Abstract: A connector assembly with rounded edges, in which an end of a female connector is formed in a round shape and a guide groove having an inner dimension receiving a wire is formed at an end portion to guide the wire to be curved to correspond to the round shape at a wire harness inlet end and guide the curved wire to be received in the guide groove, thereby guiding reduction of tension of the curved wire and prevention of interference with an external structure.

Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.

Abstract: A display device includes: a first substrate including a display area and a pad area; a second substrate facing the first substrate, a touch portion on the second substrate, a first flexible circuit board coupled to the first substrate, a second flexible circuit board coupled to the touch portion, a first adhesive layer on the first flexible circuit board, and a second adhesive layer that attaches the first adhesive layer and the second flexible circuit board to each other. The first adhesive layer and the second adhesive layer are formed of different materials from each other.

Abstract: A PCB direct connector including terminal members configured to have a pair of contact portions elastically contacting an upper surface and a lower surface of the circuit board and be electrically connected to conductive patterns disposed on at least one of the upper surface and the lower surface, and a connector housing configured to accommodate the terminal members therein and allow a connector connection portion formed at one side of an end of the circuit board to be fitted into and released from the connector housing.

Abstract: A PCB direct connector is directly mounted to a circuit board, and the PCB direct connector includes terminal members arranged in two rows to respectively contact upper conductive patterns and lower conductive patterns provided to an upper surface and a lower surface of the circuit board, and a connector housing configured to accommodate the terminal members therein and allow a connector connection portion formed at one side of an end of the circuit board to be fitted into and released from the connector housing.

Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.

Abstract: A vertical-type direct printed circuit board (PCB) connector including a connector housing directly mounted to one surface of a PCB substrate in a vertical type, and bending terminal members installed inside the connector housing and having one side extending in a first direction corresponding to a direction perpendicular to the one surface of the PCB substrate to be connected to a signal transmission cable and the other side extending in a second direction corresponding to a length direction of contact pads provided to the one surface of the PCB substrate to be connectable to the contact pads.

Abstract: Provided is a tool adapter mounted on a handle of a tool to be gripped by a robot hand, the tool adapter including: a fixing part including an opening in which the handle of the tool is inserted to be fixed to the fixing part; a grip part including contact surfaces which are installed on left and right sides of the fixing part to be gripped by the robot hand, and configured such that as at least one of the contact surfaces moves in accordance with a gripping force from the robot hand, a distance between the contact surfaces changes; and a power transmission structure connected to the grip part and configured to convert a movement of the at least one of the contact surfaces into a movement of pressing a switch installed at the handle of the tool.

Abstract: A CMP pad conditioner and method for manufacturing the same. The CMP pad conditioner includes: a metal plate shank, diamond grit particles each having a lower end secured to a surface of the metal plate shank; a plating layer formed on the surface of the metal plate shank and surfaces of lower portions of the diamond grit particles to expose upper portions of the diamond grit particles; and a coating layer deposited over a surface of the plating layer and surfaces of the upper portions of the diamond grit particles.

Abstract: A PCB direct connector including terminal members configured to have a pair of contact portions elastically contacting an upper surface and a lower surface of the circuit board and be electrically connected to conductive patterns disposed on at least one of the upper surface and the lower surface, and a connector housing configured to accommodate the terminal members therein and allow a connector connection portion formed at one side of an end of the circuit board to be fitted into and released from the connector housing.

Abstract: A display device including: a display unit including a substrate including a first region and a second region, first pixels are included in the first region, second pixels are included in the second region, first gate lines in the first region are connected to the first pixels, second gate lines in the second region are connected to the second pixels, and data lines are connected to the first and second pixels; and a compensator configured to compensate image data for the first and second pixels, based on correction values, and configured to generate corrected image data by decreasing a brightness of an over-compensated portion of the first and second pixels and increasing a brightness of an under-compensated portion of the first and second pixels in a boundary region between the first region and the second region.

Abstract: To solve the above problems, a pouch molding method according to an embodiment of the present invention includes: a seating step of seating a pouch film on a top surface of a die; a stripper descending step of allowing a stripper disposed above the die to descend; a fixing step of fixing the pouch film using the stripper; a molding preparation step of allowing a Blank holder disposed at a central portion of the die to ascend to contact one surface of the pouch film and allowing a punch disposed at a central portion of the stripper to descend to contact the other surface of the pouch film; and a molding step of allowing the punch and the Blank holder to descend along with each other to form a cup part in the pouch film.

Abstract: A PCB direct connector is directly mounted to a circuit board, and the PCB direct connector includes terminal members arranged in two rows to respectively contact upper conductive patterns and lower conductive patterns provided to an upper surface and a lower surface of the circuit board, and a connector housing configured to accommodate the terminal members therein and allow a connector connection portion formed at one side of an end of the circuit board to be fitted into and released from the connector housing.

Abstract: A vertical-type direct printed circuit board (PCB) connector including a connector housing directly mounted to one surface of a PCB substrate in a vertical type, and bending terminal members installed inside the connector housing and having one side extending in a first direction corresponding to a direction perpendicular to the one surface of the PCB substrate to be connected to a signal transmission cable and the other side extending in a second direction corresponding to a length direction of contact pads provided to the one surface of the PCB substrate to be connectable to the contact pads.

Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.

Abstract: A connector assembly with rounded edges, in which an end of a female connector is formed in a round shape and a guide groove having an inner dimension receiving a wire is formed at an end portion to guide the wire to be curved to correspond to the round shape at a wire harness inlet end and guide the curved wire to be received in the guide groove, thereby guiding reduction of tension of the curved wire and prevention of interference with an external structure.

Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.

Abstract: A connector having locking structure which are formed at left and right sides of a male connector and left and right sides of a female connector and used to doubly couple the male connector and the female connector, thereby preventing the male connector and the female connector in a coupled state from being warped to the left and right.

Abstract: An apparatus and method for storing security information are provided. The apparatus is generally an electronic device that includes a memory configured to include a secured region to store security information and a processor configured to electrically connect with the memory. The processor is further configured to execute an application program configured to store the security information in a first secured region, to receive a request to store the security information from the application program, and to store the security information in a second secured region different from the first secured region in response to the request.

Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.