Abstract: A solid-state image capturing system (1) includes a solid-state image capturing device (100) and an information processing device (200). The solid-state image capturing device (100) includes a first DNN processing unit (130) that executes, on image data, a part of a DNN algorithm by a first DNN to generate a first result. The information processing device (200) includes a second DNN processing unit (230) that executes, on the first result acquired from the solid-state image capturing device, remaining of the DNN algorithm by a second DNN to generate a second result.

Abstract: A connector includes a female terminal module and a male terminal module that is to be coupled to the female terminal module. The female terminal module includes a female-side inner conductor, a female-side derivative, and a female-side outer conductor. The female-side outer conductor receives therein the female-side inner conductor via the female-side derivative. The male terminal module includes a male-side inner conductor, a male-side derivative, and a male-side outer conductor. The male-side outer conductor receives therein the male-side inner conductor via the male-side derivative and is connected to the female-side outer conductor. The female-side fitting portion of the female-side derivative and the male-side fitting portion of the male-side derivative are fitted to each other with recess-protrusion fitting. The male-side inner conductor includes a male connection portion and the male connection portion is inserted in the female-side fitting portion and connected to the female-side inner conductor.

Abstract: A liquid cartridge includes a first surface, a second surface spaced apart from the first surface, and a third surface extending between the first surface and the second surface, with a liquid outlet through the first surface. A circuit board is mounted on the third surface. A locking mechanism includes a locking surface that extends above the third surface, and a liquid detection mechanism includes a light access portion. The light access portion is disposed between the circuit board and the locking surface, and the circuit board is disposed between the first surface and the light access portion.

Abstract: A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.

Abstract: A wind power generation device includes a blade, a main shaft of which one end is connected to the blade, a speed increaser connected to the other end of the main shaft, an output shaft of which one end is connected to the speed increaser, a power generation unit connected to the other end of the output shaft, a vibration sensor, and an abnormality diagnosis unit. The power generation unit is configured to rotate the output shaft and the main shaft by performing powering operation. The abnormality diagnosis unit diagnoses the presence or absence of an abnormality based on data acquired by the vibration sensor during a period in which the power generation unit performs powering operation.

Abstract: A solid-state image capturing system (1) includes a solid-state image capturing device (100) and an information processing device (200). The solid-state image capturing device (100) includes a first DNN processing unit (130) that executes, on image data, a part of a DNN algorithm by a first DNN to generate a first result. The information processing device (200) includes a second DNN processing unit (230) that executes, on the first result acquired from the solid-state image capturing device, remaining of the DNN algorithm by a second DNN to generate a second result.

Abstract: Provided are a host-group-containing polymerizable monomer usable as a starting material for producing a macromolecular material with a high degree of freedom in material design, and excellent toughness and strength; a macromolecular material produced using the host-group-containing polymerizable monomer; and a method for producing the macromolecular material. The host-group-containing polymerizable monomer according to the present invention is a host-group-containing polymerizable monomer, and the host group is a monovalent group formed by removing one hydrogen atom or hydroxy group from a cyclodextrin derivative. The cyclodextrin derivative has such a structure that the hydrogen atom of at least one hydroxy group of a cyclodextrin is replaced with a group selected from the group consisting of a hydrocarbon group, an acyl group, and —CONHR wherein R represents a methyl group or an ethyl group.

Abstract: The present embodiment is an information processing device adapted to a non-contact user interface. The information processing device includes a display control unit configured to perform control such that a first screen is displayed on a display, a feature recognition unit configured to recognize a feature related to a specific part of a user in a spatial coordinate system, a mapping unit configured to specify a position on the first screen, the position corresponding to a position of the specific part in the spatial coordinate system, according to a mapping algorithm on the basis of the feature, an input operation specifying unit configured to specify an input operation on the basis of content of the first screen and the position on the first screen, and a processing execution unit configured to execute processing on the basis of the input operation.

Abstract: Provided is an information processing apparatus capable of further improving operability. A virtual touch panel surface that does not actually exist is set in a space in front of a display surface of a display. Then, a touch operation on the virtual touch panel surface performed by a user is detected on the basis of position information of a specific site of a body used by the user for the touch operation on the virtual touch panel surface, and processing corresponding to the detected touch operation is executed.

Abstract: A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.

Abstract: A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.

Abstract: The present embodiment is an information processing device adapted to a non-contact user interface. The information processing device includes a display control unit configured to perform control such that a first screen is displayed on a display, a feature recognition unit configured to recognize a feature related to a specific part of a user in a spatial coordinate system, a mapping unit configured to specify a position on the first screen, the position corresponding to a position of the specific part in the spatial coordinate system, according to a mapping algorithm on the basis of the feature, an input operation specifying unit configured to specify an input operation on the basis of content of the first screen and the position on the first screen, and a processing execution unit configured to execute processing on the basis of the input operation.

Abstract: The present invention is an information processing apparatus adapted to a user interface that enables non-contact operation according to a screen displayed on a display. The information processing apparatus includes an input operation identification unit that identifies predetermined input operation on the basis of a sequence of position information of a specific part of a user in a predetermined spatial coordinate system, and a processing execution unit that executes predetermined processing on the basis of identified the predetermined input operation. The input operation identification unit identifies the predetermined input operation in a case of judging, on the basis of a second sequence of the position information, that the specific part of the user is in a moving state after the specific part of the user is in a staying state at a reference position in the predetermined spatial coordinate system on the basis of a first sequence of the position information.

Abstract: A solid-state image capturing system (1) includes a solid-state image capturing device (100) and an information processing device (200). The solid-state image capturing device (100) includes a first DNN processing unit (130) that executes, on image data, a part of a DNN algorithm by a first DNN to generate a first result. The information processing device (200) includes a second DNN processing unit (230) that executes, on the first result acquired from the solid-state image capturing device, remaining of the DNN algorithm by a second DNN to generate a second result.

Abstract: A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.

Abstract: A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.

Abstract: A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.

Abstract: A glass melt production apparatus, which comprises a melting vessel, a vacuum degassing apparatus, a first conducting pipe structure connecting the melting vessel and the vacuum degassing apparatus, and a second conducting pipe structure to introduce a glass melt to a forming means, provided downstream the vacuum degassing apparatus; the vacuum degassing apparatus having an uprising pipe through which the glass melt from the melting vessel ascends, a vacuum degassing vessel, and a downfalling pipe through which the glass melt from the vacuum degassing vessel descends; the flow path of the glass melt in the uprising pipe, the vacuum degassing vessel and the downfalling pipe being made of a refractory material; the first conducting pipe structure having an upstream pit to supply the glass melt to the uprising pipe; and the second conducting pipe structure having a downstream pit containing the glass melt from the downfalling pipe; the glass melt production apparatus further comprising a third conducting pipe st

Abstract: To facilitate a preheating operation in a vacuum degassing apparatus having a flow path of a glass melt in an uprising pipe, a vacuum degassing vessel and a downfalling pipe constituted by a refractory material. Flow of a glass melt G between a melting vessel 100 and an upstream pit 210 of a first conducting pipe structure connected to a vacuum degassing vessel 320 is shut off, and in a state where the flow of the glass melt G in a by-pass 500 for the glass melt G is shut off by a first closing means 220, a combustion gas from preheating burners 530, 540 is introduced to the by-pass 500 to preheat the flow path of the glass melt G in an uprising pipe 330, the vacuum degassing vessel 320 and a downfalling pipe 340.

Abstract: It is an object of the present invention to provide a vacuum degassing apparatus configured so as to be capable of carrying out more simply exchange operation for an extension pipe made of heat-resisting metal and immersed in molten glass. The present invention includes a vacuum housing, a vacuum vessel, an introduction pipe and a discharge pipe which are assembled by a plurality of bricks, and an extension pipe connected to at least one of the introduction pipe and the discharge pipe and made of heat-resisting metal. The extension pipe is constituted by a base end portion, a body portion formed so as to be continuous to the base end portion, and a sealing flange extending from an outer peripheral side of the body portion.