Abstract: An enantioselective route to compounds of formula I is disclosed: The compounds of formula I are key intermediates in the synthesis of compounds useful in treatment of Alzhemer's disease.

Abstract: Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imaging die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.

Abstract: Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imaging die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.

Abstract: Microelectronic imaging units and methods for manufacturing a plurality of imaging units at the wafer level are disclosed herein. In one embodiment, a method for manufacturing a plurality of imaging units includes providing an imager workpiece having a plurality of imaging dies including integrated circuits, external contacts electrically coupled to the integrated circuits, and image sensors operably coupled to the integrated circuits. The individual image sensors include at least one dark current pixel at a perimeter portion of the image sensor. The method includes depositing a cover layer onto the workpiece and over the image sensors. The method further includes patterning and selectively developing the cover layer to form discrete volumes of cover layer material over corresponding image sensors. The discrete volumes of cover layer material have sidewalls aligned with an inboard edge of the individual dark current pixels such that the dark current pixels are not covered by the discrete volumes.

Abstract: Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods are disclosed herein. A method for processing a microfeature workpiece in accordance with one embodiment includes applying adhesive material to a non-active portion on a first side of a workpiece. The workpiece can include a first active portion and a second active portion separated from each other at least in part by the non-active portion. The method continues by adhesively attaching the first side of the workpiece to a first support member, and releasably attaching the second side of the workpiece to a second support member. The method further includes separating the first active portion from the second active portion while the workpiece is attached to the second support member by cutting through the first support member and the non-active portion of the workpiece.

Abstract: Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods are disclosed herein. A method for processing a microfeature workpiece in accordance with one embodiment includes applying adhesive material to a non-active portion on a first side of a workpiece. The workpiece can include a first active portion and a second active portion separated from each other at least in part by the non-active portion. The method continues by adhesively attaching the first side of the workpiece to a first support member, and releasably attaching the second side of the workpiece to a second support member. The method further includes separating the first active portion from the second active portion while the workpiece is attached to the second support member by cutting through the first support member and the non-active portion of the workpiece.

Abstract: Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imager die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imager die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.

Abstract: An improved manual activation mechanism for an electronic flushometer system. A manual activation or override plate has a sensor switch directly coupled thereto and is hingedly connected to a sensor bracket. When a user presses the manual activation or override plate, the sensor switch acts against a bumper, which is compressed to create an electrical contact with a printed circuit board. The electrical contact results in the transmission of an electrical signal to a solenoid system, actuating a flushometer valve.

Abstract: In one embodiment, a method for implementing two-way communication between at least first and second devices comprises steps of: (a1) during finite time periods following transmission of respective first messages from the first device to the second device, using the first device to listen for second messages transmitted from the second device to first device; and (a2) after each of the finite time periods following the transmission of the respective first messages from the first device to the second device, ceasing to use the first device to listen for second messages transmitted from the second device to the first device until after the first device transmits another first message to the second device.

Abstract: Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imaging die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.

Abstract: Methods for forming interconnects in blind holes and microelectronic workpieces having such interconnects are disclosed herein. One aspect of the invention is directed toward a method for manufacturing a microelectronic workpiece having microelectronic dies with integrated circuits and terminals electrically coupled to the integrated circuits. In one embodiment, the method includes forming a blind hole in the workpiece. The blind hole extends from a first exterior side of the workpiece to an intermediate depth in the workpiece. The method continues by forming a vent in the workpiece. The vent is in fluid communication with the blind hole. The method further includes constructing an electrically conductive interconnect in at least a portion of the blind hole.

Abstract: Methods for forming interconnects in blind vias or other types of holes, and microelectronic workpieces having such interconnects. The blind vias can be formed by first removing the bulk of the material from portions of the back side of the workpiece without thinning the entire workpiece. The bulk removal process, for example, can form a first opening that extends to an intermediate depth within the workpiece, but does not extend to the contact surface of the electrically conductive element. After forming the first opening, a second opening is formed from the intermediate depth in the first opening to the contact surface of the conductive element. The second opening has a second width less than the first width of the first opening. This method further includes filling the blind vias with a conductive material and subsequently thinning the workpiece from the exterior side until the cavity is eliminated.

Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

Abstract: Microelectronic imager assemblies with optical devices having integral reference features and methods for assembling such microelectronic imagers is disclosed herein. In one embodiment, the imager assembly can include a workpiece with a substrate having a front side, a back side, and a plurality of imaging dies on and/or in the substrate. The imaging dies include image sensors, integrated circuitry operatively coupled to the image sensors, and external contacts electrically coupled to the integrated circuitry. The assembly also includes optics supports on the workpiece. The optics supports have openings aligned with corresponding image sensors and first interface features at reference locations relative to corresponding image sensors. The assembly further includes optical devices having optics elements and second interface features seated with corresponding first interface features to position the optics elements at a desired location relative to corresponding image sensors.

Abstract: Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imager die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imager die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.

Abstract: An infrared filter includes an optical filter stack disposed on a first surface of a substrate, the optical filter stack includes a plurality of dielectric layers and a plurality of metal layers alternating with the dielectric layers. and a transmission-enhancing coating. The infrared filter obtains an average transmission greater than or equal to 75% between 400 nm and 600 nm.

Abstract: A liquid soap dispenser includes a housing, a shank that engages a base of the housing, a soap path retainer disposed in the interior of the housing, a shank adapter disposed in the shank, and an infrared sensor to sense the presence of a user. A generally continuous passageway is defined through the shank adapter and the soap path retainer such that an elongated soap delivery tube of a liquid soap reservoir may be inserted through the passageway from the bottom of the soap dispenser to the spout end. The reservoir may be attached to the bottom end of the shank adapter. The soap path retainer is preferably formed of complementary halves, such as by plastic injection molding, that mate together to provide a curved passageway from near the base of the housing to the soap dispensing end and to support the sensor assembly.

Abstract: The invention relates to an optical coupling device that provides passive compensation for a shift in center wavelength due to a change in ambient temperature. A conventional solution is to mount one of the elements to be coupled on a pedestal or cantilevered arm, which has a coefficient of thermal expansion (CTE) different from a frame fixed relative to the other of the elements to be coupled. Unfortunately, these devices do not provide consistent results over long periods of time, due to uncontrolled movement of the outer free end of the cantilevered arm or pedestal. The present invention provides an expansion arm fixed on one end to a frame, a holder on the other end of the expansion arm, and a pair of flexible arms connecting the holder to the frame. This arrangement enables the expansion arm to freely expand in a first direction, while greatly restricting movement in any other direction.

Abstract: The invention relates to an optical coupling device that provides passive compensation for a shift in center wavelength due to a change in ambient temperature. A conventional solution is to mount one of the elements to be coupled on a pedestal or cantilevered arm, which has a coefficient of thermal expansion (CTE) different from a frame fixed relative to the other of the elements to be coupled. Unfortunately, these devices do not provide consistent results over long periods of time, due to uncontrolled movement of the outer free end of the cantilevered arm or pedestal. The present invention provides an expansion arm fixed on one end to a frame, a holder on the other end of the expansion arm, and a pair of flexible arms connecting the holder to the frame. This arrangement enables the expansion arm to freely expand in a first direction, while greatly restricting movement in any other direction.

Abstract: A mobile vehicle cab has cab extender pieces engaged to the cab rearwards relative to vehicle forward movement. The cab extenders act as extensions of the cab sides to provide aerodynamic efficiency to vehicle operation. A one-piece cab extender mounting and integrated grab handle is engaged to the rearward side of the cab and to the interior surface of the left side cab extender. The cab extender mounting and integrated grab handle contains a vertical handle portion that is integrated and between an approximately horizontal upper portion and an approximately horizontal lower portion.