Patents by Inventor Sung-Hyun Park

Sung-Hyun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154422
    Abstract: A power conversion system of a battery for a vehicle includes a bidirectional charger configured to output a first active line voltage between a first active line and a neutral line and a second active line voltage between a second active line and the neutral line at different levels by converting a voltage of a battery into an AC voltage in a battery discharge mode, and a wiring swap device configured to electrically connect the first active line to a load-side first active line and to cross and electrically connect the second active line and the neutral line to a load-side neutral line and a load-side second active line, respectively.
    Type: Application
    Filed: April 21, 2023
    Publication date: May 9, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Sung Uk Park, Jae Hyun Kim, Hyun Wook Seong, Dong Gyun Woo
  • Publication number: 20240150831
    Abstract: The present invention relates to a nucleic acid based self-assembled complex for Raman detection of a target nucleic acid, and use thereof. The present invention provides a nucleic acid based self-assembled complex of turn-off based way for detecting a target nucleic acid, which has a structural stability so as produce a reproducible scattering light signal regardless of Brownian motion in liquid and relates to a method of detecting a target nucleic acid as an optical signal such as a Raman signal through a nucleic acid based self-assembled complex performing Brownian motion in a liquid phase.
    Type: Application
    Filed: February 23, 2022
    Publication date: May 9, 2024
    Inventors: Dong-woo LEE, Su-min PARK, Sung Su KIM, Yujae HYUN
  • Patent number: 11974901
    Abstract: Disclosed is a small animal intraventricular injection compensator for injecting a drug into a desired location through a syringe, the compensator including: a guide part provided with a guide hole into which a needle of a syringe is inserted; a body comprising an upper cavity provided inside thereof and a cradle provided to seat the guide part on an upper side thereof; and a fixation part integrally provided with the body or separately provided, and comprising a lower cavity provided to allow a head accommodation space, which a head of a small animal may enter into or exit from, to be provided inside thereof by corresponding to the upper cavity.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: May 7, 2024
    Assignees: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
    Inventors: Sung Gurl Park, Kang Hyun Han, Chang Mook Lim, So Ra Park, Hong Su Lee, Jae Bong Lee, Jung Ho Noh, Sang Seop Han
  • Patent number: 11975076
    Abstract: The present invention relates to antibody-drug conjugates (ADCs) wherein a plurality of active agents are conjugated to an antibody through at least one branched linker. The branched linker may comprise a branching unit, and two active agents are coupled to the branching unit through a secondary linker and the branching unit is coupled to the antibody by a primary linker. The active agents may be the same or different. In certain such embodiments, two or more such branched linkers are conjugated to the antibody, e.g., 2-4 branched linkers, which may each be coupled to a different C-terminal cysteine of a heavy or light chain of the antibody. The branched linker may comprise one active agent coupled to the branching unit by a first branch and a second branch that comprises a polyethylene glycol moiety coupled to the branching unit. In certain such embodiments, two or more such branched linkers are conjugated to the antibody, e.g.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: May 7, 2024
    Assignee: LegoChem Biosciences, Inc.
    Inventors: Yong Zu Kim, Yeong Soo Oh, Jeiwook Chae, Ho Young Song, Chul-Woong Chung, Yun Hee Park, Hyo Jung Choi, Kyung Eun Park, Hyoungrae Kim, Jinyeong Kim, Ji Young Min, Sung Min Kim, Byung Soo Lee, Dong Hyun Woo, Ji Eun Jung, Su In Lee
  • Publication number: 20240131576
    Abstract: Proposed are a highly reliable metal molded article manufactured using a combination of a mold made of an anodic aluminum oxide film and a patternable mold, and a method for manufacturing the same.
    Type: Application
    Filed: February 21, 2022
    Publication date: April 25, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Patent number: 11968643
    Abstract: An apparatus and method of processing a positioning reference signal are disclosed. In some embodiments, the method includes determining a narrow-band (NB) positioning reference signal (PRS) bitmap indicating a pattern selecting NB PRS subframes, wherein each NB PRS subframe comprises an NB PRS for positioning an NB user equipment (UE), transmitting, to the NB UE, NB PRS configuration information for the NB UE, the NB PRS configuration information comprising the NB PRS bitmap, determining, by a reference cell and based on the NB PRS bitmap, NB PRS subframes of the reference cell, mapping, by the reference cell, a first NB PRS in the NB PRS subframes of the reference cell, and receiving, from the NB UE and in response to the first NB PRS, a reference signal time difference (RSTD) measurement.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: April 23, 2024
    Assignee: Innovative Technology Lab Co., Ltd.
    Inventors: Sung Jun Yoon, Dong Hyun Park
  • Publication number: 20240128136
    Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.
