Patents by Inventor Sung-Hyung Lee

Sung-Hyung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HETERODIMERIC ANTIBODIES THAT BIND CD3 AND TUMOR ANTIGENS
    Publication number: 20220162343
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Application
    Filed: December 3, 2021
    Publication date: May 26, 2022
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • HETERODIMERIC ANTIBODIES THAT BIND CD3 AND TUMOR ANTIGENS
    Publication number: 20220041757
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Application
    Filed: October 18, 2021
    Publication date: February 10, 2022
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Heterodimeric antibodies that bind somatostatin receptor 2
    Patent number: 11225521
    Abstract: The present invention is directed to antibodies, including novel antigen binding domains and heterodimeric antibodies, that bind somatostatin receptor 2 (SSTR2).
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: January 18, 2022
    Assignee: Xencor, Inc.
    Inventors: Gregory Moore, Rumana Rashid, Sung-Hyung Lee, Paul Foster
  • Heterodimeric antibodies that bind CD3 and tumor antigens
    Patent number: 11225528
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: January 18, 2022
    Assignee: Xencor, Inc.
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • SEMICONDUCTOR DEVICE
    Publication number: 20210375906
    Abstract: A semiconductor device includes a first substrate including a cell region and surrounded by an extension region, a common source plate on the first substrate, a supporter on the common source plate, a first stack structure on the supporter and including an alternately stacked first insulating film and first gate electrode, a channel hole penetrating the first stack structure, the supporter, and the common source plate on the cell region, and an electrode isolation trench spaced apart from the channel hole in a first direction on the cell region, extending in a second direction, and penetrating the first stack structure, the supporter, and the common source plate, wherein a first thickness of the supporter in a first region adjacent to the electrode isolation trench is greater than a second thickness of the supporter in a second region formed between the electrode isolation trench and the channel hole.
    Type: Application
    Filed: August 11, 2021
    Publication date: December 2, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kang Min KIM, Jin Hyuk KIM, Jung Tae SUNG, Joong Shik SHIN, Sung Hyung LEE
  • Semiconductor device
    Patent number: 11121148
    Abstract: A semiconductor device includes a first substrate including a cell region and surrounded by an extension region, a common source plate on the first substrate, a supporter on the common source plate, a first stack structure on the supporter and including an alternately stacked first insulating film and first gate electrode, a channel hole penetrating the first stack structure, the supporter, and the common source plate on the cell region, and an electrode isolation trench spaced apart from the channel hole in a first direction on the cell region, extending in a second direction, and penetrating the first stack structure, the supporter, and the common source plate, wherein a first thickness of the supporter in a first region adjacent to the electrode isolation trench is greater than a second thickness of the supporter in a second region formed between the electrode isolation trench and the channel hole.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: September 14, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kang Min Kim, Jin Hyuk Kim, Jung Tae Sung, Joong Shik Shin, Sung Hyung Lee
  • Heterodimeric antibodies that bind CD3 and tumor antigens
    Patent number: 11111315
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: September 7, 2021
    Assignee: Xencor, Inc.
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • SEMICONDUCTOR DEVICE
    Publication number: 20210202516
    Abstract: A semiconductor device includes a first substrate including a cell region and surrounded by an extension region, a common source plate on the first substrate, a supporter on the common source plate, a first stack structure on the supporter and including an alternately stacked first insulating film and first gate electrode, a channel hole penetrating the first stack structure, the supporter, and the common source plate on the cell region, and an electrode isolation trench spaced apart from the channel hole in a first direction on the cell region, extending in a second direction, and penetrating the first stack structure, the supporter, and the common source plate, wherein a first thickness of the supporter in a first region adjacent to the electrode isolation trench is greater than a second thickness of the supporter in a second region formed between the electrode isolation trench and the channel hole.
