Abstract: An electronic device includes a controller and a semiconductor device. The controller outputs a clock signal and a command signal having a first setting combination or a second setting combination and receives a temperature information signal. The semiconductor device compares an input time of a latch signal generated based on the command signal having the first setting combination with an input time of a temperature output control signal generated internally. In addition, the semiconductor device updates a temperature code according a comparison result of the input times of the temperature output control signal and the latch signal to generate the temperature information signal.

Abstract: Provided are a hot-dip zinc plated steel material and a method for preparing same, the hot-dip zinc plated steel material comprising: base iron comprising 0.01-1.6 wt % of Si and 1.2-3.1 wt % of Mn; a Zn—Al—Mg alloy plating layer; and an Al-rich layer formed on the interface of the base iron and Zn—Al—Mg alloy plating layer, wherein the rate of occupied surface area of the Al-rich layer is 70% or higher (including 100%).

Abstract: An electronic device includes a circuit board, a semiconductor device package mounted on the circuit board, the semiconductor device package including a package substrate connected to the circuit board, a first semiconductor device and a second semiconductor device mounted side by side on the package substrate, and a molding surrounding a sidewall of the first semiconductor device and a sidewall of the second semiconductor device, the molding not covering a top surface of the first semiconductor device, and a heat dissipation structure on the semiconductor device package, the top surface of the first semiconductor device being in contact with the heat dissipation structure.

Abstract: Disclosed is a method of manufacturing an antibacterial cover window. The method includes a first step of preparing a substrate, a second step of forming a mask pattern on the substrate through a patterning process, a third step of forming an antibacterial layer on the substrate on which the mask pattern is formed, and a fourth step of removing the mask pattern to obtain an antibacterial pattern formed on the substrate. Through the method, it is possible to produce a cover window with antibacterial patterns regularly and uniformly distributed over the entire area thereof. Thus, the cover window has long-lasting excellent antibacterial property over the entire area thereof.

Abstract: Disclosed is an antibacterial flexible cover window formed using an antibacterial coating composition containing antibacterial nanoparticles dispersed in a resin coating solution. In the antibacterial coating composition, 0.001 to 0.5 parts by weight of the antibacterial nanoparticles are dispersed in 100 parts by weight of the resin coating solution. The antibacterial flexible cover window includes an antibacterial layer that is formed by applying the antibacterial coating composition to a glass substrate. Therefore, the antibacterial flexible cover window exhibits a good and long-lasting antibacterial activity.

Abstract: An electronic device includes a display for detecting touch input, and at least one processor for recognizing a type of an auxiliary input device placed on the display. A method for utilizing the electronic device includes detecting via a touch screen a type of an auxiliary input device placed on a display based on a configuration of at least one or more conductors on the auxiliary input device, detecting an input event generated by the auxiliary input device, and executing via a processor at least one function of an executing program corresponding to the detected input event.

Abstract: In the present invention, two adjacent supply lines for supplying two immiscible fluids are spirally disposed on a substrate where microchannels for microsphere production based on a droplet-based highly controlled method for mass-production of microspheres (HCMMM) are formed, and microsphere forming parts each comprising microchannels are arranged between and along the two supply lines, whereby a much larger amount of microspheres can be produced. Further, the two supply lines are disposed in a spiral configuration, and the microsphere forming parts can be disposed by branching microchannels from the two supply lines on inner and outer sides of the spiral configuration, whereby the limited space on a wafer normally having a circular shape can be maximally used to form multiple microsphere forming parts.

Abstract: The inventive concept relates to a substrate treating apparatus, and may include a substrate treating apparatus includes a rotatable spin head, a cup that surrounds the spin head, a cleaning jig seated on the spin head, and that discharges a cleaning liquid toward the cup through rotation of the spin head, and a nozzle unit located at an upper portion of the cleaning jig and that supplies the cleaning liquid to a center of an upper surface of the cleaning jig, and the cleaning jig includes spattering guide grooves formed to be recessed such that the cleaning liquid provided from the nozzle unit spatters toward the cup with a centrifugal force due to the rotation of the spin head.

Abstract: The present disclosure provides: an in-wheel motor driving device, which is improved so as to enable impact transmitted from the road during traveling to be buffered; and a movement device including the same. The in-wheel motor driving device, according to the present invention, comprises: a wheel including an in-wheel; an in-wheel motor provided inside the rim and rotating the rim; a supporting portion provided at the side surface of the in-wheel motor, and having the movement device connected at one side thereof; and a buffer provided between the in-wheel motor and the supporting portion so as to buffer the impact generated during vertical movement.

Abstract: A semiconductor package includes a substrate, an interposer on the substrate, a semiconductor chip stack on the interposer, a silicon capacitor layer on the interposer, a first semiconductor chip on the silicon capacitor layer, and a molding layer at least partially surrounding side surfaces of the semiconductor chip stack, the silicon capacitor layer and the first semiconductor chip. The semiconductor chip stack and the first semiconductor chip are laterally spaced apart from each other. A top surface of the first semiconductor chip is coplanar with a top surface of the molding layer and a top surface of the semiconductor chip stack.

