Abstract: Disclosed herein is a multi-step authentication-based electronic payment method using a mobile terminal. Order request information of a product is sequentially transmitted to an affiliated store server and a PG company server, and the product and a relevant affiliated store are verified. A mobile communication company server primarily authenticates the user, and the PG company server generates an OTP. The OTP is transmitted to allow the PG company server to secondarily authenticate the user using the OTP. The affiliated store server requests the PG company server to confirm information about a payment for the product and information about authentication of the user, and the PG company server confirms payment and authentication information. The affiliated store server requests the PG company server to process payment for the product, the PG company server requests the mobile communication company server to process payment, and the mobile communication company server processes requested payment.

Abstract: Disclosed herein is a multi-step authentication-based electronic payment method using a mobile terminal. Order request information of a product is sequentially transmitted to an affiliated store server and a PG company server, and the product and a relevant affiliated store are verified. A mobile communication company server primarily authenticates the user, and the PG company server generates an OTP. The OTP is transmitted to allow the PG company server to secondarily authenticate the user using the OTP. The affiliated store server requests the PG company server to confirm information about a payment for the product and to information about authentication of the user, and the PG company server confirms payment and authentication information. The affiliated store server requests the PG company server to process payment for the product, the PG company server requests the mobile communication company server to process payment, and the mobile communication company server processes requested payment.

Abstract: A semiconductor package includes a substrate having a plurality of through holes for interconnecting electrically conductive traces formed on upper and lower surfaces of the substrate. The through holes are classified into a first set of through holes and a second set of through holes. The second set of through holes is located exterior of the first set of through holes, and surrounds the first set of through holes. A die is mounted on the upper surface of the substrate and is connected electrically to the first set of through holes. A metal shield is disposed on the substrate for enclosing the die therein and is connected electrically to the second set of through holes. A molding resin encapsulates the metal shield, the die on the substrate and fills a gap confined between the metal shield and the die.