Abstract: A mesh electrode, a sensing device and an electrode layer are provided, in which the sensing device includes the mesh electrode. The mesh electrode is formed by a plurality of grid lines intersecting and connected to each other. The grid line has a bottom surface and a cross-section, and the cross-section is perpendicular to the bottom surface and has at least one curved portion. The electrode layer includes a plurality of conducting lines. The conducting lines have at least three line widths or at least three spaces. An appearing probability of each line width may be identical in the electrode layer. An appearing probability of each space may be identical in the electrode layer. The conducting line has a bottom surface and a cross-section, and the cross-section is perpendicular to the bottom surface and has at least one curved portion.

Abstract: In one embodiment, a conductive line structure includes a substrate and a plurality of conductive lines thereon. The substrate has a first area and a second area, and the two areas are separated by at least one borderline. The plurality of conductive lines are disposed at the first area and the second area of the substrate, respectively. The at least one borderline may be a straight line, and the conductive lines disposed at the second area are inclined relative to the at least one borderline. A sensing device using the conductive line structure is also provided.

Abstract: A sensing structure includes a sensing unit, a periphery circuit, and a connecting circuit. The connecting circuit connecting the sensing unit and the periphery circuit includes a connecting pattern. In an embodiment, the connecting pattern has at least two line widths. The line width of a part of the connecting pattern connecting the periphery circuit is greater than the line width of a part of the connecting pattern connecting the sensing unit. In an embodiment, the connecting pattern includes a mesh pattern having at least two mesh densities. The mesh density of a part of the mesh pattern connecting the periphery circuit is greater than the mesh density of a part of the mesh pattern connecting the sensing unit. In an embodiment, the connecting circuit includes lines between and connecting a single sensing series of the sensing unit and a periphery wire of the periphery circuit.

Abstract: A touch panel and a manufacturing method thereof and a touch display panel are provided. The touch panel includes a substrate, at least one first conductive line, an insulating layer, and at least one second conductive line. The substrate has a sensing region and a periphery region. The first conductive line is disposed on the periphery region. The insulating layer is disposed on the periphery region and covers the first conductive line. The second conductive line is disposed on the periphery region. The first conductive line and the second conductive line are electrically insulated to each other. A portion of at least one second conductive line is disposed on the insulating layer located above the first conductive line.

Abstract: A gravure printing system is provided. The gravure printing system includes a plate cylinder, an ink source, a cover blade, and a doctor blade. The plate cylinder has a circumferential surface with at least one groove. The ink source is adapted to provider an ink onto the circumferential surface of the plate cylinder. The cover blade is adapted to form an anti-drying layer on the plate cylinder from the ink. The doctor blade is adapted to contact the plate cylinder and fill the at least one groove with the ink. A point on the circumferential surface sequentially passes by the ink source, the cover blade, and the doctor blade as the plate cylinder rotates. A Young's modulus of a material of the cover blade is less than a Young's modulus of a material of the doctor blade. A method of using the gravure printing system is also provided.

Abstract: A touch panel structure includes a transparent substrate having a touch area and a frame wire area, X conductive electrodes, Y conductive electrodes, X conductive connecting sections connecting the X conductive electrodes along a first direction, frame wires, insulated layers and Y conductive connecting bridges on the insulated layers. The X and Y conductive electrodes are respectively arranged in an array in the touch area and interlaced with each other. The X and Y conductive electrodes are electrically connected to an external circuit via the frame wires. The insulated layers each cover one of the X conductive electrodes and two of the Y conductive electrodes. The Y conductive electrodes are electrically connected to each other via the Y conductive connecting bridges along a second direction. A conducting material is performed by one-time printing to pattern the X and Y conductive electrodes, X conductive connecting sections and frame wires.

Abstract: An illumination device includes an OLED panel, an electrode structure, and a control module. The OLED panel includes a light-emitting layer configured to emit a light beam. The electrode structure is overlaid on the OLED panel. The electrode structure includes a first touch electrode including at least two conductive portions, and the conductive portions of the first touch electrode are electrically connected to the other conductive portions. The control module is electrically connected to the OLED panel and the first touch electrode. The light-emitting layer further includes a light-emitting material, and a width of the light-emitting material is greater than half of a width of the first touch electrode.

Abstract: In one embodiment, a touch panel includes a substrate, a plurality of first and second sensing units, a plurality of wirings, a touch circuit unit, and at least one impedance adjustment means. The substrate has an active area and a peripheral area. The sensing units are disposed in the active area. The wirings are disposed in the peripheral area. The first sensing units and the plurality of wirings form first sensing channels, and the second sensing units and the plurality of wirings form second sensing channels. Impedances corresponding to the first or the second sensing channels are adjusted to substantially approximate a consistent impedance by using the impedance adjustment means.

Abstract: In one embodiment, a conductive line structure includes a substrate and a plurality of conductive lines thereon. The substrate has a first area and a second area, and the two areas are separated by at least one borderline. The plurality of conductive lines are disposed at the first area and the second area of the substrate, respectively. The at least one borderline may be a straight line, and the conductive lines disposed at the second area are inclined relative to the at least one borderline. A sensing device using the conductive line structure is also provided.

