Abstract: An electrolyte additive comprising a compound represented by Formula 1 below forms a coating film on an electrode surface in the activation of a secondary battery, thereby the generation of a large amount of gas under a high temperature condition can be prevented, and a cell OCV drop and a decrease in capacity retention rate, which are caused by elution of metal ions from an electrode, can be effectively prevented, resulting in effective improvement in durability, performance and high-temperature safety of the battery, wherein R1, R2, and M are described herein.

Abstract: Disclosed herein relates to an electrolyte composition and a lithium secondary battery including the same, wherein the electrolyte composition can not only effectively reduce gas generated during charging and discharging of the lithium secondary battery by including one or more electrolyte additives of a chemical compound represented by Formula 1 or a chemical compound represented by Formula 2, but also has the advantage of strengthening the SEI layer on the electrode surface, thereby improving the storage characteristics and life characteristics at high temperatures.

Abstract: An air-conditioning device for mobilities and an air-conditioning control system for mobilities using the same, which are capable of performing independent air-conditioning control for each seat when a mobility is heated and cooled, thereby preventing wastage of heating and cooling energy by performing individual air conditioning for each seat depending on whether a passenger is seated, and ensuring comfort of all passengers by providing conditioned air to each seat.

Abstract: An electrolyte composition with improved high temperature safety and a lithium secondary battery including the same is described herein. The electrolyte composition containing a primary additive comprising a compound represented by Formula 1, and specific amount of a secondary additive that contains one or more of cyclic carbonates, can not only reduce the generation of gas during secondary battery charge-discharge, but also improve storage characteristics and the lifespan characteristics under a high temperature condition by strengthening the SEI coating film on the surface of an electrode. wherein all the variables are described herein.

Abstract: There is provide a method for manufacturing analytical semiconductor samples by using an apparatus for manufacturing analytical semiconductor samples, which minimizes a feedback time by manufacturing a viewing surface that is environment-friendly and has a large area. The method comprising mounting the analytical semiconductor samples to a holder; discharging deionized (DI) water to an upper surface of a polishing plate through a DI water nozzle; grinding the analytical semiconductor samples with the upper surface of the polishing plat; determining whether a desired viewing surface of the analytical semiconductor samples has been acquired after the grinding of the analytical semiconductor samples; and transferring the analytical semiconductor samples to analyze the viewing surface of the ground analytical semiconductor samples based on a determination that the desired viewing surface of the analytical semiconductor samples has been acquired.

Abstract: Disclosed herein are an image fixing device and an image forming apparatus having the same. The image fixing device includes a fixing belt which is rotatably disposed, and a pressure roller which is disposed to be opposite to the fixing belt and thus to press an outer circumferential surface of the fixing belt, wherein the fixing belt includes a fixing part of which an outer surface has a first friction coefficient, and a meandering movement preventing part which is located at each of both ends of the fixing part in a length direction of the fixing belt, and of which an outer surface has a second friction coefficient greater than the first friction coefficient. By the configuration, a meandering movement of the fixing belt is prevented, and thus it is possible to improve fixing efficiency.

Abstract: A fusing device with improved fusing performance to obtain superior gloss and gloss uniformity. The fusing device includes at least one heat source to generate heat, a fusing belt disposed near the heat source, a rotation unit contacting an outer circumference of the fusing belt, at least one pressurization unit pressed toward the rotation unit such that a fusing nip is formed between the fusing belt and the rotation unit, a heat conductor contacting an inner surface of the fusing belt to conduct heat to the fusing nip, and an intermediate unit disposed between the pressurization unit and the heat conductor to prevent transmission of heat from the heat conductor to the pressurization unit.

Abstract: A fusing device with improved fusing performance to obtain superior gloss and gloss uniformity. The fusing device includes at least one heat source to generate heat, a fusing belt disposed near the heat source, a rotation unit contacting an outer circumference of the fusing belt, at least one pressurization unit pressed toward the rotation unit such that a fusing nip is formed between the fusing belt and the rotation unit, a heat conductor contacting an inner surface of the fusing belt to conduct heat to the fusing nip, and an intermediate unit disposed between the pressurization unit and the heat conductor to prevent transmission of heat from the heat conductor to the pressurization unit.

