Patents by Inventor Sumanth Banda

Sumanth Banda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220319504
    Abstract: A collection of digital video files may contain a large amount of unstructured information in the form of spoken words encoded within audio tracks. The audio tracks are transcribed into digital text. Attributes are extracted from the digital text and mapped to a particular subject matter aspect. Attribute to aspect mappings provide a useful organization for the unstructured information. Furthermore, sentiment scores and trends for one or more aspects may be determined and displayed.
    Type: Application
    Filed: April 5, 2021
    Publication date: October 6, 2022
    Inventors: Eric Owhadi, Bharat Naga Sumanth Banda, Narendra Goyal, Hong Ding
  • Publication number: 20220301913
    Abstract: Semiconductor substrate support assemblies may include an electrostatic chuck body having a substrate support surface. The electrostatic chuck body may define a plurality of protrusions extending from the substrate support surface. The assemblies may include an electrode embedded within the electrostatic chuck body. The electrode may define apertures through the electrode in line with the plurality of protrusions extending from the substrate support surface.
    Type: Application
    Filed: March 18, 2021
    Publication date: September 22, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Sumanth Banda, Vladimir Knyazik, Stephen D. Prouty
  • Patent number: 11380572
    Abstract: A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned adjacent to the porous plug and is configured to form one or more of a radial seal between the porous plug and the cavity and an axial seal between the porous plug and the cooling base.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: July 5, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Stephen Donald Prouty, Andreas Schmid, Jonathan Simmons, Sumanth Banda
  • Publication number: 20220172975
    Abstract: A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned in a groove formed in the cooling base and configured to form a seal between the cooling base and one or both of the porous plug and the body of the electrostatic chuck.
    Type: Application
    Filed: February 15, 2022
    Publication date: June 2, 2022
    Inventors: Stephen Donald PROUTY, Andreas SCHMID, Jonathan SIMMONS, Sumanth BANDA
  • Patent number: 11130142
    Abstract: Embodiments of showerheads having a detachable gas distribution plate are provided herein. In some embodiments, a showerhead for use in a substrate processing chamber includes a body having a first side and an opposing second side; a gas distribution plate disposed proximate the second side of the body; and a clamp disposed about a peripheral edge of the gas distribution plate to removably couple the gas distribution plate to the body, wherein the body is electrically coupled to the gas distribution plate through the clamp.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: September 28, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Dmitry Lubomirsky, Vladimir Knyazik, Hamid Noorbakhsh, Jason Della Rosa, Zheng John Ye, Jennifer Y. Sun, Sumanth Banda
  • Publication number: 20210276056
    Abstract: Methods of semiconductor processing may include performing a process on a semiconductor substrate. The semiconductor substrate may be seated on a substrate support positioned within a processing region of a semiconductor processing chamber. The methods may include flowing a first backside gas through the substrate support at a first flow rate. The methods may include removing the semiconductor substrate from the processing region of the semiconductor processing chamber. The methods may include performing a plasma cleaning operation within the processing region of the semiconductor processing chamber. The methods may include flowing a second backside gas through the substrate support at a second flow rate. At least a portion of the second backside gas may flow into the processing region through accesses in the substrate support.
    Type: Application
    Filed: March 6, 2020
    Publication date: September 9, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Stephen D. Prouty, Martin Perez-Guzman, Sumanth Banda, Rajinder Dhindsa, Alvaro Garcia de Gorordo
  • Patent number: 10975469
    Abstract: Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a porous chamber component and onto pore walls within the porous chamber component using an atomic layer deposition (ALD) process. The porous chamber component may include a porous body comprising a plurality of pores within the porous body, the plurality of pores each comprising pore walls. The porous body is permeable to a gas. The plasma resistant coating may have a thickness of about 5 nm to about 3 ?m, and may protect the pore walls from erosion. The porous body with the plasma resistant coating remains permeable to the gas.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: April 13, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Vahid Firouzdor, Sumanth Banda, Rajinder Dhindsa, Daniel Byun, Dana Marie Lovell
  • Patent number: 10899892
    Abstract: A method for preparing a bonding component comprises mixing a first solution comprising an organofluorine monomer unit with a second solution comprising an organosilicon monomer unit to form, in-situ, a copolymer solution comprising a copolymer of an organofluorine polymer and an organosilicon polymer based on the organofluorine monomer unit and the organosilicon monomer unit. The method further comprises depositing the copolymer solution onto a body to form a film of the copolymer, and curing the film of the copolymer.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: January 26, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Jennifer Y. Sun, Sumanth Banda
  • Publication number: 20200373184
    Abstract: A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned adjacent to the porous plug and is configured to form one or more of a radial seal between the porous plug and the cavity and an axial seal between the porous plug and the cooling base.