    Type: Application
    Filed: February 16, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Wook PARK, Seong Hun NA, Jae Hyun JUNG, Kwang Su KIM, Sung Jun LEE, Yong Suk KIM, Dong Hyun PARK
  • Patent number: 11961742
    Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: April 16, 2024
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Jong Sik Paek, Doo Hyun Park, Seong Min Seo, Sung Geun Kang, Yong Song, Wang Gu Lee, Eun Young Lee, Seo Yeon Ahn, Pil Je Sung
  • Publication number: 20240118337
    Abstract: Proposed are a guide plate and a test device including the guide plate capable of being insulated from electrically conductive contact pins and capable of blocking signal interference between the electrically conductive contact pins.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 11, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Publication number: 20240119211
    Abstract: A semiconductor design optimization system that includes: a data base configured to store design data, a training data preprocessing unit configured to preprocess the design data and generate training data, a data learning unit configured to generate a physical property prediction model by training using the training data, a physical property prediction unit configured to generate predicted physical property data including information associated with predicted physical property values for each region of a semiconductor device to be fabricated, wherein the physical property prediction unit is configured to input, into the physical property prediction model, input data including information associated with design drawings of the semiconductor device to be fabricated, and a layout generator configured generate a design layout optimized to distribute the predicted physical property values for each region of the semiconductor device to be fabricated by modifying the design drawings based on the predicted physical
    Type: Application
    Filed: June 6, 2023
    Publication date: April 11, 2024
    Applicants: Samsung Electronics Co., Ltd., Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Eun-Ho Lee, Jae Choon Kim, Tae-Hyun Kim, Jeong-Hyeon Park, Hwanjoo Park, Sunggu Kang, Sung-Ho Mun
  • Publication number: 20240120475
    Abstract: The present disclosure relates to a cathode active material for an all-solid-state battery with a controlled particle size and a method for preparing the same. In particular, the cathode active material includes lithium and a transition metal, wherein the cathode active material has a single peak in the range of 1 ?m to 10 ?m as a result of particle size distribution (PSD) analysis.
    Type: Application
    Filed: May 4, 2023
    Publication date: April 11, 2024
    Inventors: Sung Woo NOH, Hong Seok MIN, Sang Heon LEE, Jeong Hyun SEO, Im Sul SEO, Chung Bum LIM, Ju Yeong SEONG, Je Sik PARK
  • Publication number: 20240120323
    Abstract: The present disclosure relates to an apparatus for fabricating a display panel including: an attachment member having a fixing portion in a pressurization direction to which a pressurization header is fixed, an attachment driving member configured to move the attachment member and the pressurization header in the pressurization direction or a detachment direction through a fixing frame of the attachment member, a first pressure sensing module between the pressurization header and the attachment member and configured to generate first pressure detection signals according to pressure applied to the pressurization header, a gradient setting module configured to set a gradient of the pressurization header based on magnitudes of the first pressure detection signals, and a gradient control module configured to adjust gradients of the pressurization header, the attachment member, and the fixing frame according to control of the gradient setting module.
    Type: Application
    Filed: September 6, 2023
    Publication date: April 11, 2024
    Inventors: Tae Hee LEE, Sung Kook PARK, Kyung Ho KIM, Young Seok SEO, Jae Gwang UM, Sang Hyun LEE, Hyung Suk HWANG
  • Patent number: 11954644
    Abstract: Provided is an electronic apparatus and a method thereof. The method includes identifying pickup item information, identifying at least one storage place corresponding to the pickup item information among a plurality of storage places in the item storage center based on information on or regarding an item group located at each of the plurality of storage places, and providing information on the identified storage place and the pickup item information to a manager terminal, wherein the item group comprises at least one same item corresponding to an item group, and at least a portion of a plurality of item groups comprising a same item are stored in different storage places in the item storage center.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: April 9, 2024
    Assignee: Coupang Corp.
