Abstract: An electric compressor capable of reducing a size and lightening weight of a package of an inverter unit, as a common mode choke (CM choke) is disposed radially outside of a circuit board of the inverter unit, and a high voltage connector, a CM choke, and a low voltage connector are integrated into a support body.

Abstract: A thrust enhancing device is disclosed. The thrust enhancing device enhances thrust of a thrust generation part in a state coupled to the thrust generation part configured to obtain a propulsive force by using a reaction force of a fluid. The thrust enhancing device includes a venturi part configured to receive a basic fluid allowed to flow by the thrust generation part and allow the basic fluid to pass through the inside thereof, and an ejection induction part disposed in an inner flow field of the venturi part and configured to linearize a flow of a fluid to be ejected to the outside of the venturi part.

Abstract: An electroluminescent device including a first electrode and a second electrode facing each other; a light emitting layer disposed between the first electrode and the second electrode; and an electron transport layer disposed between the light emitting layer and the second electrode. The light emitting layer includes a plurality of semiconductor nanoparticles, and the electron transport layer includes a plurality of zinc oxide nanoparticles, the zinc oxide nanoparticles further include magnesium and gallium.

Abstract: One aspect of the present invention provides a compound in which a functional group capable of binding to a globulin Fc region or a physiologically active polypeptide is introduced at one end of a non-peptidic polymer and a functional group capable of a click reaction is introduced at the other end; a polypeptide conjugate in which a physiologically active polypeptide binds to one end of the compound; a physiologically active polypeptide conjugate in which a physiologically active polypeptide and an immunoglobulin Fc region bind to both ends thereof by using the compound as a linker; and methods for preparing the same compound, polypeptide conjugate, and physiologically active polypeptide conjugate.

Abstract: The present disclosure relates to an implant device in a shape of a natural tooth with a removable tooth root. The implant device includes an implant body having a tooth root hole formed to penetrate therethrough, an integral tooth root formed by being integrally coupled to the implant body, a removable tooth root formed to extend from the implant body while being inserted along the root hole, and a tooth root fixing unit formed to fix the removable tooth root to the implant body.

Abstract: The present invention relates to an apparatus and method for encoding and decoding an image by skip encoding. The image-encoding method by skip encoding, which performs intra-prediction, comprises: performing a filtering operation on the signal which is reconstructed prior to an encoding object signal in an encoding object image; using the filtered reconstructed signal to generate a prediction signal for the encoding object signal; setting the generated prediction signal as a reconstruction signal for the encoding object signal; and not encoding the residual signal which can be generated on the basis of the difference between the encoding object signal and the prediction signal, thereby performing skip encoding on the encoding object signal.

Abstract: A battery module according to the present disclosure includes: a cell stack including a plurality of battery cells that are stacked in one direction; and a sensing module located on a front portion or a rear portion of the cell stack for voltage sensing and electrical connection of the plurality of battery cells, wherein the sensing module includes: a main frame formed to cover a front surface or a rear surface of the cell stack and including a plurality of lead holes through which electrode leads of the plurality of battery cells are drawn out; a plurality of bus bars located on the main frame to be spaced apart from one another in one direction; and a printed circuit board formed of a rigid material, including a plurality of sensing tips detachably provided on corresponding bus bars, and attached to the main frame.

Abstract: A pattern fuse includes a lower film layer, an adhesive layer stacked on the lower film layer, a circuit pattern made of a conductive material and provided on the adhesive layer, an upper film layer stacked on the adhesive layer and the circuit pattern and a coating layer configured to cover the opening of the upper film layer, wherein the coating layer includes a flame retardant material. The upper film layer has an opening formed therein that is configured to allow a part or the entirety of the circuit pattern to be exposed therethrough. A method of manufacturing the pattern fuse is also provided.

Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.

