Patents by Inventor Sun Cheol LEE

Sun Cheol LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160099105
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers; an active part including first and second internal electrodes which are exposed to both end surfaces of the ceramic body in a length direction thereof, and floating electrodes which are partially overlapped with the first and second internal electrodes; upper and lower cover parts including the dielectric layers and disposed above and below the active part; dummy electrodes disposed in the upper and lower cover parts to be overlapped with the floating electrodes; and first and second external electrodes.
    Type: Application
    Filed: March 19, 2015
    Publication date: April 7, 2016
    Inventors: Sun Cheol LEE, Hyoung Wook LIM, Mi Ok PARK, Jae Yeol CHOI, Ji Hee MOON
  • Patent number: 9155197
    Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: October 6, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sun Cheol Lee, Woo Sup Kim, Dong Gun Kim, Kyeong Jun Kim, Kyu Ho Lee
  • Publication number: 20150114701
    Abstract: A multilayer ceramic capacitor may include a ceramic body including dielectric layers, first and second internal electrodes disposed in the ceramic body to face each other, the dielectric layer being interposed between the first and second internal electrodes, and first and second external electrodes covering both end surfaces of the ceramic body. The ceramic body may include an active layer as a capacitance forming part and a cover layer as a non-capacitive part disposed on at least one surface of upper and lower surfaces of the active layer, the cover layer including at least one buffer layer, and when a thickness of the cover layer is defined as tc, and a thickness of the buffer layer is defined as ti, ti/tc being in a range of 0.15 to 0.90 (0.15?ti/tc?0.90).
    Type: Application
    Filed: April 25, 2014
    Publication date: April 30, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hae Sock CHUNG, Doo Young KIM, Chang Hoon KIM, Sun Cheol LEE, Jong Hyun YOON, Ki Won KIM
  • Publication number: 20140083755
    Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.
    Type: Application
    Filed: December 13, 2012
    Publication date: March 27, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sun Cheol LEE, Woo Sup KIM, Dong Gun KIM, Kyeong Jun KIM, Kyu Ho LEE