Patents by Inventor Steven W. Winn

Steven W. Winn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10881867
    Abstract: A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400° C. to about 700° C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400° C. to about 1,900° C. for up to 6 hours; and a cool down portion at a rate of up to 5°/minute from a maximum sintering temperature down to about 1,000° C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: January 5, 2021
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Publication number: 20200121935
    Abstract: A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400° C. to about 700° C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400° C. to about 1,900° C. for up to 6 hours; and a cool down portion at a rate of up to 5°/minute from a maximum sintering temperature down to about 1,000° C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device.
    Type: Application
    Filed: December 10, 2019
    Publication date: April 23, 2020
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Patent number: 10500402
    Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: December 10, 2019
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Patent number: 10292718
    Abstract: An orthopedic reamer cutting tool is disclosed that incorporates a second material such as graphene having an increased coefficient of thermal conductivity to remove heat generated at the tissue cutting surface during use. The reamer is constructed having a hemispherical cutting shell that extends from an equatorial base to an apex at a distal end. A plurality of cutting teeth, each having a tissue cutting surface, extend from the exterior of the cutting shell. A reamer driver interface may be positioned spanning the diameter of the reamer base. The second material, having increased thermal conductivity, may be applied to the interior and/or exterior shell surfaces. In addition, the second material may be incorporated within the shell or the driver interface.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: May 21, 2019
    Assignee: VIANT AS&O HOLDINGS, LLC
    Inventors: Matthew L. Mroczkowski, Lasantha Viyannalage, Steven W Winn
  • Patent number: 10143480
    Abstract: An orthopedic bone cutter for cutting bone and tissue is described. The cutting device comprises a support frame having a plurality of radially extending struts to which a cutting shell is removably connected thereto. The frame serves as a universal support structure that provides added mechanical support and stability to which various embodiments of cutting shells may be connected thereto. The bone cutter of the present invention is designed such that the cutting shell may comprise a variety of embodiments that enable the removal of bone and tissue. Embodiments of the cutting shell may comprise at least a partially hemispherical shape in which a plurality of cutting surfaces may extend. In addition, the cutting shell may comprise a plurality of removal cutting blade inserts that are received within slots that extend through the shell thickness.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: December 4, 2018
    Assignee: Viant AS&O Holdings, LLC
    Inventors: Gary C. Victor, Sean P. Curry, Steven W. Winn
  • Publication number: 20180178017
    Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
    Type: Application
    Filed: February 12, 2018
    Publication date: June 28, 2018
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Patent number: 9889306
    Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
    Type: Grant
    Filed: July 11, 2015
    Date of Patent: February 13, 2018
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Patent number: 9687662
    Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
    Type: Grant
    Filed: July 11, 2015
    Date of Patent: June 27, 2017
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Publication number: 20170000502
    Abstract: An orthopedic reamer cutting tool is disclosed that incorporates a second material such as graphene having an increased coefficient of thermal conductivity to remove heat generated at the tissue cutting surface during use. The reamer is constructed having a hemispherical cutting shell that extends from an equatorial base to an apex at a distal end. A plurality of cutting teeth, each having a tissue cutting surface, extend from the exterior of the cutting shell. A reamer driver interface may be positioned spanning the diameter of the reamer base. The second material, having increased thermal conductivity, may be applied to the interior and/or exterior shell surfaces. In addition, the second material may be incorporated within the shell or the driver interface.
    Type: Application
    Filed: July 5, 2016
    Publication date: January 5, 2017
    Inventors: Matthew L. Mroczkowski, Lasantha Viyannalage, Steven W. Winn
  • Patent number: 9511220
    Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: December 6, 2016
    Assignee: Greatbatch Ltd.
    Inventors: Thomas Marzano, Keith W. Seitz, Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Richard L. Brendel, Jason Woods, Steven W. Winn, Dominick J. Frustaci, Bruehl E. Truex, Donald H. Hickel, Jr.
