Patents by Inventor Sun Jun

Sun Jun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240076766
    Abstract: Provided are a QT heat treated high carbon hot rolled steel sheet, a high carbon cold rolled steel sheet, a QT heat treated high carbon cold rolled steel sheet, and manufacturing methods thereof, wherein the QT heat treated high carbon hot rolled steel sheet comprises, in weight %, C: 1.0-1.4%, Si: 0.1-0.4%, Mn: 0.1-0.8%, Cr: 0.3-11%, W: 0.05-2.5%, P: 0.03% or less, S: 0.03% or less, Al: 0.02% or less, and the balance being Fe and other inevitable impurities, the average size of carbides being 0.1-20 ?m.
    Type: Application
    Filed: December 10, 2021
    Publication date: March 7, 2024
    Applicant: POSCO Co., Ltd
    Inventors: Sun-Mi KIM, Jae-Hun CHOI, Hak-Jun KIM
  • Patent number: 11905402
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene-based resin having an isotactic pentad fraction of 96% or more as measured by 13C-NMR, a thermoplastic elastomer, an inorganic filler having an average particle diameter of 0.1 ?m to 5 ?m, and a compatibilizer, and has a flexural modulus of 2,500 MPa or more and a coefficient of linear thermal expansion of 60 ?m/m·° C. or less.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: February 20, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HANWHA TOTAL ENERGIES PETROCHEMICAL CO., LTD.
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Jeong Gil Ko, Yoon Hwan Lee
  • Patent number: 11884802
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline polypropylene and the like, an elastomer, and an inorganic filler.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: January 30, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HDC HYUNDAI ENGINEERING PLASTICS CO., LTD.
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Jin Bo Chae
  • Publication number: 20240026282
    Abstract: The present disclosure relates to a Corynebacterium sp. mutant strain having increased L-arginine or L-citrulline productivity and a method of producing L-arginine or L-citrulline using the same. The Corynebacterium sp. mutant strain has enhanced activity of acetylglutamate kinase involved in the L-arginine biosynthesis pathway, and thus is capable of producing L-arginine or L-citrulline in an increased yield compared to a parent strain.
    Type: Application
    Filed: October 4, 2022
    Publication date: January 25, 2024
    Applicant: DAESANG CORPORATION
    Inventors: Mi RYU, Sun Jun Yoon, In Pyo Hong, Seok Hyun Park
  • Publication number: 20240032188
    Abstract: A substrate including a base substrate and first to fourth identification codes on the base substrate, wherein the substrate is one of a plurality of substrates at a row ‘c’ and a column ‘d’ in a (b)th strip of an (a)th panel, where ‘a’, ‘b’, ‘c’ and ‘d’ are natural numbers, the plurality of substrates being included in the (b)th strip of the (a)th panel, the first identification code includes information on the ‘a’, the second identification code includes information on the ‘b’, the third identification code includes information on the ‘c’, and the fourth identification code includes information on the ‘d’, may be provided.
    Type: Application
    Filed: April 11, 2023
    Publication date: January 25, 2024
    Applicant: Samsung Electronics Co.,Ltd.
    Inventor: Sun Jun KIM
  • Publication number: 20240026283
    Abstract: The present disclosure relates to a Corynebacterium sp. mutant strain having increased L-arginine or L-citrulline productivity and a method of producing L-arginine or L-citrulline using the same. The Corynebacterium sp. mutant strain has enhanced activity of acetylornithine aminotransferase involved in the L-arginine biosynthesis pathway, and thus is capable of producing L-arginine or L-citrulline productivity in an increased yield compared to a parent strain.
