Abstract: A method for manufacturing a magnetic write head that avoids the challenges associated with the formation of fence structures during write pole definition. A magnetic write pole material is deposited. A mask structure is deposited over the magnetic write pole material. The mask structure includes a first hard mask, a marker layer, a physically robust, inorganic RIEable image transfer layer, a second hard mask structure over the image transfer layer and a photoresist layer over the second hard mask. A reactive ion etching process can be used to transfer the image of the photoresist mask and second hard mask layer onto the image transfer layer. An ion milling is performed to define the write pole. A layer of non-magnetic material such as alumina is deposited. An ion milling is performed until the marker layer has been reached, and another reactive ion etching is performed to remove the remaining hard mask.

Abstract: A method for manufacturing a magnetic write head having a wrap around magnetic shield. The method allows a highly accurate short wavelength such as 193 mm photolithography to be used to accurately define the placement and critical dimension of wrap around magnetic shield. The method includes the formation of a magnetic write pole, top gap, and side gap and the deposition of a RIEable fill layer thereover, and CMP to planarization. A 193 nm photolithography and ion milling is used to form a mask over the RIEable layer and one or more reactive ion etching processes are performed to pattern the RIEable layer through 193 nm photolithography mask. A wrap around shield can then be electroplated into the opening formed in the RIEable layer.

Abstract: A method for manufacturing a magnetic write head for perpendicular magnetic recording. The method includes forming a write pole, and then depositing a refill layer. A mask structure can be formed over the writ pole and refill layer, the mask structure being configured to define a stitched pole. An ion milling or reactive ion milling can then be performed to remove portions of the refill layer that are not protected by the mask structure. Then a magnetic material can be deposited to form a stitched write pole that defines a secondary flare point. The stitched pole can also be self aligned with an electrical lapping guide in order to accurately locate the front edge of the secondary flare point relative to the air bearing surface of the write head.

Abstract: A giant magnetoresistive (GMR) head is formed to include a recess in an overcoat layer that reduces stress on the poles. The process includes depositing a seed layer over the overcoat layer prior to plating a metal mask layer with an opening where the recess is to be formed, wet chemical etching the seed layer through the opening in the mask layer and performing an ion milling process to remove any remaining traces of the seed layer. With the seed layer completely removed, a trench having smooth sidewalls and bottom is etched in the overcast layer by a reactive ion etch (RIE) process. The saw that is used to separate the head elements in the wafer can be passed through the clean trench without contacting the overcoat layer, thereby avoiding the chipping and cracking that might otherwise result from the use of a silicon dioxide or silicon nitride overcoat layer.

Abstract: A perpendicular write head for writing data onto tracks includes a main pole, a trailing shield and bilayer trailing shield gap layer between the main pole and the trailing shield and improving writing and track width control.

Abstract: A perpendicular write head includes a main pole comprising a Durimide/Alumina hard mask formed over a laminate layer process to form the main pole without using a liftoff or chemical mechanical polishing process, thereby avoiding rounding corners of the pole, the main pole being controlled in shape for improved control of critical dimension of track width and angle of the bevel to avoid undesirable adjacent track writing.

Abstract: A method for manufacturing a write pole for perpendicular magnetic recording for accurately defining a side shield throat height and write pole flare point. The method includes the formation of a magnetic structure that provides an electronic lapping guide as well as providing the structure for both the side shields and the write pole. The magnetic structure includes a write pole portion and first and second side shield portions. The side shields portions are magnetically connected with the write pole portion in a region in front of an intended air hearing surface plane (e.g. in the direction from which lapping will progress). The side shields portions are each separated from the write pole portion in a region behind the intended air bearing surface plane by notches that terminate at a desired location relative to the intended air bearing surface plane and which open up in a region behind the intended air bearing surface plane.

Abstract: A perpendicular write head including a main pole and a trailing shield, the main pole being made of a diamond-like carbon (DLC) layer as hard mask and a rhodium (Rh) layer as shield gap, both DLC and Rh layers being CMP stop layers so as to avoid corner rounding and damage from chemical mechanical planarization (CMP) process, the DLC layer being removed by reactive ion etching (RIE) to create a trench, the trailing shield being deposited into the trench for self alignment.

Abstract: A method using a CMP resistant hardmask in a process of fabricating a pole piece for a magnetic head is described. A set of layers used as the mask for milling the pole piece preferably includes a CMP resistant hardmask of silicon dioxide, a resist hardmask, an upper hardmask and a photoresist mask respectively. A multi-step reactive-ion etching (RIE) process is preferably used to sequentially remove the excess materials in the layer stack to ultimately define the multilayer mask for the pole piece. The excess pole piece material is then milled away. The wafer is then refilled with a nonmagnetic material such as alumina. A CMP liftoff is used to remove the resist hardmask. The material for the CMP resistant hardmask is selected to have a high resistance to the CMP liftoff process in comparison to the refill material. The CMP resistant hardmask is preferably then removed by a RIE process.

Abstract: A system and method are provided for manufacturing a coil structure for a magnetic head. Initially, an insulating layer is deposited with a photoresist layer deposited on the insulating layer. Moreover, a silicon dielectric layer is deposited on the photoresist layer as a hard mask. The silicon dielectric layer is then masked. A plurality of channels is subsequently formed in the silicon dielectric layer using reactive ion etching (i.e. CF4/CHF3). The silicon dielectric layer is then used as a hard mask to transfer the channel pattern in the photoresist layer using reactive ion etching with, for example, H2/N2/CH3F/C2H4 reducing chemistry. To obtain an optimal channel profile with the desired high aspect ratio, channel formation includes a first segment defining a first angle and a second segment defining a second angle. Thereafter, a conductive seed layer is deposited in the channels and the channels are filled with a conductive material to define a coil structure.

