Abstract: Managing power-consuming resources on a first computing device by adjusting data delivery from a plurality of second computing devices based on a state of the first computing device. The state of the first computing device is provided to the second computing devices to alter the data delivery. In some embodiments, the first computing device provides the second computing devices with actions or commands relating to data delivery based on the device state. For example, the second computing devices are instructed to store the data, forward the data, forward only high priority data, or perform other actions. Managing the data delivery from the second computing devices preserves battery life of the first computing device.

Abstract: Managing power-consuming resources on a first computing device by time-based and condition-based scheduling of data delivery from a plurality of second computing devices. A scheduler executing on the first computing device has knowledge of recurrent schedules for activation by the second computing devices. The first computing device determines availability of the power-consuming resources and adjusts an activation time for the schedules to use the power-consuming resources when the resources are available. Managing the schedules associated with the second computing devices preserves battery life of the first computing device.

Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

Abstract: Methods of forming a conductive via may include forming a blind via hole partially through a substrate, forming an aluminum film on surfaces of the substrate, removing a first portion of the aluminum film from some surfaces, selectively depositing conductive material onto a second portion of the aluminum film, and exposing the blind via hole through a back side of the substrate. Methods of fabricating a conductive via may include forming at least one via hole through at least one unplated bond pad, forming a first adhesive over at least one surface of the at least one via hole, forming a dielectric over the first adhesive, forming a base layer over the dielectric and the at least one unplated bond pad, and plating nickel onto the base layer.

Abstract: Methods for fabricating an imager die package and resulting die packages are disclosed. An imager die packaging process may include dicing through a fabrication substrate comprising a plurality of imager die. Thereafter, known good die (KGD) qualified from the imager die are repopulated, face down on a high temperature-compatible temporary carrier, the KGD on the temporary carrier are encapsulated and thereafter removed as a reconstructed wafer from the temporary carrier. Furthermore, a first plurality of discrete conductive elements on a back side of the reconstructed wafer may be partially exposed and, optionally, a second plurality of discrete conductive elements may be applied to the first plurality of discrete conductive elements. The encapsulated KGD are then singulated.

Abstract: The invention is a method to make compression molded motor vehicle parts from a charge of composite material with resin and fibers, such as sheet molded compound. The parts have voids, such as holes and gaps, that form in the compression mold under heat and pressure and not in secondary processing steps. The resin in the charge is melts in a reservoir in the mold to form resinous material from the charge. A flow front of resinous material is allowed to flow into a flow path around a restriction corresponding to the shape of the void from the reservoir. The flow front carries sufficient reinforcing fibers into the flow path. At least part of a border for the void forms in the flow path. The configuration is allowed to at least partially set.

Abstract: The invention is a method to make compression molded motor vehicle parts from a charge of composite material with resin and fibers, such as sheet molded compound. The parts have voids, such as holes and gaps, that form in the compression mold under heat and pressure and not in secondary processing steps. The resin in the charge is melts in a reservoir in the mold to form resinous material from the charge. A flow front of resinous material is allowed to flow into a flow path around a restriction corresponding to the shape of the void from the reservoir. The flow front carries sufficient reinforcing fibers into the flow path. At least part of a border for the void forms in the flow path. The configuration is allowed to at least partially set.

Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

Abstract: The invention includes semiconductor assemblies having two or more dies. An exemplary assembly has circuitry associated with a first die front side electrically connected to circuitry associated with a second die front side. The front side of the second die is adjacent a back side of the first die, and a through wafer interconnect extends through the first die. The through wafer interconnect includes a conductive liner within a via extending through the first die. The conductive liner narrows the via, and the narrowed via is filled with insulative material. The invention also includes methods of forming semiconductor assemblies having two or more dies; and includes electronic systems containing assemblies with two or more dies.

Abstract: Managing power-consuming resources on a first computing device by time-based and condition-based scheduling of data delivery from a plurality of second computing devices. A scheduler executing on the first computing device has knowledge of recurrent schedules for activation by the second computing devices. The first computing device determines availability of the power-consuming resources and adjusts an activation time for the schedules to use the power-consuming resources when the resources are available. Managing the schedules associated with the second computing devices preserves battery life of the first computing device.

Abstract: Managing power-consuming resources on a first computing device by adjusting data delivery from a plurality of second computing devices based on a state of the first computing device. The state of the first computing device is provided to the second computing devices to alter the data delivery. In some embodiments, the first computing device provides the second computing devices with actions or commands relating to data delivery based on the device state. For example, the second computing devices are instructed to store the data, forward the data, forward only high priority data, or perform other actions. Managing the data delivery from the second computing devices preserves battery life of the first computing device.

Abstract: Methods of forming a conductive via in a substrate include contacting the substrate with a wave of conductive liquid material, such as molten solder, and drawing the liquid material into the aperture with a vacuum. The wave may be formed by flowing the liquid material out from an outlet in a direction generally against the gravitational field. The liquid material may be solidified to form an electrically conductive structure. A plurality of apertures may be selectively filled with the liquid material one at a time, and liquids having different compositions may be used to provide conductive vias having different compositions in the same substrate. Systems for forming conductive vias include a substrate fixture, a vacuum device having a vacuum fixture, and a solder-dispensing device configured to provide a wave of molten solder material. Relative lateral and vertical movement is provided between the wave of molten solder and a substrate supported by the substrate fixture.

Abstract: Methods for fabricating an imager die package and resulting die packages are disclosed. An imager die packaging process may include dicing through a fabrication substrate comprising a plurality of imager die. Thereafter, known good die (KGD) qualified from the imager die are repopulated, face down on a high temperature-compatible temporary carrier, the KGD on the temporary carrier are encapsulated and thereafter removed as a reconstructed wafer from the temporary carrier. Furthermore, a first plurality of discrete conductive elements on a back side of the reconstructed wafer may be partially exposed and, optionally, a second plurality of discrete conductive elements may be applied to the first plurality of discrete conductive elements. The encapsulated KGD are then singulated.

Abstract: The invention is a method to make compression molded motor vehicle parts from a charge of composite material with resin and fibers, such as sheet molded compound. The parts have voids, such as holes and gaps, that form in the compression mold under heat and pressure and not in secondary processing steps. The resin in the charge is melts in a reservoir in the mold to form resinous material from the charge. A flow front of resinous material is allowed to flow into a flow path around a restriction corresponding to the shape of the void from the reservoir. The flow front carries sufficient reinforcing fibers into the flow path. At least part of a border for the void forms in the flow path. The configuration is allowed to at least partially set.

Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

Abstract: Methods of forming a conductive via in a substrate include contacting the substrate with a wave of conductive liquid material, such as molten solder, and drawing the liquid material into the aperture with a vacuum. The wave may be formed by flowing the liquid material out from an outlet in a direction generally against the gravitational field. The liquid material may be solidified to form an electrically conductive structure. A plurality of apertures may be selectively filled with the liquid material one at a time, and liquids having different compositions may be used to provide conductive vias having different compositions in the same substrate. Systems for forming conductive vias include a substrate fixture, a vacuum device having a vacuum fixture, and a solder dispensing device configured to provide a wave of molten solder material. Relative lateral and vertical movement is provided between the wave of molten solder and a substrate supported by the substrate fixture.

Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.