Abstract: An optical biosensor includes a sensing block that receives a first optical signal and outputs a second optical signal through at least one channel of a plurality of channels that correspond to a sensed concentration of a biomaterial; and a detecting block that detects the second optical signal, converts the second optical signal into an electrical signal, and outputs the electrical signal.

Abstract: An optical link may include a main optical waveguide; N sub-optical waveguides, where N is a natural number; N mode couplers, each configured to perform a mode coupling operation between the main optical waveguide and a respective one of the N sub-optical waveguide; and an optical wavelength filter connected to an output terminal of the main optical waveguide and an output terminal of each of the N sub-optical waveguides. A memory system may include a memory device, a memory controller, and the optical link. A data processing system may include the memory system and a central processing unit connected to the memory system through a bus.

Abstract: A semiconductor memory system includes a controller and a memory device that are optical-interconnected. The controller includes a control logic configured to generate a control signal for controlling the memory device and a transmitter configured to convert the control signal into an optical signal, and output the optical signal. The memory device includes a receiving unit filter configured to convert the optical signal into an electric signal, and the electric signal based on a supply voltage corresponding to a period of the optical signal or the electric signal.

Abstract: A waveguide structure includes a metal layer of a predetermined size on a substrate, a lower clad layer on the structure completely covering the metal layer, a core layer of a predetermined size on the lower clad layer at the location corresponding to the metal layer, and an upper clad layer thereon completely covering the core layer.

Abstract: An integrated circuit device includes a plurality of device layers disposed on a substrate. A first one of the device layers includes at least one photo device and/or at least one electronic device and a second one of the device layers includes at least one photo device overlying the at least one photo device and/or the at least one electronic device of the first one of the device layers.

Abstract: A metal layer having an aperture for delivering light, a method of forming the same, a light delivery module including the metal layer having the aperture, and a heat assisted magnetic recording head including the same are provided. The aperture of the metal layer has an inlet and an outlet of different sizes, and also has curved side surfaces. Also, the light delivery module includes the metal layer at an output end thereof, and the heat assisted magnetic recording head includes the light delivery module as an optical heating unit.

Abstract: A manufacturing method of a waveguide structure includes forming a metal layer of a predetermined size on a substrate to form a structure, forming a lower clad layer on the structure in order to completely cover the metal layer, forming a core layer of a predetermined size on the lower clad layer at the location corresponding to the metal layer, and forming an upper clad layer thereon in order to completely cover the core layer.

Abstract: Provided is an optical interconnection system that transmits and receives a three-level signal. The optical interconnection system includes a first and a second optical interconnection device that transmits and receives a two-level signal, and a synthesizer that outputs a three-level signal by synthesizing signals from the first and second optical interconnection devices. The optical interconnection system may transmit and receive a three-level signal while using an optical interconnection device that interconnects a two-level signal.

Abstract: A multi-chip having an optical interconnection unit is provided. The multi-chip having an optical interconnection unit includes a plurality of silicon chips sequentially stacked, a plurality of optical device arrays on a side of each of the plurality of the silicon chips such that the optical device arrays correspond to each other and a wiring electrically connecting the silicon chip and the optical device array attached to a side of the silicon chip, wherein the corresponding optical device arrays forms an optical connection unit by transmitting and receiving an optical signal between the corresponding optical device arrays in different layers. Each of the optical device arrays includes at least one of a light emitting device and a light receiving device.

Abstract: A head gimbals assembly for a hard disk for use in a thermally assisted magnetic disk recording medium, in which a laser diode is applied so as to record information with high density. The head gimbals assembly for a hard disk having a plurality of suspensions, each of which is provided with a magnetic head positioned adjacent to a corresponding disk surface among the disks so as to record/reproduce information; a head gimbals body having a centrally formed pivot hole which allows the head gimbals body to be fitted in such a manner as to be rotatable in relation to the disks, the suspensions extending from one end of the head gimbals body; a coil rotator provided at the other end of the head gimbals body so as to rotate the head gimbals body about the pivot hole; and a laser assembly having one or more laser diodes and one or more wave guides, the light emitted from any of the laser diodes is guided to a corresponding magnetic head by the wave guides.

Abstract: Provided is an optical interconnection system that transmits and receives a three-level signal. The optical interconnection system includes a first and a second optical interconnection device that transmits and receives a two-level signal, and a synthesizer that outputs a three-level signal by synthesizing signals from the first and second optical interconnection devices. The optical interconnection system may transmit and receive a three-level signal while using an optical interconnection device that interconnects a two-level signal.