    Type: Application
    Filed: June 26, 2020
    Publication date: July 1, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kang Min KIM, Jin Hyuk KIM, Jung Tae SUNG, Joong Shik SHIN, Sung Hyung LEE
  • HETERODIMERIC ANTIBODIES THAT BIND CD3 AND TUMOR ANTIGENS
    Publication number: 20210102003
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Application
    Filed: December 16, 2020
    Publication date: April 8, 2021
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Heterodimeric antibodies that bind CD3 and tumor antigens
    Patent number: 10913803
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: February 9, 2021
    Assignee: Xencor, Inc.
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Heterodimeric antibodies that bind CD3 and tumor antigens
    Patent number: 10889653
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: January 12, 2021
    Assignee: Xencor, Inc.
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • HETERODIMERIC ANTIBODIES THAT BIND ENPP3 AND CD3
    Publication number: 20200317814
    Abstract: The present invention is directed to antibodies, including novel antigen binding domains and heterodimeric antibodies, that bind Ectonucleotide pyrophosphatase/phosphodiesterase family member 3 (ENPP3).
    Type: Application
    Filed: February 28, 2020
    Publication date: October 8, 2020
    Inventors: Rumana Rashid, Umesh S. Muchhal, Gregory Moore, Alex Nisthal, Seung Chu, Sung-Hyung Lee, Yoon Kyung Kim
  • TRISPECIFIC ANTIBODIES
    Publication number: 20190352416
    Abstract: Provided herein are trispecific antibodies that include a) a first monomer, b) a second monomer, and c) a light chain. The first monomer includes a first variant Fc domain and a variable heavy domain, the second monomer includes a second variant Fc domain and a first scFv domain and the light chain includes a variable light domain. The variable heavy domain and the variable light domain form an antigen binding domain. The trispecific antibody further includes a second scFv domain on either the first or second monomers.
    Type: Application
    Filed: August 2, 2019
    Publication date: November 21, 2019
    Inventors: Gregory Moore, John Desjarlais, Seung Chu, Sung-Hyung Lee
  • Trispecific antibodies
    Patent number: 10428155
    Abstract: The invention provides trispecific antibodies that co-engage CD3, CD8 and a tumor target antigen.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: October 1, 2019
    Assignee: Xencor, Inc.
    Inventors: Gregory Moore, John Desjarlais, Seung Chu, Sung-Hyung Lee
  • HETERODIMERIC ANTIBODIES THAT BIND SOMATOSTATIN RECEPTOR 2
    Publication number: 20190248898
    Abstract: The present invention is directed to antibodies, including novel antigen binding domains and heterodimeric antibodies, that bind somatostatin receptor 2 (SSTR2)
    Type: Application
    Filed: April 24, 2019
    Publication date: August 15, 2019
    Inventors: Gregory Moore, Rumana Rashid, Sung-Hyung Lee, Paul Foster
  • HETERODIMERIC ANTIBODIES THAT BIND CD3 AND TUMOR ANTIGENS
    Publication number: 20190202938
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Application
    Filed: March 14, 2019
    Publication date: July 4, 2019
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Heterodimeric antibodies that bind somatostatin receptor 2
    Patent number: 10316088
    Abstract: The present invention is directed to antibodies, including novel antigen binding domains and heterodimeric antibodies, that bind somatostatin receptor 2 (SSTR2).
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: June 11, 2019
    Assignee: Xencor, Inc.
    Inventors: Gregory Moore, Rumana Rashid, Sung-Hyung Lee, Paul Foster
  • Heterodimeric antibodies that bind CD3 and tumor antigens
    Patent number: 10259887
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: April 16, 2019
    Assignee: Xencor, Inc.
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • HETERODIMERIC ANTIBODIES THAT BIND CD3 AND TUMOR ANTIGENS
    Publication number: 20180282432
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Application
    Filed: April 4, 2018
    Publication date: October 4, 2018
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • HETERODIMERIC ANTIBODIES THAT BIND CD3 AND TUMOR ANTIGENS
    Publication number: 20180223000
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Application
    Filed: April 4, 2018
    Publication date: August 9, 2018
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee