Abstract: A heat radiator of a semiconductor package, the heat radiator being provided on the semiconductor package, the heat radiator contacting a thermal interface material, the heat radiator includes a line state high thermal interface material standing, in a thermally conductive direction, on a surface of the heat radiator facing the thermal interface material. Head end parts of the line state high thermal interface material are adhered to a surface of the thermal interface material.

Abstract: An optical device includes a translucent member, and a light shielding member formed on the translucent member and having a first opening. A portion of the light shielding member corresponding to a side surface of the first opening is formed into an inclined surface. A method of manufacturing the optical device includes: forming a mask having a second opening on the translucent member such that the second opening corresponds to a shape and a forming area of the light shielding member; filling a Cr-containing resin, in which particles containing Cr are contained in a resin, into the second opening by a printing method; curing the Cr-containing resin filled in the opening to form the light shielding member made of the cured Cr-containing resin; and removing the mask.