Patents by Inventor Sung Kwon Wi

Sung Kwon Wi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130300527
    Abstract: The present invention relates to a method of manufacturing a coil element and a coil element, which include a process of forming, aligning, and coupling a first auxiliary layer and a second auxiliary layer of which coil portions formed of a plating pattern are disposed on a substrate or an insulating layer, and it is possible to overcome limitations due to collapse or deformation of a photoresist pattern even when forming a fine-pitch fine conductor coil with a high aspect ratio by applying a plating method using a photoresist pattern.
    Type: Application
    Filed: March 13, 2013
    Publication date: November 14, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Suk KIM, Sung Kwon WI, Ju Hwan YANG, Won Chul SIM, Jeong Bok KWAK, Jeong Min CHO, Young Seuck YOO, Sang Moon LEE
  • Publication number: 20130263440
    Abstract: Disclosed herein is a method for manufacturing an inductor, including: forming a coil laminate by inserting spiral coils into a guide shaft disposed at a center of a magnetic substrate; providing a molding part so as to surround the coil laminate; removing the guide shaft; and providing a ferrite composite so as to surround the molding part.
    Type: Application
    Filed: December 21, 2012
    Publication date: October 10, 2013
    Inventors: Sang Moon Lee, Jung Min Park, Sung Kwon Wi, Young Seuck Yoo, Yong Suk Kim
  • Publication number: 20130265131
    Abstract: The present invention relates to an electronic component having a primary coil pattern and a secondary coil pattern with at least one selected from a dielectric and an insulator interposed therebetween, which includes at least one discharge terminal for discharging overvoltage or overcurrent applied to the primary coil pattern or the secondary coil pattern, and a method for manufacturing the same. Since it is possible to efficiently discharge overvoltage or overcurrent applied to an electronic component, it is possible to improve reliability of various electronic devices to which the electronic component in accordance with an embodiment of the present invention is applied as well as to extend lifespan of the electronic component itself.
    Type: Application
    Filed: March 13, 2013
    Publication date: October 10, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan YANG, Sang Moon Lee, Young Seuck Yoo, Sung Kwon Wi
  • Publication number: 20130241684
    Abstract: Disclosed herein are a method for manufacturing common mode filter and a common mode filter. The method includes: performing electroplating on first coil patterns made of a conductive material to form second coil patterns having a cross-sectional area increased as compared to the first coil patterns. Therefore, the common mode filter fulfilling a miniaturization demand and having the improved characteristics such as the inductance, the DC resistance, and the like, may be implemented.
    Type: Application
    Filed: March 4, 2013
    Publication date: September 19, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan YANG, Won Chul SIM, Young Seuck YOO, Sung Kwon WI
  • Publication number: 20130234819
    Abstract: The present invention relates to a common mode filter and a method of manufacturing the same and provides a thin film type common mode filter including: a first magnetic substrate; a first laminate disposed on the first magnetic substrate and including a primary coil pattern electrode; a core magnetic layer disposed on the first laminate; a second laminate disposed on the core magnetic layer and including a secondary coil pattern electrode; and a second magnetic substrate disposed on the second laminate.
    Type: Application
    Filed: February 13, 2013
    Publication date: September 12, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Seuck YOO, Sung Kwon WI, Jong Yun LEE, Sang Moon LEE, Won Chul SIM, Jeong Bok KWAK, Kang Heon HUR, Yong Suk KIM
  • Publication number: 20130234820
    Abstract: Disclosed herein are a common mode filter and a fabrication method thereof. The common mode filter includes: a first magnetic substrate; a laminate including insulating sheets with coil pattern electrodes printed thereon, having holes therein, and provided on the first magnetic substrate; a magnetic core inserted into the hole; and a second magnetic substrate integrally formed with the magnetic core and provided on the laminate.
    Type: Application
    Filed: February 26, 2013
    Publication date: September 12, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Seuck YOO, Sung Kwon WI, Jong Yun LEE, Sang Moon LEE, Won Chul SIM, Jeong Bok KWAK, Kang Heon HUR, Yong Suk KIM
  • Publication number: 20130169399
    Abstract: There is provided a thin film-type coil component having a size equal to or less than 0806 and including a ceramic main body, external electrodes including a plurality of first external electrodes formed on one surface of the ceramic main body and a plurality of second external electrodes formed on the other surface facing one surface of the ceramic main body, and a coil unit including a plurality of coil layers stacked in the ceramic main body, thereby obtaining low direct current (DC) resistance.
