Abstract: An apparatus for controlling a discharge pressure of a fluid includes: a pump configured to suck the fluid through an inlet or to discharge the sucked fluid through an outlet; a distributor connected to the pump and to an injection nozzle provided by a sensor and configured to distribute the fluid discharged from the pump to the sensor; and a controller. The controller is configured to control the pump to operate selectively in accordance with detection of contamination of the sensor and to control operation of the distributor to be forcibly delayed during operation of the pump such that the fluid distributed to the sensor, when detected as being contaminated, is controlled to reach a selected required discharge pressure of different required discharge pressures selected in accordance with water amount information and a degree of contamination of the sensor.

Abstract: Provided is a method for packing a semiconductor, and more particularly, to a method for packaging a semiconductor, which packages the semiconductor device in a wafer level packaging manner. The method for packaging the semiconductor includes: preparing a wafer including a plurality of semiconductor devices; and forming a conductive pattern layer electrically connected to the plurality of semiconductor devices by using a mask member that is provided separately from the wafer.

Abstract: A liquid injection device includes a liquid injector including a liquid injection hopper connected to a storage tank configured to store an electrolyte and a valve including an injection nozzle connected to the liquid injector to inject the electrolyte into a cell. The injection nozzle includes a conical body and an injection part protruding from an end of the body, and the injection part includes an obstacle. A shape of the liquid injection nozzle may be changed to disperse an injection pressure of the electrolyte, and damage such as scratches in a top surface of the electrode assembly may be avoided.

Abstract: An embodiment of the present disclosure discloses tobacco material including: a center portion including a flavor material; and an outer portion including a tobacco mixture, wherein the outer portion surrounds the center portion.

Abstract: The present disclosure provides a mobile communications system line number sheet management device and method. Provided, according to one aspect of the present disclosure, is a line number sheet management device and method, for automating access network-related line number sheet management by automatically collecting and updating line number information, the line number information being collected from a mobile communications base station management server (mobile communications system management server) and a fronthaul management server. Provided, according to another aspect of the present disclosure, is a fronthaul device for: acquiring unique information of a base station by receiving an optical signal from any one of a radio unit (RU) and a digital unit (DU); and transmitting the unique information of the base station to a fronthaul management server.

Abstract: An apparatus and a method for generating log data includes a controller that monitors input data and output data corresponding to the input data with respect to a control device of a vehicle, and when there is a change in current output data compared to previous output data, generates log data based on the input data and the current output data and a memory that stores the generated log data.

Abstract: Disclosed herein is a multi-cloud edge system. The multi-cloud edge system includes a core cloud, a multi-cluster-based first edge node system, and a multi-cluster-based near edge node system, wherein the multi-cluster-based first edge node system includes multiple worker nodes, and a master node including a scheduler.

Abstract: Disclosed herein are a distributed cloud system, a data processing method of a distributed cloud system, and a storage medium. The data processing method of a distributed cloud system includes receiving a request of a user for an edge cloud and controlling a distributed cloud system, wherein the distributed cloud system comprises a core cloud including a large-scale resource, the edge cloud, and a local cloud including a middle-scale resource between the core cloud and the edge cloud, processing tasks corresponding to the user request through a scheduler of the core cloud, distributing the tasks based on a queue, and aggregating results of processed tasks, and providing processed data in response to a request of the user, wherein the distributed cloud system provides a management function in case of failure in the distributed cloud system.

Abstract: A semiconductor device includes a substrate having a first region and a second region, first and second nanowires disposed sequentially on the substrate in the first region, and extending respectively in a first direction, third and fourth nanowires disposed sequentially on the substrate in the second region, and extending respectively in the first direction, a first inner spacer between the first nanowire and the second nanowire, and including hydrogen of a first hydrogen mole fraction, and a second inner spacer between the third nanowire and the fourth nanowire, and including hydrogen of a second hydrogen mole fraction that is greater than the first hydrogen mole fraction.

Abstract: A semiconductor device includes first and second fin type patterns, first and second gate patterns intersecting the first and second fin type patterns, third and fourth gate patterns intersecting the first fin type pattern between the first and the second gate patterns, a fifth gate pattern intersecting the second fin type pattern, a sixth gate pattern intersecting the second fin type pattern, first to third semiconductor patterns disposed among the first, the third, the fourth and the second gate patterns, and fourth to sixth semiconductor patterns disposed among the first, the fifth, the sixth and the second gate patterns. The first semiconductor pattern to the fourth semiconductor pattern and the sixth semiconductor pattern are electrically connected to a wiring structure, and the fifth semiconductor pattern is not connected to the wiring structure.

