Patents by Inventor Subra Suresh

Subra Suresh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6134954
    Abstract: An indentation measurement apparatus is retrofittable onto any of a variety of load-applying frames and includes a mount for mounting an indenter of any geometry (for example blunt or sharp). The arrangement is very stiff and mechanical values including Young's modulus, strain hardening exponent, yield strength, and hardness can be obtained from a single load/unload versus displacement test. A wide variety of materials can be tested using the apparatus. An optical probe can measure displacement of the indenter head relative to a sample. A new method of calculating strain hardening directly from load/displacement measurement is presented as is a new method of calculating strain hardening exponent.
    Type: Grant
    Filed: April 15, 1996
    Date of Patent: October 24, 2000
    Assignee: Massachusetts Institute of Technology
    Inventors: Subra Suresh, Jorge Alcala, Antonios E. Giannakopoulos
  • Patent number: 5999887
    Abstract: Techniques for the determination of mechanical properties of homogenous or functionally-graded materials from indentation testing are presented. The technique is applicable to indentation on the nano-scale through the macro-scale including the geological scale. The technique involves creating a predictive load/depth relationship for a sample, providing an experimental load/depth relationship, comparing the experimental data to the predictive data, and determining a physical characteristic from the comparison.
    Type: Grant
    Filed: February 26, 1997
    Date of Patent: December 7, 1999
    Assignee: Massachusetts Institute of Technology
    Inventors: Antonios E. Giannakopoulos, Subra Suresh
  • Patent number: 5847283
    Abstract: A technique for determining properties such as Young's modulus, coefficient of thermal expansion, and residual stress of individual layers within a multi-layered sample is presented. The technique involves preparation of a series of samples, each including one additional layer relative to the preceding sample. By comparison of each sample to a preceding sample, properties of the topmost layer can be determined, and residual stress at any depth in each sample, resulting from deposition of the top layer, can be determined.
    Type: Grant
    Filed: July 3, 1996
    Date of Patent: December 8, 1998
    Assignee: Massachusetts Institute of Technology
    Inventors: Marc Finot, Olivera Kesler, Subra Suresh