    Type: Application
    Filed: March 12, 2012
    Publication date: July 4, 2013
    Inventors: Young Seuck YOO, Young Ghyu Ahn, Yong Suk Kim, Sung Kwon Wi, Sang Soo Park, Kang Heon Hur
  • Publication number: 20130169381
    Abstract: The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.
    Type: Application
    Filed: March 23, 2012
    Publication date: July 4, 2013
    Inventors: Yong Suk KIM, Sung Kwon Wi, Jeong Bok Kwak, Sang Moon Lee, Won Chul Sim, Young Seuck Yoo
  • Publication number: 20130162371
    Abstract: The present invention discloses a filter for removing noise, which includes: a lower magnetic body; an insulating layer provided on the lower magnetic body and including at least one conductor pattern; and an upper magnetic body including a primary ferrite composite provided on the insulating layer and a secondary ferrite composite provided on the primary ferrite composite to cover a pore formed on a surface of the primary ferrite composite, and a method of manufacturing the same. According to the present invention, it is possible to implement a filter for removing noise with high performance and characteristics by increasing magnetic permeability and improving impedance characteristics through simple structure and process.
    Type: Application
    Filed: March 22, 2012
    Publication date: June 27, 2013
    Inventors: Sang Moon Lee, Sung Kwon WI, Jeong Bok KWAK, Won Chul SIM, Young Seuck YOO, Yong Suk KIM
  • Publication number: 20130154767
    Abstract: The present invention discloses a filter for removing noise, which includes: a lower magnetic substrate; a coil layer disposed on the lower magnetic substrate and including at least one conductor pattern and an insulating layer covering the conductor pattern; an upper magnetic substrate disposed on the coil layer; and a magnetic permeability enhancing layer disposed on the magnetic substrate with lower magnetic permeability of the lower magnetic substrate and the upper magnetic substrate. According to the present invention, it is possible to implement a filter for removing noise with high performance, characteristics, and reliability by increasing magnetic permeability to improve impedance characteristics and improving an effect of shielding electromagnetic waves such as jamming.
    Type: Application
    Filed: March 14, 2012
    Publication date: June 20, 2013
    Inventors: Yong Suk Kim, Young Ghyu Ahn, Young Seuck Yoo, Jeong Bok Kwak, Sang Moon Lee, Kang Heon Hur, Sung Kwon Wi
  • Publication number: 20130141205
    Abstract: A conductor pattern of a coil part formed in a spiral shape on a magnetic substrate, which includes: a primary conductor pattern; and a secondary conductor pattern formed on the primary conductor pattern. The primary conductor pattern is formed to have a longitudinal section including a first horizontal portion and a first vertical portion electrically connected to an end portion of one surface of the first horizontal portion. The secondary conductor pattern is formed to have a longitudinal section including a second horizontal portion corresponding to the first horizontal portion and a second vertical portion electrically connected to an end portion of one surface of the second horizontal portion.
    Type: Application
    Filed: March 14, 2012
    Publication date: June 6, 2013
    Inventors: Sang Moon LEE, Yong Suk KIM, Jeong Bok KWAK, Young Seuck YOO, Sung Kwon WI
  • Publication number: 20130135074
    Abstract: The present invention relates to a stacked chip inductor. According to one aspect of the present invention, provided is an inductor including: a stacked structure; and an external electrode structure formed outside of the stacked structure, wherein the stacked structure: an insulating layer; and a polymer layer is stacked on the insulating layer.
    Type: Application
    Filed: February 22, 2012
    Publication date: May 30, 2013
    Inventors: Sung Kwon Wi, Young Seuck Yoo, Jeong Bok Kwak, Yong Suk Kim, Sang Moon Lee, Kang Heon Hur
  • Publication number: 20130082813
    Abstract: A coil part is provided. The coil part includes a coil layer, a lower magnetic layer, and an upper magnetic layer. The coil layer includes a primary coil pattern, a secondary coil pattern, and a dielectric including the primary coil pattern and the secondary coil pattern. The lower magnetic layer is disposed under the coil layer. The upper magnetic layer is disposed on the lower magnetic layer to fill up the center and the periphery of the coil layer and cover the coil layer. Accordingly, the coil part can improve filtering characteristics by more smoothly increasing a magnetic flux surrounding the coil pattern. Also, the coil part can cut fabrication costs by reducing the length of the coil pattern with respect to the same characteristics.
    Type: Application
    Filed: September 15, 2012
    Publication date: April 4, 2013
    Inventors: Sung Kwon WI, Young Seuck Yoo, Jeong Bok Kwak, Yong Suk Kim, Sang Moon Lee, Young Ghyu Ahn
  • Publication number: 20130082812
    Abstract: A coil part is provided. The coil part includes a coil layer including a core and a first coil and a second coil disposed on and under the core, a lower magnetic layer bonded under the coil layer, and an upper magnetic layer bonded on the coil layer. Accordingly, it is possible to improve process and productivity and cut fabrication costs by preventing process defects that occur during the fabrication process of a coil part using a ferrite substrate.
