Patents by Inventor Suk-in Oh

Suk-in Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IRIDIUM ALLOY CATALYST HAVING REVERSIBLE CATALYTIC ACTIVITY AND PREPARATION METHOD THEREOF
    Publication number: 20210328229
    Abstract: Proposed is an iridium alloy catalyst having reversible catalytic activity for an oxygen evolution reaction (OER), a hydrogen evolution reaction (HER), and a hydrogen oxidation reaction (HOR) by including an iridium alloy including iridium (Ir) and nickel (Ni). The iridium alloy catalyst according to the present disclosure is rapidly converted to an iridium alloy catalyst in an oxide form and an iridium alloy catalyst in a metallic form according to applied voltage by controlling its crystallinity. Thus, even in case an oxide layer is formed after the OER, the oxidation layer disappears during the HER and HOR and the properties of an iridium metal catalyst remain, thereby maintaining HER/HOR performance.
    Type: Application
    Filed: March 10, 2021
    Publication date: October 21, 2021
    Inventors: Hyung Suk OH, Woong Hee LEE, Byoung Koun MIN, Yun Jeong HWANG, Ung LEE, Dong Ki LEE, Da Hye WON, Jai Hyun KOH
  • STRUCTURE FOR DELIVERING POWER
    Publication number: 20210329774
    Abstract: A structure for delivering power is described. In some embodiments, the structure can include conductors disposed on two or more layers. Specifically, the structure can include a first set of interdigitated conductors disposed on a first layer and oriented substantially along an expected direction of current flow. At least one conductor in the first set of interdigitated conductors may be maintained at a first voltage, and at least one conductor in the first set of interdigitated conductors may be maintained at a second voltage, wherein the second voltage is different from the first voltage. The structure may further include a conducting structure disposed on a second layer, wherein the second layer is different from the first layer, and wherein at least one conductor in the conducting structure is maintained at the first voltage.
    Type: Application
    Filed: June 28, 2021
    Publication date: October 21, 2021
    Applicant: Rambus Inc.
    Inventors: Kyung Suk Oh, Ralf M. Schmitt, Yijiong Feng
  • HYDROGEN PRODUCTION AND STORAGE SYSTEM USING SOLAR ENERGY INDEPENDENTLY OPERATED WITHOUT EXTERNAL POWER
    Publication number: 20210292917
    Abstract: Disclosed is a hydrogen production and storage system using solar energy which converts solar energy into electric energy through a solar panel, operates a water electrolysis reactor using the electric energy to produce hydrogen, and stores the hydrogen at a high pressure in a hydrogen storage tank through a water tank, a pressure control valve, etc.
    Type: Application
    Filed: September 11, 2020
    Publication date: September 23, 2021
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Ung LEE, Byoung Koun MIN, Hyun Joo LEE, Yun Jeong HWANG, Hyung Suk OH, Dong Ki LEE, Da Hye WON, Jai Hyun KOH, Dong Gu HAN
  • Film defect detection method and system
    Patent number: 11127134
    Abstract: The present specification provides a film defect detection system. The film defect detection system may comprise an image acquisition unit configured to acquire an image of a film in a manufacturing process of the film; a defect detection unit configured to detect defects in the film by analyzing the acquired image of the film, using a machine learning algorithm learned to detect a defect in advance, when receiving the acquired image of the film; and an information output unit configured to output information on the defects in the film detected by the defect detection unit.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: September 21, 2021
    Assignee: SKC CO., LTD.
    Inventors: Il Taek Hong, In Suk Oh, Hyeon Guk Kim, Kwang Seok Oh
  • SIGNAL TRANSMISSION CONNECTOR AND METHOD FOR MANUFACTURING SAME
    Publication number: 20210288446
    Abstract: The present invention relates to a signal transmission connector connected to an electronic device, for transmitting an electrical signal, and includes a signal shielding unit in which multiple conductive particles are dispersed within an elastic insulating material in order to shield an external noise signal, a plurality of signal transmission units spaced apart within the signal shielding unit in a form in which the multiple conductive particles are arranged in a thickness direction within the elastic insulating material in such a way as to be connected to terminals of an electronic device, and a plurality of insulation units each disposed to surround the signal transmission unit between the signal transmission unit and the signal shielding unit in order to insulate the plurality of signal transmission units and the signal shielding unit.