    Type: Application
    Filed: October 4, 2022
    Publication date: January 25, 2024
    Applicant: DAESANG CORPORATION
    Inventors: Mi RYU, Sun Jun YOON, In Pyo HONG, Seok Hyun PARK
  • Patent number: 11882705
    Abstract: Provided are a three-dimensional semiconductor memory device, a method for manufacturing the same, a method for operating the same, and an electronic system including the same. The three-dimensional semiconductor memory device includes a substrate, a stack structure on the substrate, and vertical channel structures, which are provided in channel holes penetrating the stack structure, wherein each of the vertical channel structures includes a data storage pattern, a vertical channel pattern, a conductive pad, and a vertical semiconductor pattern, wherein the vertical channel pattern includes a first portion contacting the upper surface of the substrate and a second portion provided between the data storage pattern and the vertical semiconductor pattern, and wherein the vertical semiconductor pattern is spaced apart from the substrate with the first portion of the vertical channel pattern therebetween.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: January 23, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yun Heub Song, Sun Jun Choi, Chang Hwan Choi, Jae Kyeong Jeong
  • Patent number: 11864872
    Abstract: A method of estimating a continuous blood pressure waveform or a continuous blood pressure in a subject including: measuring an arterial blood pressure waveform or an arterial blood pressure with a sensor supported by a supporting structure comprising a polymeric substrate and connected to a processor and a transmitter, wherein the supporting structure is configured to press the sensor against a skin surface of a subject, wherein the sensor is configured to detect a biological metric of the subject, and wherein the processor is configured to quantify one or more signal(s) corresponding to the biological metric and the transmitter is configured to transmit the one or more signals to an external user system, and transforming the arterial blood pressure waveform or the arterial blood pressure to the continuous blood pressure waveform or the continuous blood pressure using a transfer function.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: January 9, 2024
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Michelle Khine, Nicole Eckmann, Kimberly Veliz, Jonathan Pegan, Joshua Kim, Sun-Jun Park
  • Publication number: 20230406812
    Abstract: The present invention provides a novel aminoaromatic compound or a pharmaceutically acceptable salt thereof, a pharmaceutical composition that is for preventing or treating neurodegenerative diseases and comprises same as an active ingredient, and a health functional food composition for preventing or ameliorating neurodegenerative diseases.
    Type: Application
    Filed: November 12, 2021
    Publication date: December 21, 2023
    Inventors: Chang Jun LEE, Heejung CHUN, Woojin WON, Ki Duk PARK, Jong Hyun PARK, Ae Nim PAE, Ji Won CHOI, Elijah LEE, Sun Jun PARK, Hyeon Jeong KIM, Yoowon KIM, Byung Eun KIM, Siwon KIM
  • Patent number: 11820884
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a first polypropylene resin having crystallinity of 50% to 80%, a second polypropylene resin having a coefficient of linear thermal expansion of 70 ?m/m·° C. to 90 ?m/m·° C., an elastomer, and an inorganic filler.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: November 21, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DAE HA CO., LTD.
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Kwan Suk Ryu, Tae Kyung Lee
  • Publication number: 20230343500
    Abstract: Disclosed are a solenoid actuator and a multi-stage solenoid actuator for transmitting a constant force. The solenoid actuator includes a tubular solenoid, a power unit capable of applying current to the solenoid, and a magnetic pair member having two magnetic members providing magnetic fields formed such that respective first poles thereof face each other and respective second poles thereof different from the first poles are located at both distal ends, and extending through the tub of the solenoid.
    Type: Application
    Filed: April 21, 2023
    Publication date: October 26, 2023
    Applicant: PUKYONG NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
    Inventors: Do Jin IM, Seo Jun BAE, Sun Jun LEE
  • Publication number: 20230284448
    Abstract: A three-dimensional flash memory for improving leakage current and a substrate are disclosed. The three-dimensional flash memory comprises: a string extending in one direction on the substrate, wherein the string includes a channel layer extending in the one direction and a charge storage layer extending in the one direction so as to surround the channel layer; at least one selection line vertically connected to an upper end or a lower end of the string; and a plurality of word lines positioned above or below the at least one selection line and vertically connected to the string, wherein the channel layer is formed of an oxide semiconductor material.
    Type: Application
    Filed: May 4, 2021
    Publication date: September 7, 2023
    Applicant: (IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Yun Heub SONG, Bongseok KIM, Jaemin SIM, Sun Jun CHOI
  • Publication number: 20230207867
    Abstract: Disclosed is a method of predicting the lithium ion conductivity of a solid electrolyte having a specific composition.
    Type: Application
    Filed: October 12, 2022
    Publication date: June 29, 2023
    Inventors: Ju Yeong Seong, In Woo Song, Sang Heon Lee, Sung Woo Noh, Je Sik Park, Jeong Hyun Seo, Yong Jun Jang, A Reum Ha, Sang Uck Lee, Byeong Sun Jun
  • Publication number: 20230187708
    Abstract: Disclosed is a method of screening a solid electrolyte having excellent lithium ion conductivity and stability.