    Type: Application
    Filed: March 6, 2012
    Publication date: April 4, 2013
    Inventors: Young Seuck Yoo, Jeong Bok Kwak, Yong Suk Kim, Sang Moon Lee, Kang Heon Hur, Sung Kwon Wi
  • Publication number: 20130057378
    Abstract: Disclosed herein are a magnetic substrate, a common mode filter, a method for manufacturing a magnetic substrate, and a method for manufacturing a common mode filter. The common mode filter includes: a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part, wherein the magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon.
    Type: Application
    Filed: August 9, 2012
    Publication date: March 7, 2013
    Inventors: Sung Kwon WI, Jeong Bok KWAK, Sang Moon LEE, Young Seuck YOO, Yong Suk KIM
  • Publication number: 20130052439
    Abstract: The present invention provides a magnetic substrate, which comprises a first magnetic layer made of a first magnetic material; and a second magnetic layer made of a second magnetic material, wherein the first and second magnetic materials are equal each other, and have different grain sizes.
    Type: Application
    Filed: August 7, 2012
    Publication date: February 28, 2013
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong Suk KIM, Kang Heon HUR, Sang Moon LEE, Young Seuck YOO, Jeong Bok KWAK, Sung Kwon WI
  • Publication number: 20130049917
    Abstract: Disclosed herein are a conductor pattern of an electronic component formed in an oval coil shape on a magnetic substrate, the conductor pattern including: a straight part; and a curved part connected to the straight part at both sides thereof, wherein a line width of the curved part is smaller than that of the straight part, and an electronic component including the same. With the conductor pattern and the electronic component including the same according to the present invention, the high precision fine line width and the high resolution conductor pattern may be implemented to improve connectivity, thereby improving characteristics and reliability of the electronic component.
    Type: Application
    Filed: August 28, 2012
    Publication date: February 28, 2013
    Inventors: Yong Suk KIM, Sung Kwon Wi, Sang Moon Lee, Young Seuck Yoo, Jeong Bok Kwak
  • Publication number: 20130043764
    Abstract: Disclosed herein is an ultrasonic sensor including: a conductive case; a piezoelectric element fixed to a bottom surface of the case through a conductive adhesive; a temperature compensation capacitor positioned on the piezoelectric element; a first lead wire and electrically connected to one surface of the temperature compensation capacitor; a first wire electrically connecting one surface of the temperature compensation capacitor and the case to each other; a second lead wire and electrically connected to the other surface of the temperature compensation capacitor; a second wire electrically connecting the other surface of the temperature compensation capacitor and an upper surface of the piezoelectric element to each other; and a fixing part fixing the first lead wire and the first wire to one surface of the temperature compensation capacitor and fixing the second lead wire and the second wire to the other surface thereof.
    Type: Application
    Filed: August 7, 2012
    Publication date: February 21, 2013
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Boum Seock Kim, Sung Kwon Wi, Eun Tae Park
  • Publication number: 20130045385
    Abstract: A metal powder including a graphene layer irregularly formed on a surface of the metal powder, a method for preparing the same, and a multilayered ceramic capacitor including an inner electrode using the metal powder. By using the metal powder having the graphene irregularly formed on the surface thereof as the inner electrode material of the multilayered ceramic capacitor, and allowing the necking phenomenon to occur on only the surface where the graphene is not formed, the necking of the metal powder is delayed and the shrinkage of the inner electrode is controlled, so that reduction of the thickness of the inner electrode and disconnection/crack can be prevented.
    Type: Application
    Filed: July 13, 2012
    Publication date: February 21, 2013
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Woon Chun KIM, Hyun Ho Lim, Sung Kwon Wi, Kyu Sang Lee
  • Publication number: 20130038417
    Abstract: There are provided a coil component and a manufacturing method thereof which secure coupling force between a coil and a substrate. The coil component includes: a substrate unit including a first substrate layer, an insulating layer stacked on the first substrate, and a second substrate layer stacked on the insulating layer; and coil layers each interposed between the first substrate layer and the insulating layer and between the insulating layer and the second substrate layer.
    Type: Application
    Filed: October 18, 2011
    Publication date: February 14, 2013
    Inventors: Yong Suk Kim, Kang Heon Hur, Sang Moon Lee, Young Seuck Yoo, Jeong Bok Kwak, Sung Kwon Wi