    Type: Application
    Filed: October 1, 2019
    Publication date: September 16, 2021
    Inventors: Jae Suk Oh, Kyung Sook Lim
  • PET Bottle for Efficient Recycling Comprising an Easily Removable Label and a Cap without a Retainer Ring
    Publication number: 20210276763
    Abstract: The present invention relates to a PET bottle which increases recycling rate of PET bottles, wherein the PET bottle comprises a label that assembles the cap 20 without a retainer ring 21 on to the body 10 of the PET bottle, seals from the top of the cap 20 to the upper portion of the body 10 with the one continuous label and safety seal film 50, and has vertical parallel perforated lines 51 on one portion of the sealed label and safety seal film 50. A flap 52 extends from the end of the upper end of the perforated lines 51 to assist with tearing the label. The sealed label and safety seal film 50 covers the upper portion of the body 10 in shape of an inverted funnel, such that when it is torn along the perforated lines 51, the film 50 will be separated naturally from the bottle.
    Type: Application
    Filed: July 6, 2020
    Publication date: September 9, 2021
    Inventor: Won Suk OH
  • Chip on film package and display device including the same
    Patent number: 11107743
    Abstract: A chip on film package includes; a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: August 31, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-Tae Hwang, Jae-Choon Kim, Kyung-Suk Oh, Woon-Bae Kim, Jae-Min Jung
  • PHOTOELECTRODE FOR HYDROGEN GENERATION IN SOLAR WATER SPLITTING AND MANUFACTURING METHOD THEREOF
    Publication number: 20210254225
    Abstract: Provided are a photoelectrode for hydrogen generation in solar water splitting and a manufacturing method thereof. The photoelectrode for hydrogen generation in solar water splitting, includes a light absorbing layer including a chalcopyrite compound; and a hydrogen generation catalyst including CuxS (where 0?x?2) which is present on the light absorbing layer, and may be manufactured by using a solution process which enables mass production and produce hydrogen from water using sunlight with high efficiency without using a noble metal element.
    Type: Application
    Filed: February 28, 2020
    Publication date: August 19, 2021
    Inventors: Dong Ki LEE, Byoung Koun MIN, Byungwoo KIM, Yun Jeong HWANG, Hyung-Suk OH, Ung LEE, Jai Hyun KOH
  • Structure for delivering power
    Patent number: 11083077
    Abstract: A structure for delivering power is described. In some embodiments, the structure can include conductors disposed on two or more layers. Specifically, the structure can include a first set of interdigitated conductors disposed on a first layer and oriented substantially along an expected direction of current flow. At least one conductor in the first set of interdigitated conductors may be maintained at a first voltage, and at least one conductor in the first set of interdigitated conductors may be maintained at a second voltage, wherein the second voltage is different from the first voltage. The structure may further include a conducting structure disposed on a second layer, wherein the second layer is different from the first layer, and wherein at least one conductor in the conducting structure is maintained at the first voltage.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: August 3, 2021
    Assignee: Rambus Inc.
    Inventors: Kyung Suk Oh, Ralf M. Schmitt, Yijiong Feng
  • Driving device of washing machine
    Patent number: 11072880
    Abstract: A driving device for a washing machine includes a motor comprising a stator and a rotor configured to rotate inside the stator, a shaft configured to receive torque of the motor and rotate an inner tub of the washing machine, a planetary gear located at a front end of the shaft and configured to adjust a rotation speed of the inner tub by changing the torque of the motor at a preset reduction gear ratio, and an electronic clutch located between the shaft and the planetary gear and configured to operate to adjust connection and disconnection between the shaft and the planetary gear according to an operation mode change signal of the washing machine.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: July 27, 2021
    Assignee: LG Electronics Inc.
