Abstract: An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

Abstract: A fusing device includes a rotatable pressing roller, a fusing belt to rotate by a rotational force transmitted from the rotatable pressing roller, a nip forming member to contact an inner surface of the fusing belt to form a nip on a contact area between the rotatable pressing roller and the fusing belt, a heating member formed in approximately an internal central portion of the fusing belt to heat the nip forming member and the fusing belt, an inner support member formed within the fusing belt to press a nip part of the nip forming member toward the rotatable pressing roller, and an outer support member formed outside the fusing belt, and both ends of the outer support member being engaged with the inner support member to thereby reinforce the strength of the inner support member and form a path for radiation heat to disperse.

Abstract: An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

Abstract: An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

Abstract: A fusing apparatus includes a heating unit to generate heat to fuse an image onto a printing medium, a pressurizing roller that faces and contacts the heating unit having an endless fusing film that is rotated while facing and contacting the pressurizing roller and presses the printing medium toward the heating unit, a nip forming member including a main body formed inside the fusing film to surround a heat source and contacts a portion of the fusing film to the pressurizing roller to form a nip. The fusing apparatus further includes a supporting member to support the nip forming member.

Abstract: A fusing device includes a pressure unit, a belt unit to rotate in outer contact with the pressure unit, a nip forming unit to form a nip over a contact portion between the pressure unit and the belt unit, a heating unit to heat the nip forming unit and the belt unit, and a support unit to press and support the nip forming unit constantly and having a plurality of heat transmission portions defined in a parallelogrammic shape of an oblique direction with respect to a traveling direction of the belt unit.

Abstract: A fixing device includes a fixing roller, a fixing belt which is made to rotate by a rotation force received from the fixing roller, a nip forming unit to form a nip zone at a contact area between the fixing roller and the fixing belt, and a first heating unit, which is separated from the nip zone, to apply heat to the fixing belt. The nip zone and the heating unit are separated, so that the heating unit can be prevented from being broken as a result of the pressurization and thermal deformation.

Abstract: A fusing device includes a pressing member, a belt member to rotate in contact with the pressing member, a nip forming member to support the belt member so that nip areas are formed on the pressing member and the belt member at contacting portions thereto, a heating member disposed away from the nip areas, to heat the belt member, and a tension application member to stiffen the belt member so that the heating member is tightly contacted with the belt member. The heating member includes a plate type heating element which is arranged at an upstream side of the nip areas, and to contact an inner circumference of the belt member, in an advancing direction of the fusing belt. The effective width of then nip areas increases, and the increased pressure is exerted to the nip areas, because the fusing belt enters a location where the nip areas are formed in a heated state.

Abstract: Disclosed are a fusing device with improved temperature increase and fusing performance characteristics and an image forming apparatus having the same. The fusing device can include a heater to generate heat, a fusing belt arranged around the heater, a rotating member, a press member and a heat shield unit. The rotating member may be configured to come into contact with an outer periphery of the fusing belt. The press member may be configured to be press a portion of the fusing belt toward the rotating member to define a fusing nip between the fusing belt and the rotating member. The heat shield unit configured to surround the press member to reduce the amount of heat delivered to the press member.

Abstract: A method of fabricating a backlight module in which at least one luminescence element is positioned, including: positioning a luminescence element in at least one cavity formed on a carrier; forming a lower electrode on a substrate; transferring the luminescence element positioned on the carrier to the substrate, connecting the luminescence element to a pattern of the lower electrode formed on the substrate, and removing the carrier; forming an insulating layer on a surface of the substrate to which the luminescence element is transferred, and exposing a top region of the luminescence element; and forming an upper electrode on the exposed top region of the luminescence element. Accordingly, the backlight module including very small luminescence elements being of a micro unit in size is easily fabricated.

Abstract: An image heating apparatus including: a pressure member; a fixing roller to rotate on the pressure member; a heater to heat an external surface of the fixing roller; and a film to be heated by the heater. While passing through a gap between the pressure member and the fixing roller, the film may form a nip with the pressure member. The image heating apparatus may reduce an initial warm-up time through a film heating operation, and may utilize the fixing roller as a heat reservoir by heating the fixing roller.

Abstract: An image heating apparatus includes a pressure roller, a belting film to circulate while partially connecting with the pressure roller, a support member to be provided in the belting film and comprises a guide to guide the circulating of the belting film, a nip spring to comprise a nip portion to form a nip between the belting film and the pressure roller, and a support portion to support the nip portion against the support member, and a heater to be provided adjacent to the nip spring and transfer heat to the image through the belting film.