Abstract: A mesh electrode, a sensing device and an electrode layer are provided, in which the sensing device includes the mesh electrode. The mesh electrode is formed by a plurality of grid lines intersecting and connected to each other. The grid line has a bottom surface and a cross-section, and the cross-section is perpendicular to the bottom surface and has at least one curved portion. The electrode layer includes a plurality of conducting lines. The conducting lines have at least three line widths or at least three spaces. An appearing probability of each line width may be identical in the electrode layer. An appearing probability of each space may be identical in the electrode layer. The conducting line has a bottom surface and a cross-section, and the cross-section is perpendicular to the bottom surface and has at least one curved portion.

Abstract: Disclosed is a sensing structure including a sensing unit, a periphery circuit, and a connecting circuit. The connecting circuit connecting the sensing unit and the periphery circuit includes a connecting pattern. In an embodiment, the connecting pattern has at least two line widths. The line width of a part of the connecting pattern connecting the periphery circuit is greater than the line width of a part of the connecting pattern connecting the sensing unit. In an embodiment, the connecting pattern includes a mesh pattern having at least two mesh densities. The mesh density of a part of the mesh pattern connecting the periphery circuit is greater than the mesh density of a part of the mesh pattern connecting the sensing unit. In an embodiment, the connecting circuit includes lines between and connecting a single sensing series of the sensing unit and a periphery wire of the periphery circuit.

Abstract: An illumination device including a light-emitting panel, a touch panel, and a control module is provided. The light-emitting panel includes a light-emitting layer configured to emit a light beam. The touch panel is overlaid on the light-emitting panel, and includes a first touch electrode. The control module is electrically connected to the light-emitting panel and the touch panel. The light-emitting layer further includes a light-emitting material, and the width of the light-emitting material is greater than half of the width of the first touch electrode.

Abstract: An illumination device includes an OLED panel, an electrode structure, and a control module. The OLED panel includes a light-emitting layer configured to emit a light beam. The electrode structure is overlaid on the OLED panel. The electrode structure includes a first touch electrode including at least two conductive portions, and the conductive portions of the first touch electrode are electrically connected to the other conductive portions. The control module is electrically connected to the OLED panel and the first touch electrode. The light-emitting layer further includes a light-emitting material, and a width of the light-emitting material is greater than half of a width of the first touch electrode.

Abstract: A chip stack structure taking a wafer as a stacking base and stacking chips thereon is provided. The chip stack structure is capable of achieving high density electrode bonding and breaking the bottleneck of requiring interposer to serve as a transferring interface in three dimensional chip package. The chip stack structure is easily fabricated and compatible with wafer level process, so as to reduce processing time and manufacturing cost. A method for fabricating the chip stack structure is also provided.

Abstract: A touch panel structure includes a transparent substrate having a touch area and a frame wire area, X conductive electrodes, Y conductive electrodes, X conductive connecting sections connecting the X conductive electrodes along a first direction, frame wires, insulated layers and Y conductive connecting bridges on the insulated layers. The X and Y conductive electrodes are respectively arranged in an array in the touch area and interlaced with each other. The X and Y conductive electrodes are electrically connected to an external circuit via the frame wires. The insulated layers each cover one of the X conductive electrodes and two of the Y conductive electrodes. The Y conductive electrodes are electrically connected to each other via the Y conductive connecting bridges along a second direction. A conducting material is performed by one-time printing to pattern the X and Y conductive electrodes, X conductive connecting sections and frame wires.

Abstract: A touch structure and a manufacturing method for the same are provided. The touch structure comprises first patterned electrodes, a second patterned electrode, a dielectric structure and a conductive bridge. The second patterned electrode is disposed between the first patterned electrodes, and separated from the first patterned electrodes. The dielectric structure is disposed on the first patterned electrodes and the second patterned electrode. The dielectric structure has a dielectric opening. The conductive bridge is disposed across the dielectric structure and extended in the dielectric opening. The first patterned electrodes are electrically connected to each other through the conductive bridge.

Abstract: An illumination device including a light-emitting panel, a touch panel, and a control module is provided. The light-emitting panel includes a light-emitting layer configured to emit a light beam. The touch panel is overlaid on the light-emitting panel, and includes a first ouch electrode. The control module is electrically connected to the light-emitting panel and the touch panel. The light-emitting layer further includes a light-emitting material, and the width of the light-emitting material is greater than half of the width of the first touch electrode.

Abstract: A touch panel and a manufacturing method thereof and a touch display panel are provided. The touch panel includes a substrate, at least one first conductive line, an insulating layer, and at least one second conductive line. The substrate has a sensing region and a periphery region. The first conductive line is disposed on the periphery region. The insulating layer is disposed on the periphery region and covers the first conductive line. The second conductive line is disposed on the periphery region. The first conductive line and the second conductive line are electrically insulated to each other. A portion of at least one second conductive line is disposed on the insulating layer located above the first conductive line.

Abstract: A touch structure and a manufacturing method for the same are provided. The touch structure comprises first patterned electrodes, a second patterned electrode, a dielectric structure and a conductive bridge. The second patterned electrode is disposed between the first patterned electrodes, and separated from the first patterned electrodes. The dielectric structure is disposed on the first patterned electrodes and the second patterned electrode. The dielectric structure has a dielectric opening. The conductive bridge is disposed across the dielectric structure and extended in the dielectric opening. The first patterned electrodes are electrically connected to each other through the conductive bridge.

Abstract: An electronic device comprises a substrate and a number of bump units over the substrate, wherein each of the bump units includes an electrically insulating bump-forming body extending in a first direction, and at least two conductive layers separated from each other on the electrically insulating bump-forming body, the at least two conductive layers extending in a second direction orthogonal to the first direction.