    Inventors: Hyoung Uk Nam, Seung-Suk Oh, Jin Hong
  • On-Die Termination of Address and Command Signals
    Publication number: 20210225417
    Abstract: A system has a plurality of memory devices arranged in a fly-by topology, each having on-die termination (ODT) circuitry for connecting to an address and control (RQ) bus. The ODT circuitry of each memory device includes a set of one or more control registers for controlling on-die termination of one or more signal lines of the RQ bus. A memory controller sends register values, for storage in a plurality of registers of a respective memory device. The register values include register values that represent one or more impedance values of on-die termination (ODT) impedances to apply to the respective inputs of the respective memory device that receive the CA signals, and one or more register values to selectively enable application of a chip select ODT impedance to the chip select input of the respective memory device.
    Type: Application
    Filed: April 5, 2021
    Publication date: July 22, 2021
    Inventors: Ian Shaeffer, Kyung Suk Oh
  • Receiver with clock recovery circuit and adaptive sample and equalizer timing
    Patent number: 11063791
    Abstract: A receiver is equipped with an adaptive phase-offset controller and associated timing-calibration circuitry that together shift the timing for a data sampler and a digital equalizer. The sample and equalizer timing is shifted to a position with less residual inter-symbol interference (ISI) energy relative to the current symbol. The shifted position may be calculated using a measure of signal quality, such as a receiver bit-error rate or a comparison of filter-tap values, to optimize the timing of data recovery.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: July 13, 2021
    Assignee: Rambus Inc.
    Inventors: Qi Lin, Brian Leibowitz, Hae-Chang Lee, Jihong Ren, Kyung Suk Oh, Jared L. Zerbe
  • SEMICONDUCTOR PACKAGE FOR DISCHARGING HEAT GENERATED BY SEMICONDUCTOR CHIP
    Publication number: 20210202352
    Abstract: Disclosed is a semiconductor package comprising a package substrate, a first semiconductor chip on the package substrate and including a first region and a second region, a second semiconductor chip on the first region, a heat radiation spacer on the second region, a third semiconductor chip supported by the second semiconductor chip and the heat radiation spacer, and a molding layer covering the first to third semiconductor chips and the heat radiation spacer.
    Type: Application
    Filed: March 16, 2021
    Publication date: July 1, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hyunki KIM, Sangsoo KIM, Seung Hwan KIM, Kyung Suk OH, Yongkwan LEE, Jongho LEE
  • IN-WHEEL MOTOR
    Publication number: 20210178893
    Abstract: According to an embodiment of the present disclosure, provided is a high-output, high-torque in-wheel motor having a power line-taken-out structure. According to an embodiment of the present disclosure, the in-wheel motor includes a circular rim; a shaft connected to the rim through a center of the rim; a motor assembly including a stator connected to the shaft in the rim and a rotor surrounding the stator and rotated about the stator; a cover coupled to an opening of the rim to block the motor assembly from an outside of the rim; and a bearing contacting and configured to support the shaft. The shaft includes a first shaft body passing through a center of each of the rim and the cover and extending outward; and a second shaft body having a larger diameter than a diameter of the first shaft body and disposed between the stator and the bearing.
    Type: Application
    Filed: November 9, 2020
    Publication date: June 17, 2021
    Inventors: Haerim YANG, Seung-Suk OH, Yeongjae KIM
  • SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
    Publication number: 20210175199
    Abstract: A semiconductor package includes a substrate, a die stack on the substrate, and connection terminals between the substrate and the die stack. The die stack includes a first die having a first active surface facing the substrate, the first die including first through electrodes vertically penetrating the first die, a second die on the first die and having a second active surface, the second die including second through electrodes vertically penetrating the second die, and a third die on the second die and having a third active surface facing the substrate. The second active surface of the second die is in direct contact with one of the first or third active surfaces.