    Inventors: Hyeon Chang Baek, Chang Hyun Kim, Sang Ho Yim, Sung Jin Park, Chang Geun Jin, Lianxi Bai
  • Patent number: 11956426
    Abstract: Disclosed herein are a decoding method and apparatus and an encoding method and apparatus for deriving an intra-prediction mode. An intra-prediction mode may be derived using a method for deriving an intra-prediction mode based on a neighbor block of the target block, a method for deriving an intra-prediction mode using signaling of the intra-prediction mode of the target block, or a method for deriving an adaptive intra-prediction mode based on the type of a target slice. An MPM list may be used to derive the intra-prediction mode, and a temporal neighbor block or the like may be used to configure the MPM list.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: April 9, 2024
    Assignees: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Korea Aerospace University, Industry-Academia Cooperation Group of Sejong University
    Inventors: Jin-Ho Lee, Jae-Gon Kim, Jung-Won Kang, Do-Hyeon Park, Yung-Lyul Lee, Ha-Hyun Lee, Sung-Chang Lim, Hui-Yong Kim, Ji-Hoon Do, Yong-Uk Yoon
  • Patent number: 11951890
    Abstract: Proposed are a seat side bolster apparatus and a control method thereof. The seat side bolster apparatus of the disclosure includes a driving unit, which is provided under a foam pad of a seat cushion, is moved upwards and downwards by operation of an actuator, and presses the foam pad upwards when moving upwards, and a covering bracket, which is connected to the driving unit so as to be moved upwards and downwards together with the driving unit and to which an end of a covering enveloping the foam pad of the seat cushion is fixed.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: April 9, 2024
    Assignee: HYUNDAI TRANSYS INCORPORATED
    Inventors: Jae Keun Park, Do Hyun Kim, Sung Hyun Jo, Seung Joon Lee, Jae Sang Lim
  • Publication number: 20240112968
    Abstract: Proposed are an anodic aluminum oxide film-based interposer for electrical connection and a manufacturing method therefor, a semiconductor package and a manufacturing method therefor, a multi-stacked semiconductor device and a manufacturing method therefor, and a display and a manufacturing method therefor that can cope with a narrow pitch between terminals and prevent an increase in current density and thermal energy density in a bump connection part. To this end, proposed is an interposer for electrical connection, in which a through-hole is provided in a body made of anodic aluminum oxide film and a first bonding material, an electrically conductive material, and a second bonding material are formed in the through-hole by electroplating. Here, fine trenches having repeated peaks and valleys in the circumferential direction are provided in an outer circumferential surface of a micro-bump.
    Type: Application
    Filed: March 23, 2022
    Publication date: April 4, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Publication number: 20240107002
    Abstract: A method for coding image information includes generating prediction information by predicting information on a current coding unit, and determining whether the information on the current coding unit is the same as the prediction information. When the information on the current coding unit is the same as the prediction information, a flag indicating that the information on the current coding unit is the same as the prediction information is coded and transmitted. When the information on the current coding unit is not the same as the prediction information, a flag indicating that the information on the current coding unit is not the same as the prediction information and the information on the current coding unit are coded and transmitted.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Applicants: Electronics and Telecommunications Research Institute, University-Industry Cooperation Group of Kyung Hee University
    Inventors: Se Yoon JEONG, Hui Yong KIM, Sung Chang LIM, Jin Ho LEE, Ha Hyun LEE, Jong Ho KIM, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Gwang Hoon PARK, Kyung Yong KIM, Tae Ryong KIM, Han Soo LEE
  • Publication number: 20240102611
    Abstract: A low profile flat bombe for Liquefied Petroleum Gas (LPG) storage and method for manufacturing the same, may include a flat bombe body including an upper plate having a plurality of first piercing holes and a pump installation hole formed therethrough, a lower plate having a plurality of second piercing holes formed therethrough at positions vertically coinciding with the plurality of first piercing holes, and side plates integrally connecting first and second side end portions of the upper and lower plates, end plates mounted at front and rear openings in the flat bombe body, and support pipes, wherein upper end portions of the support pipes are welded to internal circumferential portions of the plurality of first piercing holes and lower end portions thereof are welded to internal circumferential portions of the plurality of second piercing holes to maintain a vertical distance between the upper and lower plates.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DAE HUNG PRECISION IND'L CO., LTD.
    Inventors: Seong Cheol Cho, Sung Won Lee, Ju Tae Song, Seung Hyun Yeo, Duk Hee Park
  • Patent number: 11939505
    Abstract: Provided are a silicon nitride film etching composition, a method of etching a silicon nitride film using the same, and a manufacturing method of a semiconductor device. Specifically, a silicon nitride film may be stably etched with a high selection ratio relative to a silicon oxide film, and when the composition is applied to an etching process at a high temperature and a semiconductor manufacturing process, not only no precipitate occurs but also anomalous growth in which the thickness of the silicon oxide film is rather increased does not occur, thereby minimizing defects and reliability reduction.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: ENF Technology Co., Ltd.
    Inventors: Dong Hyun Kim, Hyeon Woo Park, Sung Jun Hong, Myung Ho Lee, Myung Geun Song, Hoon Sik Kim, Jae Jung Ko, Myong Euy Lee, Jun Hyeok Hwang
  • Patent number: 11938822
    Abstract: The button structure including a front panel configured to define a body and having a mounting hole formed in a front surface of the front panel directed toward an interior of an occupant compartment, a button unit accommodated in the mounting hole and configured to selectively control various types of AV systems of a vehicle, a detection unit accommodated in the front panel and configured to detect a user's hand, a switch unit configured to operate various types of AV systems of the vehicle under the control of the button unit, and a lighting unit accommodated in a housing and configured to emit light to the button unit in response to a detection signal of the detection unit, in which the detection unit is disposed rearward of the button unit and positioned from the button unit in a direction opposite to the direction toward the interior of the occupant compartment.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: March 26, 2024
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventors: Sung Hyun Park, Jun Seong Seo, Sol Ji Yoo