Abstract: The present disclosure provides autotaxin (ATX) inhibitor compounds and compositions including said compounds. The present disclosure also provides methods of using said compounds and compositions for inhibiting ATX. Also provided are methods of preparing said compounds and compositions, and synthetic precursors of said compounds.

Abstract: Proposed are a seat side bolster apparatus and a control method thereof. The seat side bolster apparatus of the disclosure includes a driving unit, which is provided under a foam pad of a seat cushion, is moved upwards and downwards by operation of an actuator, and presses the foam pad upwards when moving upwards, and a covering bracket, which is connected to the driving unit so as to be moved upwards and downwards together with the driving unit and to which an end of a covering enveloping the foam pad of the seat cushion is fixed.

Abstract: A scrubber system may include a scrubber housing including a vertically extended cleaning space, an inflow chamber coupled to a bottom portion of the scrubber housing, and first and second inflow portions, each of which is configured to supply a gas into the inflow chamber. The inflow chamber may include a mixing space, and the mixing space may be connected to the cleaning space. The first inflow portion may include a first connection pipe coupled to the inflow chamber to provide a first connection path and the second inflow portion may include a second connection pipe coupled to the inflow chamber to provide a second connection path. The first and second connection paths may be extended toward the mixing space in opposite directions, respectively, and may be connected to opposite portions of the mixing space, respectively.

Abstract: A light-emitting element includes a first semiconductor layer, a light-emitting layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the light-emitting layer, a device electrode layer disposed on the second semiconductor layer, a reflective electrode layer disposed on the device electrode layer, an insulating film surrounding a side surface of the light-emitting layer, a side surface of the second semiconductor layer, and a side surface of the device electrode layer, and a reflective layer surrounding a side surface of the insulating film, wherein the side surface of the device electrode layer is aligned with a side surface of the reflective electrode layer.

Abstract: The present invention relates to a heteroaryl derivative compound and a use thereof. Since the heteroaryl derivative of the present invention exhibits excellent inhibitory activity against EGFR, the heteroaryl derivative can be usefully used as a therapeutic agent for EGFR-associated diseases.

Abstract: The present invention provides methods for treating or ameliorating metabolic diseases, cholestatic liver diseases, or organ fibrosis, which comprises administering to a subject a therapeutically effective amount of a pharmaceutical composition comprising an isoxazole derivative, a racemate, an enantiomer, or a diastereoisomer thereof, or a pharmaceutically acceptable salt of the derivative, the racemate, the enantiomer, or the diastereoisomer.

Abstract: A semiconductor package includes a first substrate, a semiconductor chip on the first substrate, a second substrate spaced apart from the first substrate, a wire spaced apart from a lateral surface of the semiconductor chip and connecting the first substrate to the second substrate, a mold structure on a top surface of the semiconductor chip, the lateral surface of the semiconductor chip, and a lateral surface of the wire, and an under-fill pattern on the lateral surface of the wire and is between the wire and the mold structure.

Abstract: Provided is a polyester-based resin composition including: (a) at least one type of dicarboxylic acid component selected from an aromatic dicarboxylic acid and an ester-forming derivative of the aromatic dicarboxylic acid; (b) a bisphenyl fluorene-based diol component; and (c) a tetracyclobutane-based diol component, wherein a content of the bisphenyl fluorene-based diol component is 20 to 90 mol % relative to the total of the diol component and a glass transition temperature (Tg) is greater than or equal to 100° C.

Abstract: Provided is a portable IPL sterilizer comprising: a body partitioned into a central region and a peripheral region surrounding at least a portion of the central region; a xenon lamp light source for sterilization provided in the central region of the body; and a light-shielding comb part provided in the peripheral region of the body.

Abstract: The present invention relates to a composition for a non-pneumatic tire spoke. In particular, the non-pneumatic tire spoke prepared from the composition for a non-pneumatic tire spoke has excellent mechanical properties. A composition for a non-pneumatic tire spoke includes a thermoplastic polyester elastomer, a silane-based interfacial binder, and silica particles. The silica particles have an average particle diameter of 100 to 300 ?m.

Abstract: A semiconductor package includes a semiconductor chip, and a connection structure disposed on at least one side of the semiconductor chip, and including an insulating layer and a redistribution layer electrically connected to the semiconductor chip, wherein the redistribution layer includes a plurality of conductive patterns, and at least two of the plurality of conductive patterns have different degrees of surface roughness, and a conductive pattern having a higher surface roughness has a width wider than a width of a conductive pattern having a lower surface roughness.

Abstract: A semiconductor device includes a plurality of main contact plugs and a plurality of dummy contact plugs which pass through an insulating layer on a substrate. A plurality of upper interconnections is on the insulating layer. The plurality of dummy contact plugs include a first dummy contact plug. The plurality of upper interconnections include a first upper interconnection overlapping the first dummy contact plug. A vertical central axis of the first dummy contact plug is located outside the first upper interconnection.

Abstract: The present invention relates to a composition for a non-pneumatic tire spoke. In particular, the non-pneumatic tire spoke prepared from the composition for a non-pneumatic tire spoke has excellent mechanical properties. A composition for a non-pneumatic tire spoke includes a thermoplastic polyester elastomer, a silane-based interfacial binder, and silica particles. The silica particles have an average particle diameter of 100 to 300 ?m.

Abstract: A semiconductor package includes a connection structure including one or more redistribution layers, a semiconductor chip disposed on the connection structure and electrically connected to the one or more redistribution layers, an encapsulant disposed on the connection structure and covering at least a portion of the semiconductor chip, and a shielding structure covering at least a portion of the encapsulant. The shielding structure includes a conductive pattern layer having a plurality of openings, a first metal layer covering the conductive pattern layer and extending across the plurality of openings, and a second metal layer covering the first metal layer. The second metal layer has a thickness greater than a thickness of the first metal layer.

Abstract: A fan-out semiconductor package includes a frame comprising a plurality of wiring layers electrically connected to one another, and having a recessed portion having a stopper layer 112aM disposed on a bottom surface of the recessed portion, and a through-hole penetrating through the stopper layer; a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, and disposed in the recessed portion such that the inactive surface opposes the stopper layer; an encapsulant covering at least portions of the frame and the inactive surface of the semiconductor chip, and filling at least a portion of the recessed portion; and an interconnect structure disposed on the frame and the active surface of the semiconductor chip, and comprising a redistribution layer electrically connected to the plurality of wiring layers and the connection pad.

Abstract: A thermoplastic elastomer resin composition for a moisture-permeable waterproof film includes a thermoplastic elastomer resin composed of a hard segment containing polybutylene terephthalate and a soft segment containing polyethylene glycol and polytetramethylene glycol, wherein the polyethylene glycol is contained in an amount of 30 to 70 wt % and the polytetramethylene glycol is contained in an amount of 1 to 10 wt %, based on the total weight of the thermoplastic elastomer resin. A moisture-permeable waterproof film formed of the elastomer composition and a moisture-permeable waterproof fabric in which the moisture-permeable waterproof film is stacked on at least one surface of a substrate fiber are also provided.

Abstract: A semiconductor package includes a semiconductor chip, and a connection structure disposed on at least one side of the semiconductor chip, and including an insulating layer and a redistribution layer electrically connected to the semiconductor chip, wherein the redistribution layer includes a plurality of conductive patterns, and at least two of the plurality of conductive patterns have different degrees of surface roughness, and a conductive pattern having a higher surface roughness has a width wider than a width of a conductive pattern having a lower surface roughness.

Abstract: A semiconductor package includes a connection structure including one or more redistribution layers, a semiconductor chip disposed on the connection structure and electrically connected to the one or more redistribution layers, an encapsulant disposed on the connection structure and covering at least a portion of the semiconductor chip, and a shielding structure covering at least a portion of the encapsulant. The shielding structure includes a conductive pattern layer having a plurality of openings, a first metal layer covering the conductive pattern layer and extending across the plurality of openings, and a second metal layer covering the first metal layer. The second metal layer has a thickness greater than a thickness of the first metal layer.

Abstract: A method of generating a layout and manufacturing a semiconductor device, including receiving a design layout of a semiconductor device including active fins; extracting a design rule of the active fins from the design layout; forming fin lines overlapping the active fins such that the fin lines have a length that is greater than a length of the active fins, wherein the fin lines continuously extend from a position adjacent to one edge of a layout region of the semiconductor device toward another edge, and are formed in an entirety of the layout region of the semiconductor device; forming a mandrel pattern layout in an entirety of the layout region of the semiconductor device, using the fin lines; and forming a cut pattern layout in the entirety of the layout region of the semiconductor device, using the active fins.

Abstract: A fan-out semiconductor package includes a frame comprising a plurality of wiring layers electrically connected to one another, and having a recessed portion having a stopper layer 112aM disposed on a bottom surface of the recessed portion, and a through-hole penetrating through the stopper layer; a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, and disposed in the recessed portion such that the inactive surface opposes the stopper layer; an encapsulant covering at least portions of the frame and the inactive surface of the semiconductor chip, and filling at least a portion of the recessed portion; and an interconnect structure disposed on the frame and the active surface of the semiconductor chip, and comprising a redistribution layer electrically connected to the plurality of wiring layers and the connection pad.