Abstract: An inspection system for a semiconductor package includes an inspection apparatus that includes a stage on which the semiconductor package is loaded, and a computer coupled to the inspection apparatus. The semiconductor package may include a first semiconductor chip and a second semiconductor chip on the first semiconductor chip, the computer may provide first identification information about the first semiconductor chip and second identification information about the second semiconductor chip, and the computer may control the inspection apparatus to selectively perform a package test process on one of the first and second semiconductor chips, the one of the first and second semiconductor chips being identified as a good chip based on the first identification information and the second identification information.

Abstract: According to an embodiment of the present invention, a method for forming a thin film includes loading an object to be processed into a chamber, and while controlling the temperature of the object to be processed to be 400° C. or less, supplying an Si source gas and an oxidizing gas into the chamber to form a silicon oxide film on the surface of the object to be processed, wherein the oxidizing gas is heated to a temperature exceeding 400° C. before being supplied into the chamber.

Abstract: Zn alloy plated steel material having excellent weldability and processed-part corrosion resistance and a method for production of Zn alloy plated steel material are provided. In the Zn alloy plated steel material comprising base steel material and a Zn alloy plating layer, the Zn alloy plating layer includes, by wt %, Al: 0.1-5.0%, Mg: 0.1-5.0%, as well as a remainder of Zn and inevitable impurities. The Zn alloy plated steel material includes a lower interface layer and an upper interface layer between the base steel material and the Zn alloy plating layer, wherein the lower interface layer is formed on the base steel material and has a dense structure, and the upper interface layer is formed on the lower interface layer and has a network-type or island-type structure.

Abstract: A semiconductor package including a first package including a memory chip having a memory cell, and a capacitor structure disposed independently of the memory chip; and a second package including a logic chip configured to access the memory cell, wherein the capacitor structure is electrically connected to the memory chip and the logic chip.

Abstract: A memory device comprising a programmable command-and-address (CA) interface and/or a programmable data interface is described. In an operational mode, two or more CA interfaces may be active. In another operational mode, at least one, but not all, CA interfaces may be active. In an operational mode, all of the data interfaces may be active. In another operational mode, at least one, but not all, data interfaces may be active. The memory device can include circuitry to select: an operational mode; a sub-mode within an operational mode; one or more CA interfaces as the active CA interface(s); a main CA interface from multiple active CA interfaces; and/or one or more data interfaces as the active data interfaces. The circuitry may perform these selection(s) based on one or more bits in one or more registers and/or one or more signals received on one or more pins.

Abstract: A chip on film package includes: a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.

Abstract: A semiconductor package may include a first semiconductor chip on and electrically connected to a wiring substrate, an intermediate layer on the first semiconductor chip and covering an entire surface of the first semiconductor chip, a second semiconductor chip on the intermediate layer and electrically connected to the wiring substrate, a mold layer on the wiring substrate and covering the first semiconductor chip and the second semiconductor chip, the mold layer including one or more inner surfaces defining a mold via hole that exposes a portion of a surface of the intermediate layer, an electromagnetic shielding layer on the one or more inner surfaces of the mold layer and further on one or more outer surfaces of the mold layer, and a thermal discharge layer on the electromagnetic shielding layer in the mold via hole, such that the thermal discharge layer fills the mold via hole.

Abstract: An emergency rescue request notification method using an infotainment system and a system therefor are provided. The emergency rescue request notification method in the vehicle includes detecting an accident of the vehicle, collecting information corresponding to the detected accident, generating an emergency rescue request message based on the collected information, searching for an FM radio channel with the highest receive sensitivity, changing and transmitting a program type of the found FM radio channel to a specific value using an FM radio data system (RDS) message, and transmitting the emergency rescue request message over the found FM radio channel.

Abstract: A semiconductor package includes a first redistribution substrate, a first semiconductor chip mounted on the first redistribution substrate, a second semiconductor chip disposed on a top surface of the first semiconductor chip, an insulating layer surrounding the first and second semiconductor chips on the first redistribution substrate, a second redistribution substrate disposed on the second semiconductor chip and on which the second semiconductor chip is mounted, and a connection terminal disposed at a side of the first and second semiconductor chips and connected to the first and second redistribution substrates. An inactive surface of the second semiconductor chip is in contact with an inactive surface of the first semiconductor chip. At an interface of the first and second semiconductor chips, an upper portion of the first semiconductor chip and a lower portion of the second semiconductor chip constitute one body formed of a same material.

Abstract: An electronic device includes a display for detecting touch input, and at least one processor for recognizing a type of an auxiliary input device placed on the display. A method for utilizing the electronic device includes detecting via a touch screen a type of an auxiliary input device placed on a display based on a configuration of at least one or more conductors on the auxiliary input device, detecting an input event generated by the auxiliary input device, and executing via a processor at least one function of an executing program corresponding to the detected input event.