Abstract: A fixing device includes a pressing roller, a fixing belt to receive a rotation force transferred from the pressing roller and to rotate thereby, a nip forming member which is mounted inside the fixing belt, the nip forming member including a heat transmission unit formed thereon, and a heat source, which is mounted inside the nip forming member, to simultaneously apply heat to the nip forming member and to the fixing belt through the heat transmission unit.

Abstract: A lighting device is provided. The lighting device includes a light source, a light source supporting member which has a surface to which the light source is attached, and a heat sink on an opposite surface of the light source supporting member, for dissipating heat generated by the light source. In addition, the heat sink includes a heat transfer member which protrudes from the surface of the light source supporting member; a plurality of first fins which are spaced apart from each other at intervals in a length direction of the heat transfer member, and are arranged parallel to the light source supporting member; and a plurality of second fins which are spaced apart from each other at intervals, surround outer portions of the first fins, and are arranged perpendicularly to the light source supporting member.

Abstract: A piezoelectric inkjet printhead, and a method of manufacturing the same, includes an ink inlet for allowing inflow of ink, a plurality of pressure chambers to contain ink to be ejected, the plurality of pressure chambers being in communication with the ink inlet, a manifold formed in communication with the ink inlet, a plurality of restrictors connecting the manifold to respective first ends of the pressure chambers, a plurality of dampers at positions corresponding to respective second ends of the pressure chambers, the second ends being opposite the first ends, a plurality of nozzles in communication with the plurality of dampers for ejecting the ink, a plurality of actuators for applying a driving force to each of the pressure chambers for ejecting the ink, a damping membrane under the manifold for dampening a pressure change inside the manifold and a cavity under the damping membrane.

Abstract: A liquid crystal on silicon (LCOS) device includes a wafer, glass, and walls formed at opposite ends of an upper surface of the wafer to define a predetermined cell gap between the glass and the wafer. A thin piezo-electric layer is attached onto a surface of the wafer and an electrode is applied with external power to expand and/or contract the thin piezo-electric layer. The LCOS device further includes a voltage detection unit for detecting a voltage generated by the deformation of the thin piezo-electric layer; and a feedback control unit for compensating for deformation of the thin piezo-electric layer according to the voltage detected by the voltage detection unit. The LCOS device achieves uniformity of the cell gap by adjusting the voltage level of the thin piezo-electric layer after bonding the wafer and the glass, and therefore, spacers are not required.

Abstract: A fusing device includes a pressure unit, a belt unit to rotate in outer contact with the pressure unit, a nip forming unit to form a nip over a contact portion between the pressure unit and the belt unit, a heating unit to heat the nip forming unit and the belt unit, and a support unit to press and support the nip forming unit constantly and having a plurality of heat transmission portions defined in a parallelogrammic shape of an oblique direction with respect to a traveling direction of the belt unit.

Abstract: A fusing device includes a rotatable pressing roller, a fusing belt to rotate by a rotational force transmitted from the rotatable pressing roller, a nip forming member to contact an inner surface of the fusing belt to form a nip on a contact area between the rotatable pressing roller and the fusing belt, a heating member formed in approximately an internal central portion of the fusing belt to heat the nip forming member and the fusing belt, an inner support member formed within the fusing belt to press a nip part of the nip forming member toward the rotatable pressing roller, and an outer support member formed outside the fusing belt, and both ends of the outer support member being engaged with the inner support member to thereby reinforce the strength of the inner support member and form a path for radiation heat to disperse.

Abstract: An LED package includes a substrate, an LED, and a cap. The substrate includes a first conductor unit, a second conductor unit, and a non-conductor unit which electrically insulates the first and second conductor unit. The LED is bonded to the first conductor unit. The cap is mounted on the substrate over the LED and comprises a conductive wire which connects the LED to the second conductor unit.

Abstract: A piezoelectric inkjet printhead capable of reducing a crosstalk and a method of manufacturing the same are provided. The inkjet printhead includes an upper substrate, an intermediate substrate, and a lower substrate that are sequentially stacked, wherein the upper substrate includes piezoelectric actuators on an upper surface of the upper substrate and pressure chambers and first restrictors on a lower surface of the upper substrate, the first restrictors extending from the pressure chambers and having a width smaller than a width of the pressure chambers, the intermediate substrate includes dampers passing therethrough, the dampers corresponding to the pressure chambers and second restrictors extending between the first restrictors and a manifold formed from a lower surface of the intermediate substrate and the lower substrate includes nozzles passing therethrough, the nozzles corresponding to the dampers.