Abstract: A flexible circuit having vias disposed to minimize discontinuity in a ground plane separating opposing transmission lines. The flex circuit comprises a first transmission line coupled to a first surface, a second transmission line coupled to a second opposing surface and a ground plane separating the first transmission line and the second transmission line. The flexible circuit also includes a first type of electrical connection pads disposed on the first surface, and electrically coupled to the first transmission line. The flexible circuit also includes a second type of electrical connection pads disposed on the second surface, and electrically coupled to the second transmission line wherein the second type of electrical connection pads have a higher areal density than the first type of electrical connection pads.

Abstract: A single channel optical interconnect for a fiber optic system includes a penetrator made of optically transmissive material and configured for insertion along the length of a plastic optical fiber for transferring light between the optical fiber and an optoelectronic device. A multiple channel optical interconnect uses a linear array of optoelectronic devices and corresponding optically transmissive penetrators. The penetrators may be pyramidal or conical bodies made of plastic or glass that are positioned above corresponding vertical cavity surface emitting lasers (VCSELs). The penetrators may also be etched directly into the substrates of bottom emitting VCSELs. The penetrators may have specially tailored side wall angles, or coatings, to facilitate coupling into the optical fibers and minimize back reflections into the VCSELs.

Abstract: A folded flex circuit interconnect increases a number of interconnection pads of a grid array interface available to accommodate high count outputs from distinct circuit elements. The circuit interconnect includes a substrate capable of being folded, a conductor layer adjacent to a surface of the substrate, and a pad array having an interconnection pad connected to the conductor layer at a first end of the circuit interconnect. The pad array is part of the grid array interface. An optics module includes the folded flex circuit interconnect and an optical unit. The folded flex circuit interconnect further includes an electrical interface at a second end that is connected to the conductor layer. The folded flex circuit interconnect connects to the optical unit using the electrical interface. The circuit interconnect connects the optical unit to a motherboard using the pad array at the first end.