Abstract: A memory test system is disclosed. The memory system includes a memory device, a tester generating a clock signal and a test signal for testing the memory device, and an optical splitting module. The optical splitting module comprises an electrical-optical signal converting unit which converts each of the clock signal and the test signal into an optical signal to output the clock signal and the test signal as an optical clock signal and an optical test signal. The optical splitting unit further comprises an optical signal splitting unit which splits each of the optical clock signal and the optical test signal into n signals (n being at least two), and an optical-electrical signal converting unit which receives the split optical clock signal and the split optical test signal to convert the split optical clock signal and the split optical test signal into electrical signals used in the memory device.

Abstract: A silicon based optical modulator apparatus can include a lateral slab on an optical waveguide, the lateral slab protruding beyond side walls of the optical waveguide so that a portion of the optical waveguide protrudes from the lateral slab towards a substrate.

Abstract: A memory test system is disclosed. The memory system includes a memory device, a tester generating a clock signal and a test signal for testing the memory device, and an optical splitting module. The optical splitting module comprises an electrical-optical signal converting unit which converts each of the clock signal and the test signal into an optical signal to output the clock signal and the test signal as an optical clock signal and an optical test signal. The optical splitting unit further comprises an optical signal splitting unit which splits each of the optical clock signal and the optical test signal into n signals (n being at least two), and an optical-electrical signal converting unit which receives the split optical clock signal and the split optical test signal to convert the split optical clock signal and the split optical test signal into electrical signals used in the memory device.

Abstract: An optical serializer/deserializer (SERDES) includes serializing circuitry which includes a source of a plurality of unmodulated optical signals, a modulation unit for generating a plurality of modulated optical signals using a plurality of electrical signals to modulate the plurality of unmodulated optical signals, and a coupling unit for delaying the plurality of modulated optical signs to generate a plurality of delayed modulated optical signals and combines the delayed modulated optical signals to generate a serialized modulated optical signal.

Abstract: An optical modulator comprises a bulk-silicon substrate comprising a trench having a predetermined width and a predetermined depth. A bottom cladding layer is formed in the trench, and a plurality of waveguides and a phase modulation unit are formed on the bottom cladding layer. A top cladding layer is formed on the plurality of waveguides and the phase modulation unit.

Abstract: Optical waveguide and coupler devices and methods include a trench formed in a bulk semiconductor substrate, for example, a bulk silicon substrate. A bottom cladding layer is formed in the trench, and a core region is formed on the bottom cladding layer. A reflective element, such as a distributed Bragg reflector can be formed under the coupler device and/or the waveguide device. Because the optical devices are integrated in a bulk substrate, they can be readily integrated with other devices on a chip or die in accordance with silicon photonics technology. Specifically, for example, the optical devices can be integrated in a DRAM memory circuit chip die.

Abstract: A memory module may include at least one memory package including an optical signal input/output (I/O) unit and a first optical beam path and a printed circuit board (PCB) on which the memory package is mounted. The PCB may have a second optical beam path configured to transmit an optical signal to the optical signal I/O unit. The memory module may further include a connecting body configured to mount the memory package on the PCB and match a refractive index of the first optical beam path with a refractive index of the second optical beam path.

Abstract: A metallic wave guide and a light delivery module are provided. The metallic waveguide includes a metal body formed of a conductive metal and having an aperture formed therethrough, the aperture having input and output ends. The aperture has a bent portion for changing a light traveling direction between the input and output ends, and a tapered portion between the bent portion and the output end. The tapered portion has a width that is gradually reduced toward the output end, and the aperture is formed in a C-shape by a ridge formed on an inner surface of the metal body.

Abstract: Provided is a memory module, a system using the memory module, and a method of fabricating the memory module. The memory module may include a printed circuit board and a memory package on the printed circuit board. The printed circuit board may include an embedded optical waveguide and a first optical window extending from the optical waveguide to a first surface of the printed circuit board. The memory package may also include a memory die having an optical input/output section and a second optical window. The optical input/output section, the second optical window, and the first optical window may be arranged in a line and the first optical window and the second optical window may be configured to at least one of transmit an optical signal from the optical waveguide to the optical input/output section and transmit an optical signal from the optical input/output section to the optical waveguide.