Abstract: Disclosed herein is a multi-cloud edge system. The multi-cloud edge system includes a core cloud, a multi-cluster-based first edge node system, and a multi-cluster-based near edge node system, wherein the multi-cluster-based first edge node system includes multiple worker nodes, and a master node including a scheduler.

Abstract: Disclosed herein is a method for resource allocation in an edge-computing environment. The method includes receiving a request for an intelligent edge service, selecting the worker server to execute the service based on an input/output congestion level, allocating resources based on topology information of the worker server, and configuring a virtual environment based on the allocated resources.

Abstract: An apparatus and method for processing sensitive data. The apparatus includes one or more processors and executable memory for storing at least one program executed by the one or more processors. The at least one program is configured to, in an unprotected data area, read sensitive data from a storage device and transmit the same to a protected data area using the sensitive-data storage endpoint of the protected data area; to, in the protected data area, process the sensitive data using at least one endpoint when a command for a sensitive-data service requested by a client device is received from the unprotected data area; and to, in the unprotected data area, transmit the result of processing the sensitive data to the client device.

Abstract: Disclosed herein are an apparatus and method for managing memory-based integrated storage. The apparatus includes one or more processors and executable memory for storing at least one program executed by the one or more processors. The at least one program converts data operation tasks in response to a request for access to memory-based integrated storage from a user, a single virtual disk of a virtual storage pool of the memory-based integrated storage converts a disk access command into a command for connecting to a storage backend depending on the data operation tasks, and conversion of the data operation tasks into the command includes target identification indicating which local storage of the memory-based integrated storage is to be used.

Abstract: Disclosed herein are an apparatus and method for managing in-memory container storage. The apparatus includes one or more processors, executable memory for storing at least one program executed by the one or more processors, and a container file system for storing a container, which provides application virtualization. Here, the container file system includes a merged access layer, a container layer, and an image layer, and the at least one program provides an application with link information of files in the container layer and the image layer, thereby allowing the application to access the files.

Abstract: Disclosed herein are an apparatus and method for autoscaling a service shared in a cloud. The apparatus may include memory in which at least one program is recorded and a processor for executing the program, and the program may perform autoscaling by which at least one second service for performing the same function as a first service is additionally generated or deleted depending on a load that is incurred when multiple clients call the first service in the cloud. The at least one second service may be set to one of two or more execution types having different response times depending on a response time required by each of the multiple clients.

Abstract: An apparatus and method for processing sensitive data. The apparatus includes one or more processors and executable memory for storing at least one program executed by the one or more processors. The at least one program is configured to, in an unprotected data area, read sensitive data from a storage device and transmit the same to a protected data area using the sensitive-data storage endpoint of the protected data area; to, in the protected data area, process the sensitive data using at least one endpoint when a command for a sensitive-data service requested by a client device is received from the unprotected data area; and to, in the unprotected data area, transmit the result of processing the sensitive data to the client device.

Abstract: A semiconductor device includes a substrate having a first region and a second region, first and second nanowires disposed sequentially on the substrate in the first region, and extending respectively in a first direction, third and fourth nanowires disposed sequentially on the substrate in the second region, and extending respectively in the first direction, a first inner spacer between the first nanowire and the second nanowire, and including hydrogen of a first hydrogen mole fraction, and a second inner spacer between the third nanowire and the fourth nanowire, and including hydrogen of a second hydrogen mole fraction that is greater than the first hydrogen mole fraction.

Abstract: A semiconductor device includes a substrate having a first region and a second region, first and second nanowires disposed sequentially on the substrate in the first region, and extending respectively in a first direction, third and fourth nanowires disposed sequentially on the substrate in the second region, and extending respectively in the first direction, a first inner spacer between the first nanowire and the second nanowire, and including hydrogen of a first hydrogen mole fraction, and a second inner spacer between the third nanowire and the fourth nanowire, and including hydrogen of a second hydrogen mole fraction that is greater than the first hydrogen mole fraction.

Abstract: A semiconductor device includes first and second fin type patterns, first and second gate patterns intersecting the first and second fin type patterns, third and fourth gate patterns intersecting the first fin type pattern between the first and the second gate patterns, a fifth gate pattern intersecting the second fin type pattern, a sixth gate pattern intersecting the second fin type pattern, first to third semiconductor patterns disposed among the first, the third, the fourth and the second gate patterns, and fourth to sixth semiconductor patterns disposed among the first, the fifth, the sixth and the second gate patterns. The first semiconductor pattern to the fourth semiconductor pattern and the sixth semiconductor pattern are electrically connected to a wiring structure, and the fifth semiconductor pattern is not connected to the wiring structure.