Abstract: A test interface circuit includes N switches and N resistors, wherein N is a positive integer. A first end of each of the N switches is coupled to each of N test connection ends, a second end of each of the N switches receives a reference voltage. Each of the N first resistors is coupled to each of the N switches in series between each of the N test connection ends and the reference voltage. Wherein, each of the N switches is controlled by each of N control signals to be turned on or cut off.

Abstract: A method for forming a bonded semiconductor structure is disclosed. A first device wafer having a first bonding layer and a first bonding pad exposed from the first bonding layer and a second device wafer having a second bonding layer and a second bonding pad exposed from the second bonding layer are provided. Following, a portion of the first bonding pad is removed until a sidewall of the first bonding layer is exposed, and a portion of the second bonding layer is removed to expose a sidewall of the second bonding pad. The first device wafer and the second device wafer are then bonded to form a dielectric bonding interface between the first bonding layer and the second bonding layer and a conductive bonding interface between the first bonding pad and the second bonding pad. The conductive bonding interface and the dielectric bonding interface comprise a step-height.

Abstract: A semiconductor device includes: first and second active regions extending in a first direction and separated by a gap relative to a second direction substantially perpendicular to the first direction; and gate structures correspondingly over the first and second active regions, the gate structures extending in the second direction; and each of the gate structures extending at least unilaterally substantially beyond a first side of the corresponding first or second active region that is proximal to the gap or a second side of the corresponding first or second active region that is distal to the gap; and some but not all of the gate structures also extending bilaterally substantially beyond each of the first and second sides of the corresponding first or second active region.

Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle extending through the spin base, and a clamping member covering the spin base. The spindle includes a mounting part and a supporting part disposed on the mounting part. The mounting part includes an inner projection, the supporting part includes a conical projection, and the conical projection is surrounded by the inner projection. The semiconductor wafer cleaning apparatus further includes a first sealing ring disposed between the spin base and the mounting part.

Abstract: A memory device and a programming method thereof are provided. The programming method includes the following steps. According to a step value, based on an incremental step pulse programming scheme, multiple programming operations are performed for a selected memory page. In a setting mode, multiple program verify operations are respectively performed corresponding to the programming operations to respectively generate multiple pass bit numbers. In the setting mode, a pass bit number difference value of two pass bit numbers corresponding to two programming operations is calculated. In the setting mode, an amount of the step value is adjusted according to the pass bit number difference value.

Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: A horizontal grinder rotor includes a grinding ring, multiple blades, and a center body. The grinding ring, the multiple blades and the central body are formed by 3D printing. The multiple blades are located between the grinding ring and the central body, and the multiple blades are arranged at intervals. The multiple blades are arranged in pairs and symmetrical with respect to the central body, and the horizontal grinder rotor further comprises one or more pins, the one or more pins are provided on at least one side of each of the multiple blades.

Abstract: A method of making a silicon-carbon pre-lithium composite anode material is provided. The method includes: nanoizing silicon materials to obtain nano-silicon particles, adding carbon materials and polymer into the nano-silicon particles for homogenization treatment to obtain a silicon-carbon composite; providing a pre-lithium nanomaterial; mixing the silicon-carbon composite and the pre-lithium nanomaterial to granulate to obtain a silicon-carbon pre-lithium composite precursor; and sintering the silicon-carbon pre-lithium composite precursor.

Abstract: An element-doped silicon-carbon composite negative electrode material is provided. The negative electrode material comprises a plurality of element-doped silicon-carbon composite negative electrode material particles, and each them comprises an element-doped silicon nanoparticle, a first carbon coating layer and a second carbon coating layer. The element-doped silicon nanoparticle is a core, and the first carbon coating layer is coated on the element-doped silicon nanoparticle, the second carbon coating layer covers the first carbon coating layer. The dopant element comprises at least one of a group IIIA element, a group VA element and a transition metal element. A method of preparing the element-doped silicon-carbon composite negative electrode material is further provided.

Abstract: An ESD protection circuit includes a buffer circuit, a driving circuit, and a power-clamping circuit. The buffer circuit includes first and second transistors having a first conductivity type coupled in a cascade configuration between a first node and a first power supply node. A bonding pad is coupled to the first node. The drive circuit determines a state of at least one of the first and second transistors according to a control voltage. The drive circuit includes a third transistor having a second conductivity type, which is coupled between a second power supply node and a gate of the first transistor and is controlled by the control signal. The power-clamping circuit is coupled to the bonding pad and a gate of the third transistor at a second node. The control voltage is generated at the second node and determined by a voltage at the bonding pad.

Abstract: Embodiments of the disclosure provide an angiography image determination method and an angiography image determination device. The method includes: obtaining a plurality of first images of a body part injected with a contrast medium; obtaining a plurality of corresponding second images by performing a first image preprocessing operation on each first image; obtaining a pixel statistical characteristic of each second image; finding a candidate image based on the pixel statistical characteristic of each second image; and finding a reference image corresponding to the candidate image among the plurality of first images.

Abstract: A method for preparing a swelling-inhibited silicon-carbon composite anode material with increased capacitance includes nanocrystallization of a silicon material to obtain a primary nano-silicon material in a protective environment, self-assembling the primary nano-silicon material with a first carbon source and a macromolecular polymer, and then adding a second carbon source for the self-assembly to obtain a secondary nano-silicon material with a layered structure. The method further includes granulating the secondary nano-silicon material to obtain a precursor, and sintering the precursor to obtain the silicon-carbon composite anode material. The method is simple and easy to control, and is tailored to industrial production. A battery with the silicon-carbon composite anode material on an anode electrode is also disclosed.

Abstract: The present invention relates to a method and a system for processing building energy information. The method includes the following steps: inputting data of a building information model into building energy simulation software; automatically selecting a building category or manually selecting a building category from a group of building categories provided by the building energy simulation software; in response to the selected building category, inputting a plurality of parameters into a lookup table of the building energy simulation software in accordance with a database of the building energy simulation software; and generating an estimation of a building's energy consumption through a calculation by the building energy simulation software based on the parameters.

Abstract: A light-curing resin composition, a three-dimensional object containing the same, and a manufacturing method of the three-dimensional object are provided. The light-curing resin composition includes a photoinitiator, an acrylic oligomer, an acrylic monomer, and expandable particles with hollow spherical shell structures. The acrylic monomer is a monofunctional monomer, a difunctional monomer, or a combination thereof.

Abstract: A power supply device includes a housing, a circuit board and a conductive spring contact. The housing has a receiving structure. The circuit board is disposed in the housing. The conductive spring contact is disposed in the receiving structure and includes a base portion, a contact portion and a curved portion. The contact portion is connected to the base portion and is bent relative to the base portion. The contact portion extends between the circuit board and a wall portion of the receiving structure, and the contacts the circuit board. The curved portion is connected to the contact portion and abuts against the wall portion.

Abstract: A character recognition method includes inputting an input image of a document, with the input image including a plurality of characters; selecting the plurality of characters through an object detection module to form at least one character region; separating the plurality of characters in the at least one character region to form a plurality of character boxes; performing calculation to determine a format of a character in each of the plurality of character boxes; recognizing the characters in the at least one character region through an object recognition module to determine a symbol content of the character in each of the plurality of character boxes; and converting the plurality of characters according to the format and symbol content of the character in each of the plurality of character boxes, and outputting corresponding editable characters.

Abstract: A method for assembling a shoe upper and a bottom unit includes digitally determining a bite line on the shoe upper. The method further includes storing a set of data representing the bite line in a computing device. The method also includes utilizing the set of data to automatically indicate the location of an actual physical bite line on the shoe upper.