Abstract: A fixing unit and an image forming apparatus including the fixing unit. The fixing unit includes a heating roller having an internal space in which a heating source is disposed and a pressurizing roller facing the heating roller. The heating roller has a circular hollow pipe shape and includes a fixing nip forming part which forms a fixing nip between the fixing nip forming part and the pressurizing roller. The nip forming part can have a slim part disposed at a center thereof and a pair of deformation preventing parts formed at both ends of the slim part, each deformation preventing part having a thickness thicker than a thickness of the slim part.

Abstract: An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

Abstract: An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

Abstract: A fixing unit and an image forming apparatus including the fixing unit. The fixing unit includes a heating roller having an internal space in which a heating source is disposed and a pressurizing roller facing the heating roller. The heating roller has a circular hollow pipe shape and includes a fixing nip forming part which forms a fixing nip between the fixing nip forming part and the pressurizing roller. The nip forming part can have a slim part disposed at a center thereof and a pair of deformation preventing parts formed at both ends of the slim part, each deformation preventing part having a thickness thicker than a thickness of the slim part.

Abstract: An image forming element includes an image drum including a plurality of ring electrodes and a slot. The plurality of ring electrodes are formed to be spaced apart from one another on a circumference of the image drum. The slot is formed in a longitudinal direction on the image drum. A connecting member includes a plurality of connecting electrodes and is disposed inside the image drum so that an end of the connecting member is received in the slot. The connecting electrodes are electrically connected with the ring electrodes one to one on the same line.

Abstract: Disclosed are a fusing device with improved temperature increase and fusing performance characteristics and an image forming apparatus having the same. The fusing device can include a heater to generate heat, a fusing belt arranged around the heater, a rotating member, a press member and a heat shield unit. The rotating member may be configured to come into contact with an outer periphery of the fusing belt. The press member may be configured to be press a portion of the fusing belt toward the rotating member to define a fusing nip between the fusing belt and the rotating member. The heat shield unit configured to surround the press member to reduce the amount of heat delivered to the press member.

Abstract: A fusing device includes a rotatable pressing roller, a fusing belt to rotate by a rotational force transmitted from the rotatable pressing roller, a nip forming member to contact an inner surface of the fusing belt to form a nip on a contact area between the rotatable pressing roller and the fusing belt, a heating member formed in approximately an internal central portion of the fusing belt to heat the nip forming member and the fusing belt, an inner support member formed within the fusing belt to press a nip part of the nip forming member toward the rotatable pressing roller, and an outer support member formed outside the fusing belt, and both ends of the outer support member being engaged with the inner support member to thereby reinforce the strength of the inner support member and form a path for radiation heat to disperse.

Abstract: A light emitting diode (LED) array module includes a plurality of LEDs; and a substrate which mounts the LEDs and has a built-in cooling device for cooling heat generated when the LED is driven. The cooling device includes a heat radiation space formed on the substrate and a minute passage member which is wick- or mesh-structured to form a plurality of minute passages that operate by a heat pipe principle in the heat radiation space. The cooling device operating by the heat pipe principle is integrally formed on the substrate mounted with the LEDs, so heat radiation performance of the LEDs is enhanced, such that the LEDs can operate stably for a long time.

Abstract: An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

Abstract: A fusing device includes a rotatable pressing roller, a fusing belt to rotate by a rotational force transmitted from the rotatable pressing roller, a nip forming member to contact an inner surface of the fusing belt to form a nip on a contact area between the rotatable pressing roller and the fusing belt, a heating member formed in approximately an internal central portion of the fusing belt to heat the nip forming member and the fusing belt, an inner support member formed within the fusing belt to press a nip part of the nip forming member toward the rotatable pressing roller, and an outer support member formed outside the fusing belt, and both ends of the outer support member being engaged with the inner support member to thereby reinforce the strength of the inner support member and form a path for radiation heat to disperse.

Abstract: An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

Abstract: A fusing device includes a rotatable pressing roller, a fusing belt to rotate by a rotational force transmitted from the rotatable pressing roller, a nip forming member to contact an inner surface of the fusing belt to form a nip on a contact area between the rotatable pressing roller and the fusing belt, a heating member formed in approximately an internal central portion of the fusing belt to heat the nip forming member and the fusing belt, an inner support member formed within the fusing belt to press a nip part of the nip forming member toward the rotatable pressing roller, and an outer support member formed outside the fusing belt, and both ends of the outer support member being engaged with the inner support member to thereby reinforce the strength of the inner support member and form a path for radiation heat to disperse.