Abstract: The present disclosure relates to a composition for treating anxiety disorder, particularly to a pharmaceutical composition comprising N-acetyl-L-cysteine or its derivatives for treating anxiety disorder such as post traumatic stress disorder or phobia. In accordance with the present disclosure, N-acetyl-L-cysteine can block the renewal of fear memories for a sustained period of time when it was administered during or after an exposure therapy to treat post traumatic stress disorder or phobia.

Abstract: An apparatus and method for automatically detecting a malicious link. The apparatus includes a threat information collection unit, a priority management unit, a malicious link collection unit, a malicious link analysis unit, and a malicious link tracking unit. The threat information collection unit collects threat information, and identifies whether a malicious link is present in each target site. The priority management unit determines the priorities of the target sites, and performs the assignment and management of the target sites in order to collect and analyze a malicious link. The malicious link collection unit collects the uniform resource locator (URL) of the malicious link from the target sites. The malicious link analysis unit analyzes a call correlation based on the collected URL, and analyzes the malicious link through pattern matching. The malicious link tracking unit tracks the real-time changing state of the malicious link.

Abstract: Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (PCB), mounting the die in a flip chip manner on the PCB such that a bump of the die faces the pad of the PCB, and bonding the bump of the die to the pad of the PCB using the flux may be provided.

Abstract: The present disclosure relates to an active diesel particulate filter (DPF) regeneration system of an engine, and more particularly, to an active DPF regeneration system and method, in which a non-work load is arbitrarily provided to the engine to quickly perform an active DPF regeneration even in a state where substantial work of a construction machine is stopped.

Abstract: An indexing apparatus and method for search of security monitoring data are provided. The indexing apparatus includes a data collection unit and a data index generation unit. The data collection unit collects data, that is, a basis of search of monitoring information, from a database in which security monitoring data has been stored. The data index generation unit generates file structure-based data in which indices have assigned to multiple search elements of the data collected by the data collection unit.

Abstract: Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (PCB), mounting the die in a flip chip manner on the PCB such that a bump of the die faces the pad of the PCB, and bonding the bump of the die to the pad of the PCB using the flux may be provided.

Abstract: The present disclosure relates to an active diesel particulate filter (DPF) regeneration system of an engine, and more particularly, to an active DPF regeneration system and method, in which a non-work load is arbitrarily provided to the engine to quickly perform an active DPF regeneration even in a state where substantial work of a construction machine is stopped.

Abstract: In forming a pattern on a substrate with reduced pattern error using a mold having an area smaller than an area of the substrate, a first resin pattern is formed on at least a first of a plurality of regions of an etching object layer by imprinting resin applied to the etching object layer using a first mold The etching object layer is then etched using the first resin pattern as an etching mask. A second resin pattern is formed on at least a second of the plurality of regions by imprinting resin applied to the etching object layer using a second mold. The etching object layer is again etched using the second resin pattern as an etching mask.

Abstract: The present disclosure relates to a composition for treating anxiety disorder, particularly to a pharmaceutical composition comprising N-acetyl-L-cysteine or its derivatives for treating anxiety disorder such as post traumatic stress disorder or phobia. In accordance with the present disclosure, N-acetyl-L-cysteine can block the renewal of fear memories for a sustained period of time when it was administered during or after an exposure therapy to treat post traumatic stress disorder or phobia.

Abstract: Method of manufacturing printed circuit board, including: providing a substrate including a first circuit layer having a lower land of a via; forming an insulating layer on the first circuit layer; forming a via hole in the insulating layer; filling the via hole with a first metal, thus forming a via; forming a seed layer with a second metal on the insulating layer and an exposed surface of the via; applying a resist film on the seed layer, and forming a resist pattern having an opening for a second circuit layer with a width formed on the via being smaller than a width of the via; plating a circuit region defined by the opening with a third metal, thus forming a plating layer formed of the third metal; and removing the resist film, and selectively removing an exposed portion of the seed layer, thus forming a second circuit layer.

Abstract: Disclosed are a carrier substrate including an insulating base material with a copper foil layer formed on at least one surface thereof, a metal layer formed on the copper layer and having a length shorter than that of the copper foil layer, and an insulating layer formed on the metal layer, a fabrication method thereof, a printed circuit board (PCB) using the same, and a fabrication method thereof. Because there is no land at the via and core in the substrate, because a circuit pattern connected with the via can be formed to be finer, so the circuit pattern can be highly integrated and the substrate can become thinner. Thus, a printed circuit board (PCB) having a smaller size and reduced number of layers can be fabricated.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board that simultaneously forms a via and an embedding land and thus improves the matching value of the via and the embedding land to secure interlayer conduction reliability, and further simultaneously forms the via and the embedding land to reduce manufacturing costs. In addition, the embedding land is formed to be embedded in the second insulating layer to implement high-density/high-integration of the printed circuit board and a via is formed in less time as compared to a method of forming a via hole using laser to reduce a process time.