    Type: Application
    Filed: November 29, 2022
    Publication date: June 15, 2023
    Applicants: Hyundai Motor Company, Kia Corporation, Industry-University Cooperation Foundation Hanyang University ERICA Campus
    Inventors: Ju Yeong Seong, In Woo Song, Sang Heon Lee, Sung Woo Noh, Je Sik Park, Jeong Hyun Seo, Yong Jun Jang, A Reum Ha, Sang Uck Lee, Byeong Sun Jun
  • Publication number: 20230178798
    Abstract: A lithium metal halide-based solid electrolyte for an all-solid-state battery with excellent lithium ion conductivity, includes a compound represented by the following Chemical Formula 1. Li6-a(M11-bM2b)X6??[Chemical Formula 1] wherein M1 comprises a group 3 element, a group 4 element or a group 13 element, M2 comprises silicon (Si), germanium (Ge), tin (Sn) or lead (Pb), X comprises chlorine (Cl), bromine (Br) or iodine (I), 0?b?1, and a is a number satisfying the following Mathematical Formula 1.
    Type: Application
    Filed: November 30, 2022
    Publication date: June 8, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, Industry-University Cooperation Foundation Hanyang University ERICA Campus
    Inventors: Yong Jun Jang, Sang Heon Lee, Sang Soo Lee, So Young Kim, Seong Hyeon Choi, Sun Ho Choi, Dae Yeon Hwang, Mun Seok Chae, Ho Cheol Shin, Kwang Jin Kim, Sa Heum Kim, In Woo Song, Sang Uck Lee, Byeong Sun Jun, Ji Hoon Kim
  • Publication number: 20230067598
    Abstract: Disclosed are a three-dimensional flash memory, which reduces leakage current and supports a hole injection erase technique, and a method for manufacturing same. According to an embodiment, the three-dimensional flash memory comprises: a substrate; a channel layer extending in one direction on the substrate and having the shape of a hollow macaroni; and a P-type filer extending in the one direction while filling the inner space of the channel layer.
    Type: Application
    Filed: December 24, 2020
    Publication date: March 2, 2023
    Applicant: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Yun Heub SONG, Sun Jun CHOI
  • Publication number: 20230024056
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. The thermoplastic resin composition includes a first propylene-ethylene copolymer, a second propylene-ethylene copolymer, a thermoplastic elastomer, an inorganic filler, and a sodium-phosphate-based nucleating agent as appropriate, and thus a molded article produced therefrom can exhibit improved mechanical rigidity, impact resistance, and dimensional stability. Even when formed to a low thickness for weight reduction, the molded article can be imparted with excellent processability, high tensile strength, a high flexural modulus, and high impact strength.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 26, 2023
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Seok Jin Yong, Hyung Tak Lee
  • Publication number: 20230016858
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a first polypropylene resin having crystallinity of 50% to 80%, a second polypropylene resin having a coefficient of linear thermal expansion of 70 ?m/m° C. to 90 ?m/m° C., an elastomer, and an inorganic filler.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 19, 2023
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Kwan Suk Ryu, Tae Kyung Lee
  • Publication number: 20230019540
    Abstract: Provided are a three-dimensional semiconductor memory device, a method for manufacturing the same, a method for operating the same, and an electronic system including the same. The three-dimensional semiconductor memory device includes a substrate, a stack structure on the substrate, and vertical channel structures, which are provided in channel holes penetrating the stack structure, wherein each of the vertical channel structures includes a data storage pattern, a vertical channel pattern, a conductive pad, and a vertical semiconductor pattern, wherein the vertical channel pattern includes a first portion contacting the upper surface of the substrate and a second portion provided between the data storage pattern and the vertical semiconductor pattern, and wherein the vertical semiconductor pattern is spaced apart from the substrate with the first portion of the vertical channel pattern therebetween.
    Type: Application
    Filed: September 23, 2022
    Publication date: January 19, 2023
    Applicant: Industry-University Cooperation Foundation Hanyang University
    Inventors: Yun Heub SONG, Sun Jun CHOI, Chang Hwan CHOI, Jae Kyeong JEONG
  • Publication number: 20230020477
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene-based resin having an isotactic pentad fraction of 96% or more as measured by 13C-NMR, a thermoplastic elastomer, an inorganic filler having an average particle diameter of 0.1 ?m to 5 ?m, and a compatibilizer, and has a flexural modulus of 2,500 MPa or more and a coefficient of linear thermal expansion of 60 ?m/m·° C. or less.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 19, 2023
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Jeong Gil Ko, Yoon Hwan Lee