise a plurality of sensor element traces formed in or on a sensor substrate which may comprise at least a portion of a display screen defining a biometric sensing area and forming in-active pixel locations; an auxiliary active circuit formed in or on the sensor substrate on the periphery of the biometric sensing area and in direct or indirect electrical contact with the sensor element traces; and providing a signal processing interface to a remotely located controller integrated circuit. The sensor element traces may form a portion of one dimensional linear sensor array or pixel locations in a two dimensional grid array capacitive gap biometric imaging sensor. The auxiliary circuit may provide pixel location selection or pixel signal amplification. The auxiliary circuit may be mounted on a surface of the display screen. The auxiliary circuit further comprising a separate pixel location selection controller circuit.Type: GrantFiled: July 24, 2014Date of Patent: October 13, 2015Assignee: Synaptics IncorporatedInventors: Paul Wickboldt, Gregory Lewis Dean, Erik Jonathon Thompson, Steven Molesa, Jaswinder Jandu, Patrick Smith
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Patent number: 9142696Abstract: A laser contact process is employed to form contact holes to emitters of a solar cell. Doped silicon nanoparticles are formed over a substrate of the solar cell. The surface of individual or clusters of silicon nanoparticles is coated with a nanoparticle passivation film. Contact holes to emitters of the solar cell are formed by impinging a laser beam on the passivated silicon nanoparticles. For example, the laser contact process may be a laser ablation process. In that case, the emitters may be formed by diffusing dopants from the silicon nanoparticles prior to forming the contact holes to the emitters. As another example, the laser contact process may be a laser melting process whereby portions of the silicon nanoparticles are melted to form the emitters and contact holes to the emitters.Type: GrantFiled: August 15, 2014Date of Patent: September 22, 2015Assignee: SunPower CorporationInventors: Paul Loscutoff, Steven Molesa, Taeseok Kim
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Patent number: 9045653Abstract: Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.Type: GrantFiled: August 23, 2013Date of Patent: June 2, 2015Assignee: Thin Film Electronics ASAInventors: Erik Scher, Steven Molesa, Joerg Rockenberger, Arvind Kamath, Ikuo Mori, Wenzhuo Guo, Dmitry Karshtedt, Vladimir K. Dioumaev
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Publication number: 20150091588Abstract: A biometric sensor and button assembly and method of making same are disclosed which may comprise: a button housing comprising at least two side walls each forming a vertical load absorbing tower and defining an opening within the button housing; an insert within the opening within the housing; a sensor controller integrated circuit positioned within a cavity formed in one of the insert, the housing or a combination of the insert and the housing; and the insert and the housing cooperating to absorb vertical loading on the button housing, thereby protecting the integrated circuit from excess vertical loading. The assembly and method may also comprise the biometric comprising a fingerprint sensed by the biometric sensor. The assembly and method may also comprise the at least two side walls comprising at least four side walls, the cavity being formed within the bottom of the insert, within the housing, or both.Type: ApplicationFiled: September 29, 2014Publication date: April 2, 2015Inventors: Paul WICKBOLDT, Eric JONES, Young Seen LEE, Steven MOLESA, Jeff KELSOE
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Publication number: 20150030217Abstract: A biometric imager may comprise a plurality of sensor element traces formed in or on a sensor substrate which may comprise at least a portion of a display screen defining a biometric sensing area and forming in-active pixel locations; an auxiliary active circuit formed in or on the sensor substrate on the periphery of the biometric sensing area and in direct or indirect electrical contact with the sensor element traces; and providing a signal processing interface to a remotely located controller integrated circuit. The sensor element traces may form a portion of one dimensional linear sensor array or pixel locations in a two dimensional grid array capacitive gap biometric imaging sensor. The auxiliary circuit may provide pixel location selection or pixel signal amplification. The auxiliary circuit may be mounted on a surface of the display screen. The auxiliary circuit further comprising a separate pixel location selection controller circuit.Type: ApplicationFiled: July 24, 2014Publication date: January 29, 2015Inventors: Paul WICKBOLDT, Gregory Lewis DEAN, Erik Jonathon THOMPSON, Steven MOLESA, Jaswinder JANDU, Patrick SMITH
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Patent number: 8912890Abstract: The disclosure relates to surveillance and/or identification devices having capacitors connected in parallel or in series, and methods of making and using such devices. Devices with capacitors connected in parallel, where one capacitor is fabricated with a relatively thick capacitor dielectric and another is fabricated with a relatively thin capacitor dielectric achieve both a high-precision capacitance and a low breakdown voltage for relatively easy surveillance tag deactivation. Devices with capacitors connected in series result in increased lateral dimensions of a small capacitor. This makes the capacitor easier to fabricate using techniques that may have relatively limited resolution capabilities.Type: GrantFiled: October 1, 2012Date of Patent: December 16, 2014Assignee: Thin Film Electronics ASAInventors: Patrick Smith, Criswell Choi, James Montague Cleeves, Vivek Subramanian, Arvind Kamath, Steven Molesa
