Abstract: Semiconductor devices having scalable two transistor memory cells, and methods of fabricating the same, are disclosed. The semiconductor devices include a semiconductor substrate having first, second and third isolation layers thereon. The first and second isolation layers are spaced apart to define a first active region therebetween, and the second and third isolation layers are likewise spaced apart to form a second active region therebetween. A cell gate is provided on each active region that includes a gate dielectric layer, a storage node, a multiple tunnel junction barrier and a source layer that are sequentially stacked. The device also includes first and second control lines that surround at least a portion of each sidewall of the cell gates. A dielectric layer may be interposed between the sidewalls of the cell gates and the control line that surrounds it. A data line connects to the cell gates.

Abstract: Exemplary embodiments of the present invention provide set programming methods and write driver circuits for a phase-change memory array. An exemplary embodiment of a set programming method may comprise applying a set current pulse to the phase-change cells, which may cause phase-change cells, which may be included within the phase-change memory array, to transition to the set resistance state. Exemplary embodiments of the set programming methods and/or write driver circuits may result in the phase-change cells to transition to the set resistance state.

Abstract: Semiconductor devices having scalable two transistor memory cells, and methods of fabricating the same, are disclosed. The semiconductor devices include a semiconductor substrate having first, second and third isolation layers thereon. The first and second isolation layers are spaced apart to define a first active region therebetween, and the second and third isolation layers are likewise spaced apart to form a second active region therebetween. A cell gate is provided on each active region that includes a gate dielectric layer, a storage node, a multiple tunnel junction barrier and a source layer that are sequentially stacked. The device also includes first and second control lines that surround at least a portion of each sidewall of the cell gates. A dielectric layer may be interposed between the sidewalls of the cell gates and the control line that surrounds it. A data line connects to the cell gates.

Abstract: A phase-change memory device includes a phase-change memory cell having a volume of material which is programmable between amorphous and crystalline states. A write current source selectively applies a first write current pulse to program the phase-change memory cell into the amorphous state and a second write current pulse to program the phase-change memory cell into the crystalline state. The phase-change memory device further includes a restore circuit which selectively applies the first current pulse to the phase-change memory cell to restore at least an amorphous state of the phase-change memory cell.

Abstract: A semiconductor memory device includes a sense line, a data line, a memory connected between the sense line and the data line having an active restoration function, and a sense amplifier connected between the sense line and the data line. The sense amplifier senses and inverts the data in the sense line, and outputs the inverted data to the data line. The polarity of the data on the sense line is opposite the polarity of the data on the data line, and the data in the data line are written to the memory. The semiconductor memory device is capable of performing an active restoration function which makes it possible to rewrite the result of sensing operations from the sense amplifier without the need for an additional circuit or operations.

Abstract: Semiconductor devices having scalable two transistor memory cells, and methods of fabricating the same, are disclosed. The semiconductor devices include a semiconductor substrate having first, second and third isolation layers thereon. The first and second isolation layers are spaced apart to define a first active region therebetween, and the second and third isolation layers are likewise spaced apart to form a second active region therebetween. A cell gate is provided on each active region that includes a gate dielectric layer, a storage node, a multiple tunnel junction barrier and a source layer that are sequentially stacked. The device also includes first and second control lines that surround at least a portion of each sidewall of the cell gates. A dielectric layer may be interposed between the sidewalls of the cell gates and the control line that surrounds it. A data line connects to the cell gates.

Abstract: A semiconductor memory device includes a sense line, a data line, a memory connected between the sense line and the data line having an active restoration function, and a sense amplifier connected between the sense line and the data line. The sense amplifier senses and inverts the data in the sense line, and outputs the inverted data to the data line. The polarity of the data on the sense line is opposite the polarity of the data on the data line, and the data in the data line are written to the memory. The semiconductor memory device is capable of performing an active restoration function which makes it possible to rewrite the result of sensing operations from the sense amplifier without the need for an additional circuit or operations.

Abstract: A memory cell transistor of a DRAM device is provided. A gate stack pattern is formed on a semiconductor substrate. A DC node and a BC node are formed substantially under lateral sides of the gate stack pattern in the semiconductor substrate. The DC node and the BC node are being electrically connected to a bit line and a storage electrode of a capacitor respectively. A first source/drain junction region is formed under the DC node and a second source/drain junction region is formed under the BC node. The first source/drain junction region has a profile which is different from that of the second source/drain junction region.

Abstract: A semiconductor device having a contact plug and a method for manufacturing the same are provided. A diffusion barrier layer is formed on a semiconductor substrate on which an insulating layer having a contact hole has been formed. A first metal layer is formed on the diffusion barrier layer filling the contact hole, and the first metal layer is etched back to a predetermined depth to expose a void in the first metal layer, if any, thereby forming a first sub-plug. A second metal layer is formed on the semiconductor substrate on which the first sub-plug has been formed. The second metal layer is polished so as to expose the top surface of the diffusion barrier layer on the insulating layer. As a result, a second sub-plug in the contact hole is formed. Therefore, a contact plug comprising the first and second sub-plugs and having strong resistance to particles generated in chemical and mechanical polishing (CMP) has been formed in the contact hole without a void or crack.