    Type: Application
    Filed: April 23, 2020
    Publication date: November 26, 2020
    Inventors: Stephen Donald PROUTY, Andreas SCHMID, Jonathan SIMMONS, Sumanth BANDA
  • Patent number: 10847402
    Abstract: A method and structure for a bonding layer are disclosed. The bonding structure includes a first portion surrounding an opening in a body defining a dam thereabout. A second portion surrounds the first portion. The first portion is formed from a material resistant to degradation from exposure to a process gas. The second portion is formed from a different material than the material of the first portion. The first portion further includes one or more additives to change properties thereof.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: November 24, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Wendell Glenn Boyd, Jr., Sumanth Banda
  • Patent number: 10774436
    Abstract: A chamber component for a processing chamber comprises an article having impurities, an aluminum coating on a surface of the article, wherein the aluminum coating is substantially free from impurities, and an anodization layer over the aluminum coating. The anodization layer comprises aluminum oxide. The anodization layer further comprises a dense barrier layer portion and a porous columnar layer portion.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: September 15, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jennifer Y. Sun, Sumanth Banda
  • Patent number: 10745805
    Abstract: Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a porous chamber component and onto pore walls within the porous chamber component using an atomic layer deposition (ALD) process. The porous chamber component may include a porous body comprising a plurality of pores within the porous body, the plurality of pores each comprising pore walls. The porous body is permeable to a gas. The plasma resistant coating may comprise a solid solution of Y2O3—ZrO2 and may have a thickness of about 5 nm to about 3 ?m, and may protect the pore walls from erosion. The porous body with the plasma resistant coating remains permeable to the gas.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: August 18, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Vahid Firouzdor, Sumanth Banda, Rajinder Dhindsa, Daniel Byun, Dana Marie Lovell
  • Publication number: 20200238303
    Abstract: Embodiments of showerheads having a detachable gas distribution plate are provided herein. In some embodiments, a showerhead for use in a substrate processing chamber includes a body having a first side and an opposing second side; a gas distribution plate disposed proximate the second side of the body; and a clamp disposed about a peripheral edge of the gas distribution plate to removably couple the gas distribution plate to the body, wherein the body is electrically coupled to the gas distribution plate through the clamp.
    Type: Application
    Filed: April 10, 2020
    Publication date: July 30, 2020
    Inventors: Dmitry LUBOMIRSKY, Vladimir KNYAZIK, Hamid NOORBAKHSH, Jason DELLA ROSA, Zheng John YE, Jennifer Y. SUN, Sumanth BANDA
  • Publication number: 20200140620
    Abstract: A method for preparing a bonding component comprises mixing a first solution comprising an organofluorine monomer unit with a second solution comprising an organosilicon monomer unit to form, in-situ, a copolymer solution comprising a copolymer of an organofluorine polymer and an organosilicon polymer based on the organofluorine monomer unit and the organosilicon monomer unit. The method further comprises depositing the copolymer solution onto a body to form a film of the copolymer, and curing the film of the copolymer.
    Type: Application
    Filed: December 20, 2019
    Publication date: May 7, 2020
    Inventors: Jennifer Y. Sun, Sumanth Banda
  • Patent number: 10625277
    Abstract: Embodiments of showerheads having a detachable gas distribution plate are provided herein. In some embodiments, a showerhead for use in a substrate processing chamber includes a body having a first side and an opposing second side; a gas distribution plate disposed proximate the second side of the body; and a clamp disposed about a peripheral edge of the gas distribution plate to removably couple the gas distribution plate to the body, wherein the body is electrically coupled to the gas distribution plate through the clamp.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: April 21, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Dmitry Lubomirsky, Vladimir Knyazik, Hamid Noorbakhsh, Jason Della Rosa, Zheng John Ye, Jennifer Y. Sun, Sumanth Banda
  • Patent number: 10570257
    Abstract: A copolymerized high temperature bonding component that includes a first amount of an organofluorine polymer and a second amount of an organosilicon polymer which are chemically bound to each other to form a copolymer. The bonding component may have properties that allow it to be used for binding dissimilar materials.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: February 25, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Jennifer Y. Sun, Sumanth Banda
  • Publication number: 20190304827
    Abstract: A method and structure for a bonding layer are disclosed. The bonding structure includes a first portion surrounding an opening in a body defining a dam thereabout. A second portion surrounds the first portion. The first portion is formed from a material resistant to degradation from exposure to a process gas. The second portion is formed from a different material than the material of the first portion. The first portion further includes one or more additives to change properties thereof.
    Type: Application
    Filed: April 2, 2018
    Publication date: October 3, 2019
    Inventors: Wendell Glenn BOYD, JR., Sumanth BANDA
  • Publication number: 20180337026
    Abstract: Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a chamber component using an atomic layer deposition (ALD) process. The chamber component may include an insulator material with good electrical properties. The dielectric constant of a coated insulator material may be within about ±5% of the dielectric constant of the insulator material without the plasma resistant coating.
    Type: Application
    Filed: May 17, 2018
    Publication date: November 22, 2018
    Inventors: Vahid Firouzdor, Sumanth Banda, Dana Lovell, Daniel Byun, Rajinder Dhindsa
  • Publication number: 20180265973
    Abstract: Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a porous chamber component and onto pore walls within the porous chamber component using an atomic layer deposition (ALD) process. The porous chamber component may include a porous body comprising a plurality of pores within the porous body, the plurality of pores each comprising pore walls. The porous body is permeable to a gas. The plasma resistant coating may comprise a solid solution of Y2O3—ZrO2 and may have a thickness of about 5 nm to about 3 ?m, and may protect the pore walls from erosion. The porous body with the plasma resistant coating remains permeable to the gas.
    Type: Application
    Filed: December 20, 2017
    Publication date: September 20, 2018
    Inventors: Vahid Firouzdor, Sumanth Banda, Rajinder Dhindsa, Daniel Byun, Dana Marie Lovell
  • Publication number: 20180265972
    Abstract: Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a porous chamber component and onto pore walls within the porous chamber component using an atomic layer deposition (ALD) process. The porous chamber component may include a porous body comprising a plurality of pores within the porous body, the plurality of pores each comprising pore walls. The porous body is permeable to a gas. The plasma resistant coating may have a thickness of about 5 nm to about 3 ?m, and may protect the pore walls from erosion. The porous body with the plasma resistant coating remains permeable to the gas.
    Type: Application
    Filed: March 17, 2017
    Publication date: September 20, 2018
    Inventors: Vahid Firouzdor, Sumanth Banda, Rajinder Dhindsa, Daniel Byun, Dana Marie Lovell