Abstract: A method for fabricating a semiconductor device includes forming a silicon-containing layer; forming a metal-containing layer over the silicon-containing layer; forming an undercut prevention layer between the silicon containing layer and the metal containing layer; etching the metal-containing layer; and forming a conductive structure by etching the undercut prevention layer and the silicon-containing layer.

Abstract: A method for fabricating a semiconductor device includes forming a silicon-containing layer; forming a metal-containing layer over the silicon-containing layer; forming an undercut prevention layer between the silicon containing layer and the metal containing layer; etching the metal-containing layer; and forming a conductive structure by etching the undercut prevention layer and the silicon-containing layer.

Abstract: A transistor having a source region and a drain region which are separately formed in a substrate, a trench which is defined in the substrate between the source region and the drain region, and a gate electrode which is formed in the trench. The gate electrode includes a first electrode buried over a bottom of the trench; a second electrode formed over the first electrode; and a liner electrode having an interface part which is positioned between the first electrode and the second electrode and a side part, which is positioned on sidewalls of the second electrode and overlaps with the source region and the drain region.

Abstract: Provided is a flexible organic electroluminescent device and a method for fabricating the same. In the flexible electroluminescent device, line hole patterns are formed on surfaces of a plurality of inorganic layers positioned in a pad region in which a flexible printed circuit board is connected to prevent a path of cracks caused by repeated bending and spreading of the organic electroluminescent device from spreading to the interior of the device.

Abstract: A method for fabricating a semiconductor device includes forming a silicon-containing layer; forming a metal-containing layer over the silicon-containing layer; forming an undercut prevention layer between the silicon containing layer and the metal containing layer; etching the metal-containing layer; and forming a conductive structure by etching the undercut prevention layer and the silicon-containing layer.

Abstract: A method for manufacturing a flexible electrophoretic display device, including: providing a metal mother substrate having a first thickness, including a unit display panel region and a non-display region adjacent the unit display panel region; forming a display element in the unit display panel region; forming a groove in the non-display region of the mother substrate; cutting the mother substrate along the groove to separate the unit display panel region from the mother substrate; thinning the substrate of the separated unit display panel region; and forming an electrophoretic ink film on the unit display panel region.

Abstract: A delay locked loop is provided. The delay locked loop controls the number of delay cells that delay the phase of an input clock during a locking operation and controls a phase delay value of at least one delay cell among a plurality of delay cells after the locking operation is completed.

Abstract: A duty control circuit including a clock input unit connected to a first node and a second node, the clock input unit receiving an input clock signal through the first node and changing a voltage of the second node to one of a first voltage level and a second voltage level in response to respective low and high logic levels of the input clock signal, a slew controller connected to the second node, the slew controller including one or more switches controlled by respective control signals, the one or more switches providing one of the first voltage level and the second voltage level to the second node in response to the control signals such that a slew rate of a signal at the second node is varied, and a clock output unit, the clock output unit outputting an output clock signal having a duty that varies.

Abstract: A duty cycle correction circuit includes a duty cycle correction portion that is configured to output a correction signal that is obtained by correcting a duty cycle of an input signal and to output a delayed signal that is obtained by delaying the correction signal, a complementary portion that is configured to output a complementary signal that is the complement of the delayed signal, and a phase interpolator that is configured to phase interpolate the complementary signal and the correction signal.

Abstract: Provided is a method for fabricating a transistor in a semiconductor device. The method includes forming an etch stop layer pattern over a semiconductor substrate; forming a semiconductor layer for covering the etch stop layer pattern; forming a recess trench that exposes an upper surface of the etch stop layer pattern by etching the semiconductor layer pattern; removing the etch stop layer pattern exposed in the recess trench; and forming a gate that fills the recess trench.

Abstract: A delay locked loop is provided. The delay locked loop controls the number of delay cells that delay the phase of an input clock during a locking operation and controls a phase delay value of at least one delay cell among a plurality of delay cells after the locking operation is completed.