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Publication number: 20140352781Abstract: A laser contact process is employed to form contact holes to emitters of a solar cell. Doped silicon nanoparticles are formed over a substrate of the solar cell. The surface of individual or clusters of silicon nanoparticles is coated with a nanoparticle passivation film. Contact holes to emitters of the solar cell are formed by impinging a laser beam on the passivated silicon nanoparticles. For example, the laser contact process may be a laser ablation process. In that case, the emitters may be formed by diffusing dopants from the silicon nanoparticles prior to forming the contact holes to the emitters. As another example, the laser contact process may be a laser melting process whereby portions of the silicon nanoparticles are melted to form the emitters and contact holes to the emitters.Type: ApplicationFiled: August 15, 2014Publication date: December 4, 2014Inventors: Paul LOSCUTOFF, Steven MOLESA, Taeseok KIM
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Patent number: 8822301Abstract: The present invention relates to electrically active devices (e.g., capacitors, transistors, diodes, floating gate memory cells, etc.) having dielectric, conductor, and/or semiconductor layers with smooth and/or dome-shaped profiles and methods of forming such devices by depositing or printing (e.g., inkjet printing) an ink composition that includes a semiconductor, metal, or dielectric precursor. The smooth and/or dome-shaped cross-sectional profile allows for smooth topological transitions without sharp steps, preventing feature discontinuities during deposition and allowing for more complete step coverage of subsequently deposited structures. The inventive profile allows for both the uniform growth of oxide layers by thermal oxidation, and substantially uniform etching rates of the structures. Such oxide layers may have a uniform thickness and provide substantially complete coverage of the underlying electrically active feature.Type: GrantFiled: March 8, 2013Date of Patent: September 2, 2014Assignee: Thin Film Electronics ASAInventors: Arvind Kamath, Erik Scher, Patrick Smith, Aditi Chandra, Steven Molesa
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Publication number: 20140091909Abstract: The present invention relates to surveillance and/or identification devices having capacitors connected in parallel or in series, and methods of making and using such devices. Devices with capacitors connected in parallel, where one capacitor is fabricated with a relatively thick capacitor dielectric and another is fabricated with a relatively thin capacitor dielectric achieve both a high-precision capacitance and a low breakdown voltage for relatively easy surveillance tag deactivation. Devices with capacitors connected in series result in increased lateral dimensions of a small capacitor. This makes the capacitor easier to fabricate using techniques that may have relatively limited resolution capabilities.Type: ApplicationFiled: October 1, 2012Publication date: April 3, 2014Inventors: Patrick SMITH, Criswell CHOI, James Montague CLEEVES, Vivek SUBRAMANIAN, Arvind KAMATH, Steven MOLESA
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Publication number: 20130344301Abstract: Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.Type: ApplicationFiled: August 23, 2013Publication date: December 26, 2013Inventors: Erik SCHER, Steven MOLESA, Joerg ROCKENBERGER, Arvind KAMATH, Ikuo MORI, Wenzhuo GUO, Dmitry KARSHTEDT, Vladimir DIOUMAEV
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Patent number: 8530589Abstract: Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.Type: GrantFiled: May 2, 2008Date of Patent: September 10, 2013Assignee: Kovio, Inc.Inventors: Erik Scher, Steven Molesa, Joerg Rockenberger, Arvind Kamath, Ikuo Mori
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Publication number: 20130189823Abstract: The present invention relates to electrically active devices (e.g., capacitors, transistors, diodes, floating gate memory cells, etc.) having dielectric, conductor, and/or semiconductor layers with smooth and/or dome-shaped profiles and methods of forming such devices by depositing or printing (e.g., inkjet printing) an ink composition that includes a semiconductor, metal, or dielectric precursor. The smooth and/or dome-shaped cross-sectional profile allows for smooth topological transitions without sharp steps, preventing feature discontinuities during deposition and allowing for more complete step coverage of subsequently deposited structures. The inventive profile allows for both the uniform growth of oxide layers by thermal oxidation, and substantially uniform etching rates of the structures. Such oxide layers may have a uniform thickness and provide substantially complete coverage of the underlying electrically active feature.Type: ApplicationFiled: March 8, 2013Publication date: July 25, 2013Inventors: Arvind KAMATH, Erik SCHER, Patrick SMITH, Aditi CHANDRA, Steven MOLESA
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Patent number: 8426905Abstract: The present invention relates to electrically active devices (e.g., capacitors, transistors, diodes, floating gate memory cells, etc.) having dielectric, conductor, and/or semiconductor layers with smooth and/or dome-shaped profiles and methods of forming such devices by depositing or printing (e.g., inkjet printing) an ink composition that includes a semiconductor, metal, or dielectric precursor. The smooth and/or dome-shaped cross-sectional profile allows for smooth topological transitions without sharp steps, preventing feature discontinuities during deposition and allowing for more complete step coverage of subsequently deposited structures. The inventive profile allows for both the uniform growth of oxide layers by thermal oxidation, and substantially uniform etching rates of the structures. Such oxide layers may have a uniform thickness and provide substantially complete coverage of the underlying electrically active feature.Type: GrantFiled: October 1, 2008Date of Patent: April 23, 2013Assignee: Kovio, Inc.Inventors: Arvind Kamath, Erik Scher, Patrick Smith, Aditi Chandra, Steven Molesa