Abstract: Method of manufacturing printed circuit board, including: providing a substrate including a first circuit layer having a lower land of a via; forming an insulating layer on the first circuit layer; forming a via hole in the insulating layer; filling the via hole with a first metal, thus forming a via; forming a seed layer with a second metal on the insulating layer and an exposed surface of the via; applying a resist film on the seed layer, and forming a resist pattern having an opening for a second circuit layer with a width formed on the via being smaller than a width of the via; plating a circuit region defined by the opening with a third metal, thus forming a plating layer formed of the third metal; and removing the resist film, and selectively removing an exposed portion of the seed layer, thus forming a second circuit layer.

Abstract: A method of manufacturing a printed circuit board including: preparing a first double-sided substrate including a first insulating layer, a first lower copper layer, a second circuit layer including a first lower land, and a first via; preparing a second double-sided substrate including a second insulating layer, a third lower copper layer, a fourth circuit layer including a second lower land, and a second via; disposing a third insulating layer between the second circuit layer and the fourth circuit layer such that the first lower land and the second lower land are electrically connected to each other though a conductive bump; and forming a first circuit layer including a first circuit pattern connected to the first via on the first lower copper layer and forming a third circuit layer including a third circuit pattern connected to the second via on the third lower copper layer.

Abstract: According to an example embodiment, a patterned surface includes a micro-structural surface with a micro or nano pattern on a substrate, wherein the micro-structural surface has superhydrophobic regions and superhydrophilic regions.

Abstract: Disclosed are a carrier substrate including an insulating base material with a copper foil layer formed on at least one surface thereof, a metal layer formed on the cooper layer and having a length shorter than that of the copper foil layer, and an insulating layer formed on the metal layer, a fabrication method thereof, a printed circuit board (PCB) using the same, and a fabrication method thereof. Because there is no land at the via and core in the substrate, because a circuit pattern connected with the via can be formed to be finer, so the circuit pattern can be highly integrated and the substrate can become thinner. Thus, a printed circuit board (PCB) having a smaller size and reduced number of layers can be fabricated.

Abstract: Disclosed herein are a color filter having a black matrix and an apparatus and method of manufacturing the same. The method may include applying an organic film to a substrate, forming a pattern on the organic film by applying pressure to the organic film with a mold having prominences and depressions, and forming a black matrix by applying an ink to the pattern of the organic film. The formation of the black matrix may be achieved by a roll to roll method. The black matrix is easily formed by carrying out imprinting and printing on the organic film applied to the substrate. The black matrix may have a fine line width of a nano level by imprinting and printing. Further, since the black matrix is formed by the roll to roll method, material costs may be reduced and the color filter may be manufactured at a relatively high speed.

Abstract: In forming a pattern on a substrate with reduced pattern error using a mold having an area smaller than an area of the substrate, a first resin pattern is formed on at least a first of a plurality of regions of an etching object layer by imprinting resin applied to the etching object layer using a first mold The etching object layer is then etched using the first resin pattern as an etching mask. A second resin pattern is formed on at least a second of the plurality of regions by imprinting resin applied to the etching object layer using a second mold. The etching object layer is again etched using the second resin pattern as an etching mask.

Abstract: Disclosed herein is a printed circuit board including an outmost fine circuit pattern. In the board, an end of a via, which has the minimum diameter, is connected to the outmost circuit layer of a substrate. The end surface, having the minimum diameter, is positioned at the outmost layer, so that the outmost circuit layer of the substrate, which needs to have a relatively high density in order to mount chips, compared to other circuit layers, can be more finely formed.

Abstract: A method of transmitting multimedia data on demand by using a dynamic channel and apparatus thereof are disclosed. In one embodiment, the method includes i) continuously transmitting the multimedia data from beginning to end via a first static channel at a first static channel transmission point, ii) transmitting a portion of the multimedia data from beginning via a first to dth (d is a natural number not less than 1) dynamic channel at a first to dth dynamic channel transmission point and iii) reusing kth (k is more than 1 and less than d) dynamic channel as another dynamic channel after releasing the kth dynamic channel to be available after Tk from the kth dynamic channel transmission point, wherein the Tk is not less than an elapsed time from the first static channel transmission point to the kth dynamic channel transmission point.