Abstract: Disclosed herein is a metal interconnection structure of a semiconductor device, comprising lower metal interconnection layers disposed on a semiconductor substrate, a buffer layer made of a metal oxide disposed thereon, an intermetallic dielectric layer made of a low-k material disposed on the buffer layer of the metal oxide, and an upper metal interconnection layer disposed on the intermetallic dielectric layer and electrically connected through the intermetallic dielectric layer and buffer layer to the lower metal interconnection layers.

Abstract: A method for manufacturing a semiconductor device having recess gates includes forming an etch stop film on a semiconductor substrate; forming an etch stop film pattern selectively exposing the semiconductor substrate by patterning the etch stop film; forming a semiconductor layer on the semiconductor substrate; forming a hard mask film pattern exposing regions, for forming trenches for recess gates, on the semiconductor substrate; removing the semiconductor layer using the hard mask film pattern as a mask until the etch stop film pattern is exposed; forming the trenches for recess gates by removing the etch stop film pattern from the semiconductor substrate; and forming gate stacks, each of which is formed in the corresponding one of the trenches for recess gates.

Abstract: A duty cycle correction circuit includes a duty cycle correction portion that is configured to output a correction signal that is obtained by correcting a duty cycle of an input signal and to output a delayed signal that is obtained by delaying the correction signal, a complementary portion that is configured to output a complementary signal that is the complement of the delayed signal, and a phase interpolator that is configured to phase interpolate the complementary signal and the correction signal.

Abstract: A duty control circuit including a clock input unit connected to a first node and a second node, the clock input unit receiving an input clock signal through the first node and changing a voltage of the second node to one of a first voltage level and a second voltage level in response to respective low and high logic levels of the input clock signal, a slew controller connected to the second node, the slew controller including one or more switches controlled by respective control signals, the one or more switches providing one of the first voltage level and the second voltage level to the second node in response to the control signals such that a slew rate of a signal at the second node is varied, and a clock output unit, the clock output unit outputting an output clock signal having a duty that varies.

Abstract: Disclosed herein is a method for fabricating a semiconductor memory device that can prevent oxidation of bit lines when forming an interlayer dielectric for isolating the bit lines. The bit line is formed on a semiconductor substrate where an underlying structure is formed. A silicon on dielectric (SOD) layer is formed on the resulting structure where the bit line is formed. A heat treatment can be performed on the SOD layer with a partial pressure ratio of water vapor (H2O) to hydrogen (H2) in a range of about 1×10?11 to about 1.55 at a temperature in a range of about 600° C. to about 1,100° C.

Abstract: Disclosed herein is a method for fabricating a semiconductor memory device that can prevent oxidation of bit lines when forming an interlayer dielectric for isolating the bit lines. The bit line is formed on a semiconductor substrate where an underlying structure is formed. A silicon on dielectric (SOD) layer is formed on the resulting structure where the bit line is formed. A heat treatment can be performed on the SOD layer with a partial pressure ratio of water vapor (H2O) to hydrogen (H2) in a range of about 1×10?11 to about 1.55 at a temperature in a range of about 600° C. to about 1,100° C.

Abstract: Provided is a method for fabricating a transistor in a semiconductor device. The method includes forming an etch stop layer pattern over a semiconductor substrate; forming a semiconductor layer for covering the etch stop layer pattern; forming a recess trench that exposes an upper surface of the etch stop layer pattern by etching the semiconductor layer pattern; removing the etch stop layer pattern exposed in the recess trench; and forming a gate that fills the recess trench.

Abstract: A method of forming an isolation layer in a semiconductor device using rapid vapor deposition to fill in a trench of the semiconductor device comprises forming a hydrophilic layer on the trench and forming a hydrophobic layer on a region other than the trench, and selectively forming a buried insulating layer in the trench using a catalytic reaction of the hydrophilic layer.

Abstract: A method for manufacturing a flexible electrophoretic display device, including: providing a metal mother substrate having a first thickness, including a unit display panel region and a non-display region adjacent the unit display panel region; forming a display element in the unit display panel region; forming a groove in the non-display region of the mother substrate; cutting the mother substrate along the groove to separate the unit display panel region from the mother substrate; thinning the substrate of the separated unit display panel region; and forming an electrophoretic film on the unit display panel region.