  • Patent number: 9492659
    Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: November 15, 2016
    Assignee: Greatbatch Ltd.
    Inventors: Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Robert A. Stevenson, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Patent number: 9352150
    Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: May 31, 2016
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Thomas Marzano, Keith W. Seitz, Steven W. Winn, Christine A. Frysz, Richard L. Brendel, Jason Woods, Dominick J. Frustaci, Xiaohong Tang, William C. Thiebolt
  • Patent number: 9280654
    Abstract: Various embodiments of modular battery authentication circuits are described. The various modular battery authentication circuits are intended to be utilized with electrically powered devices that do not comprise existing battery authentication capabilities. In one embodiment, a modular battery authentication adapter is described. The adapter comprises a housing in which a modular battery authentication circuit resides. One end of the adapter is positioned within a power input port of a device and a modular battery is positioned within the opposing end of the adapter. The authentication circuit within the adapter communicates with the modular battery to determine its authenticity before allowing the battery to power the device. A modular battery comprising an internal authentication circuit is also described. The modular battery is designed to interact with firmware stored within the device to determine whether the modular battery meets certain operational criteria.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: March 8, 2016
    Assignee: Electrochem Solutions, Inc.
    Inventors: Brian R. Peterson, Kenneth E. Burnap, Steven W. Winn, Michael F. Scalise
  • Publication number: 20160008595
    Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
    Type: Application
    Filed: September 25, 2015
    Publication date: January 14, 2016
    Inventors: Robert A. Stevenson, Thomas Marzano, Keith W. Seitz, Steven W. Winn, Christine A. Frysz, Richard L. Brendel, Jason Woods, Dominick J. Frustaci, Xiaohong Tang, William C. Thiebolt
  • Patent number: 9233253
    Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: January 12, 2016
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Thomas Marzano, Keith W. Seitz, Steven W. Winn, Christine A. Frysz, Richard L. Brendel, Jason Woods, Dominick J. Frustaci, Xiaohong Tang, William C. Thiebolt
  • Publication number: 20150366568
    Abstract: An orthopedic bone cutter for cutting bone and tissue is described. The cutting device comprises a support frame having a plurality of radially extending struts to which a cutting shell is removably connected thereto. The frame serves as a universal support structure that provides added mechanical support and stability to which various embodiments of cutting shells may be connected thereto. The bone cutter of the present invention is designed such that the cutting shell may comprise a variety of embodiments that enable the removal of bone and tissue. Embodiments of the cutting shell may comprise at least a partially hemispherical shape in which a plurality of cutting surfaces may extend. In addition, the cutting shell may comprise a plurality of removal cutting blade inserts that are received within slots that extend through the shell thickness.
    Type: Application
    Filed: June 22, 2015
    Publication date: December 24, 2015
    Inventors: Gary C. Victor, Sean P. Curry, Steven W. Winn
  • Publication number: 20150314131
    Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
    Type: Application
    Filed: July 11, 2015
    Publication date: November 5, 2015
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Publication number: 20150134039
    Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
    Type: Application
    Filed: January 20, 2015
    Publication date: May 14, 2015
    Inventors: Thomas Marzano, Keith W. Seitz, Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Richard L. Brendel, Jason Woods, Steven W. Winn, Dominick J. Frustaci, Bruehl E. Truex, Donald H. Hickel, JR.
  • Patent number: 8938309
    Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: January 20, 2015
    Assignee: Greatbatch Ltd.
    Inventors: Thomas Marzano, Keith W. Seitz, Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Richard L. Brendel, Jason Woods, Steven W. Winn, Dominick J. Frustaci, Buehl E. Truex, Donald Hickel, Jr.
  • Patent number: RE47624
    Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: October 1, 2019
    Assignee: Greatbatch Ltd.
    Inventors: Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Robert A. Stevenson, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominck J. Frustaci, Steven W. Winn