Abstract: A connector for large current according to the present disclosure includes: a terminal member capable of large current transmission; a connector housing in which the terminal member is accommodated; a temperature sensor attached to the terminal member; a fan unit provided in the connector housing, and configured to operate when a temperature of the terminal member is higher than a preset threshold temperature; and an exhaust cover provided on a side of the connector housing and opened/closed by wind pressure when the fan unit operates.

Abstract: A connector including a housing mounted on a printed circuit board (PCB) and including a sidewall having an empty space that is open to one side and a fixing portion extending from an outer surface of the sidewall, the fixing portion passing through the PCB, a connection terminal having a part passing through the sidewall of the housing and the other part passing through the PCB and configured to be electrically connected to the PCB, and a connection unit including a terminal receiving portion and a coupling portion extending from an outer surface of the terminal receiving portion toward a position of the fixing portion to be mechanically coupled with a part of the fixing portion extending out of the PCB.

Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.

Abstract: A battery module, including battery cells connected in series or connected in series and in parallel, a plurality of bus bars connected to corresponding electrode leads of the battery cells, and a voltage sensing member having sensing parts respectively connected to the bus bars, each of the plurality of bus bars having a pin hole perforated therethrough in a thickness direction, and each of the sensing parts having a solder pin configured to be inserted into and released from the pin hole.

Abstract: Provided is a tool adapter mounted on a handle of a tool to be gripped by a robot hand, the tool adapter including: a fixing part including an opening in which the handle of the tool is inserted to be fixed to the fixing part; a grip part including contact surfaces which are installed on left and right sides of the fixing part to be gripped by the robot hand, and configured such that as at least one of the contact surfaces moves in accordance with a gripping force from the robot hand, a distance between the contact surfaces changes; and a power transmission structure connected to the grip part and configured to convert a movement of the at least one of the contact surfaces into a movement of pressing a switch installed at the handle of the tool.

Abstract: To solve the above problems, a pouch molding method according to an embodiment of the present invention includes: a seating step of seating a pouch film on a top surface of a die; a stripper descending step of allowing a stripper disposed above the die to descend; a fixing step of fixing the pouch film using the stripper; a molding preparation step of allowing a Blank holder disposed at a central portion of the die to ascend to contact one surface of the pouch film and allowing a punch disposed at a central portion of the stripper to descend to contact the other surface of the pouch film; and a molding step of allowing the punch and the Blank holder to descend along with each other to form a cup part in the pouch film.

Abstract: A connector including a housing mounted on a printed circuit board (PCB) and including a sidewall having an empty space that is open to one side and a fixing portion extending from an outer surface of the sidewall, the fixing portion passing through the PCB, a connection terminal having a part passing through the sidewall of the housing and the other part passing through the PCB and configured to be electrically connected to the PCB, and a connection unit including a terminal receiving portion and a coupling portion extending from an outer surface of the terminal receiving portion toward a position of the fixing portion to be mechanically coupled with a part of the fixing portion extending out of the PCB.

Abstract: A display device including: a display unit including a substrate including a first region and a second region, first pixels are included in the first region, second pixels are included in the second region, first gate lines in the first region are connected to the first pixels, second gate lines in the second region are connected to the second pixels, and data lines are connected to the first and second pixels; and a compensator configured to compensate image data for the first and second pixels, based on correction values, and configured to generate corrected image data by decreasing a brightness of an over-compensated portion of the first and second pixels and increasing a brightness of an under-compensated portion of the first and second pixels in a boundary region between the first region and the second region.

Abstract: A FPCB connector including a first main body to which a first FPCB is coupled, and a second main body to which a second FPCB is coupled, the second main body being coupled to and electrically connected to the first main body. At least one of the first main body and the second main body is coupled to the first FPCB or the second FPCB without soldering.

Abstract: A connector assembly with rounded edges, in which an end of a female connector is formed in a round shape and a guide groove having an inner dimension receiving a wire is formed at an end portion to guide the wire to be curved to correspond to the round shape at a wire harness inlet end and guide the curved wire to be received in the guide groove, thereby guiding reduction of tension of the curved wire and prevention of interference with an external structure.

Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.