Abstract: In one method and embodiment of the present invention, at least one coil layer is formed in a write head, using a two-slurry step of copper damascene chemical mechanical polishing method with a first slurry step removing the undesirable copper that is on top of the tantalum barrier layer and on top of the trenches and a second slurry step removing the remainder of the undesirable copper, the tantalum barrier layer, the silicon dioxide hard mask layer, the hard baked photoresist layer, the magnetic alloy such as NiFe, CoFe, or CoNiFe, and alumina insulating layer for better thin film magnetic head performances.

Abstract: Methods of fabricating perpendicular write elements for perpendicular magnetic recording heads are discussed. In write element fabrication, write poles are fabricated according to one of many desired methods. The write poles during fabrication are typically covered by a hard mask and a photolithographic soft mask. According to the methods described herein, the soft mask is removed such as by chemical etching. The hard mask is then removed, such as by CMP and ion etching, to expose the write poles. Shield gap material may then be deposited on the write poles to define the shield gap between the write poles and the trailing shields. Trailing shield material may then be deposited on the shield gap material to form the trailing shields corresponding with the write poles.

Abstract: A system and method are provided for manufacturing a coil structure for a magnetic head. Initially, an insulating layer is deposited with a photoresist layer deposited on the insulating layer. Moreover, a silicon dielectric layer is deposited on the photoresist layer as a hard mask. The silicon dielectric layer is then masked. A plurality of channels is subsequently formed in the silicon dielectric layer using reactive ion etching (i.e. CF4/CHF3). The silicon dielectric layer is then used as a hard mask to transfer the channel pattern in the photoresist layer using reactive ion etching with, for example, H2/N2/CH3F/C2H4 reducing chemistry. To obtain an optimal channel profile with the desired high aspect ratio, channel formation includes a first segment defining a first angle and a second segment defining a second angle. Thereafter, a conductive seed layer is deposited in the channels and the channels are filled with a conductive material to define a coil structure.

Abstract: A magnetic write head for perpendicular magnetic recording that has a write pole and a trailing or side shield that has a leading edge that extends to or beyond the leading edge of write pole, thereby ensuring complete side magnetic shielding. The write head can be formed by forming the write pole on a non-magnetic substrate that is constructed of a material that can be readily removed by reactive ion etching (RIE). The write pole can be formed by depositing a layer of magnetic write pole material over the substrate and then forming a mask over the magnetic write pole material. An ion mill can be performed to define the write pole, and then a reactive ion etch can be performed to notch the substrate, so that when a non-magnetic shield gap material is deposited it will be below or at the bottom of the write pole. Then a magnetic shield material can be deposited to form a shield having a leading edge that extends beyond the leading edge of the write pole.

Abstract: In one method and embodiment of the present invention, at least one coil layer is formed in a write head, using a two-slurry step of copper damascene chemical mechanical polishing method with a first slurry step removing the undesirable copper that is on top of the tantalum barrier layer and on top of the trenches and a second slurry step removing the remainder of the undesirable copper, the tantalum barrier layer, the silicon dioxide hard mask layer, the hard baked photoresist layer, the magnetic alloy such as NiFe, CoFe, or CoNiFe, and alumina insulating layer for better thin film magnetic head performances.

Abstract: A magnetic write head for use in a data recording system having first and second magnetic pole, the first pole having a P1 pedestal. An electrically conductive coil passes through a space between the first and second poles for inducing a magnetic flux through the yoke formed by the first and second poles. A bi-layer insulation layer disposed between the poles includes a layer of photoresist for preventing voids and a layer of alumina formed thereover to provide a structural brace to prevent recession of the P1 pedestal during manufacturing operations such as soda blast.

Abstract: A method and apparatus for defining leading edge taper of a write pole tip is disclosed. The fabrication process uses reactive ion etching to fabricate LET with tight control of the placement of LET's edge and to achieve higher angle for providing a higher effective write field at the pole tip while minimizing ATI for high-density perpendicular recording. The placement of a resist's edge is used to define the LET's edge and a CMP process is used to provide a planar surface for the fabrication of the write pole.

Abstract: A magnetoresistive read/write head having a first layer of alumina and a second layer of silicon dioxide overlaying a P3 layer of the head. In a preferred embodiment, the silicon dioxide layer is recessed away from an Air Bearing Surface (ABS) to reduce protrusion of a P2 layer and the P3 layer in the head, and to reduce degradation in the magnetic properties of the pole tips of the P2 and P3 layer ends.

Abstract: A method for fabrication of magnetic write heads for disk drives in which a P1 layer is formed having a P1 Protrusion, the P1 Protrusion having a longitudinal reference axis. A gap layer is deposited on the P1 Protrusion and a layer of fill material is deposited on the gap layer. The fill material layer is shaped to form a mold which surrounds a hollow which is aligned with the longitudinal axis of the P1 Protrusion. This hollow in the fill material layer is filled with P2 pole material to form a P2 pole which is then automatically substantially aligned with the longitudinal axis of the P1 Protrusion.

Abstract: A magnetic head having an air bearing surface (ABS) and a first pole tip. A second pole tip is spaced apart from and facing the upper end of the first pole tip across a write gap. A bump extends into a portion of the upper end of the first pole tip and a portion of the bottom end of the second pole tip, the bump being positioned away from the ABS. The bump defines a throat height of the first and second pole tips.