    Type: Application
    Filed: July 31, 2020
    Publication date: June 10, 2021
    Inventors: Eunseok Song, Kyung Suk Oh
  • Standard cell for removing routing interference between adjacent pins and device including the same
    Patent number: 11031385
    Abstract: An integrated circuit including a first standard cell including, first transistors, the first transistors being first unfolded transistors, a first metal pin, a second metal pin, and a third metal pin on a first layer, the first metal pin and the second metal pin having a first minimum metal center-to-metal center pitch therebetween less than or equal to 80 nm, a fourth metal pin and a fifth metal pin at a second layer, the fourth metal pin and the fifth metal pin extending in a second direction, the second direction being perpendicular to the first direction, a first via between the first metal pin and the fourth metal pin, and a second via between the third metal pin and the fifth metal pin such that a first via center-to-via center space between the first via and the second via is greater than double the first minimum metal center-to-metal center pitch.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: June 8, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Woo Seo, Jin Tae Kim, Tae Joong Song, Hyoung-Suk Oh, Keun Ho Lee, Dal Hee Lee, Sung We Cho
  • SEMICONDUCTOR PACKAGE
    Publication number: 20210167040
    Abstract: Disclosed is a semiconductor package comprising a first memory chip including a first semiconductor substrate and a first through structure that penetrates the first semiconductor substrate, a second memory chip that directly contacts a top surface of the first memory chip and includes a second semiconductor substrate and a second through structure that penetrates the second semiconductor substrate, a first dummy chip that directly contacts a top surface of the second memory chip and includes a first conductive via, a second dummy chip that directly contacts a top surface of the first dummy chip and includes a second conductive via, and a logic chip in direct contact with a top surface of the second dummy chip. The logic chip is electrically connected to the first through structure through the second conductive via, the first conductive via, and the second through structure.
    Type: Application
    Filed: June 19, 2020
    Publication date: June 3, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: SE-HO YOU, KYUNG SUK OH, SUNKYOUNG SEO
  • INFOTAINMENT SYSTEM FOR EMERGENCY RESCUE REQUEST NOTIFICATION AND METHOD THEREOF
    Publication number: 20210160676
    Abstract: An emergency rescue request notification method using an infotainment system and a system therefor are provided. The emergency rescue request notification method in the vehicle includes detecting an accident of the vehicle, collecting information corresponding to the detected accident, generating an emergency rescue request message based on the collected information, searching for an FM radio channel with the highest receive sensitivity, changing and transmitting a program type of the found FM radio channel to a specific value using an FM radio data system (RDS) message, and transmitting the emergency rescue request message over the found FM radio channel.
    Type: Application
    Filed: September 23, 2020
    Publication date: May 27, 2021
    Inventor: Hyung Suk Oh
  • Image sensor
    Patent number: 11018173
    Abstract: An image sensor including: a semiconductor substrate having a first region and a second region; an isolation region filling an isolation trench that partially penetrates the semiconductor substrate; a plurality of photoelectric conversion regions defined by the isolation region and forming a first hexagonal array on a plane that is parallel to a surface of the semiconductor substrate; and a plurality of microlenses respectively corresponding to the plurality of photoelectric conversion regions, and forming a second hexagonal array on the plane that is parallel to the surface of the semiconductor substrate.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: May 25, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-hwang Kim, Kyung-suk Oh
  • Semiconductor device having a plurality of fins and method of fabricating the same
    Patent number: 10991692
    Abstract: A semiconductor device comprises a first fin-type pattern comprising a first long side extending in a first direction, and a first short side extending in a second direction. A second fin-type pattern is arranged substantially parallel to the first fin-type pattern. A first gate electrode intersects the first fin-type pattern and the second fin-type pattern. The second fin-type pattern comprises a protrusion portion that protrudes beyond the first short side of the first fin-type pattern. The first gate electrode overlaps with an end portion of the first fin-type pattern that comprises the first short side of the first fin-type pattern. At least part of a first sidewall of the first fin-type pattern that defines the first short side of the first fin-type pattern is defined by a first trench having a first depth. The first trench directly adjoins a second trench having a second, greater, depth.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: April 27, 2021
    Inventors: Myoung Ho Kang, Gyeongseop Kim, Jeong Lim Kim, Jae Myoung Lee, Heung Suk Oh, Yeon Hwa Lim, Joong Won Jeon, Sung Min Kim