Abstract: Disclosed herein are inner electrodes of a multilayered ceramic capacitor including metal powders including graphene layers formed on a surface thereof and a multilayered ceramic capacitor including the inner electrodes. An exemplary embodiment of the present invention can include metal powders including graphene layers formed on a surface thereof as inner electrode materials of a multilayered ceramic capacitor to more effectively prevent necking of the metal powders than the related art including only dielectric ceramic powders, thereby increasing necking temperature and necking and control inner electrode shrinkage, thereby reducing a thickness of the inner electrode and defects such as short/cracks, and the like, of the inner electrode. Therefore, it is possible to provide the multilayered ceramic capacitor with excellent reliability by minimizing a difference in shrinkage between the dielectric layer and the inner electrodes.

Abstract: Disclosed herein are a piezoelectric module and a sheet for a vehicle including the same. The sheet includes: a seat board part supporting a passenger's lower body; a backplate part formed to be extended in a direction perpendicular to one side of the seat board part and supporting the passenger's upper body; and a piezoelectric module formed in the seat board part and generating warm air or cold air using a flow of a current generated by vehicle vibration to thereby transfer the generated warm air or cold air to the passenger's body.

Abstract: Disclosed herein is a thermoelectric module. The thermoelectric module includes: an upper substrate and a lower substrate each having a plurality of grooves formed on one surface thereof; a plurality of heat radiation pads embedded in the plurality of grooves; a plurality of electrodes formed on surfaces of the plurality of heat radiation pads and corresponding to the plurality of heat radiation pads one by one; and thermoelectric elements including p-type elements and n-type elements and electrically connected to the plurality of electrodes. According to the present invention, the heat radiation pads are embedded in the respective grooves formed on the upper substrate and the lower substrate, thereby maximizing heat transfer efficiency, and functioning as an insulator for preventing an electric short between the substrates and the electrodes.

Abstract: Disclosed herein is a thermoelectric module. The thermoelectric module includes a first substrate, a second substrate, a diffusion prevention layer, and a thermoelectric device, wherein each of the first and second substrates is stacked with: a heat radiation layer performing heat generation reaction or heat adsorption reaction when power is applied to the thermoelectric module; an insulating layer formed on one surface of the heat radiation layer and formed in a first square wave pattern having a first protrusion part and a first groove part; and an electrode layer buried into the first groove part formed on a surface of the insulating layer.

Abstract: Disclosed herein are an ultrasonic sensor and a method of manufacturing the same. The ultrasonic sensor includes: a conductive case; a piezoelectric element fixed to a bottom. surface of the case through a conductive adhesive; a temperature compensation capacitor positioned over the piezoelectric element; a first lead wire lead from the outside of the case and electrically connected to one surface of the temperature compensation capacitor and the piezoelectric element; a second lead wire lead from the outside of the case and electrically connected to the other surface of the temperature compensation capacitor and the case; and a first molding part closely adhered to outer portions of the temperature compensation capacitor and the first and second lead wires.

Abstract: Disclosed herein is an ultrasonic sensor, including: a conductive case having a groove disposed at a bottom surface thereof; a piezoelectric element inserted into the groove and fixed to the groove by a conductive adhesive; a temperature compensation capacitor disposed on a top of the piezoelectric element, electrically connected to the piezoelectric element, and fixed to the case by a non-conductive adhesive; a first lead wire led-in from an outside of the case and electrically connected to one surface of the temperature compensation capacitor and the case; and a second lead wire lead-in from the outside of the case and electrically connected to the other surface of the temperature compensation capacitor, whereby the piezoelectric element which is easily damaged can be protected by the temperature compensation capacitor, without using the separate substrate for fixing the temperature compensation capacitor.

Abstract: Disclosed herein is an ultrasonic sensor, including: a conductive case having at least one groove disposed on a bottom surface thereof; a piezoelectric element fixed to the bottom surface of the case through a non-conductive adhesive; a conductive adhesive injected into the groove to electrically connect the case to the piezoelectric element; a temperature compensation capacitor disposed on an upper portion of the piezoelectric element; a first lead wire led-in from the outside of the case and being electrically connected to one surface of the temperature compensation capacitor and the piezoelectric element; and a second lead wire led-in from the outside of the case and being electrically connected to the other surface of the temperature compensation capacitor and the case.

Abstract: A multilayer chip capacitor includes a capacitor body including a first capacitor part and a second capacitor part, first and second external electrodes respectively formed on first and second longer side faces of the capacitor body, and third and fourth external electrodes respectively formed on first and second shorter side faces of the capacitor body. The first capacitor part includes first and second internal electrodes of opposite polarity, and the second capacitor part includes third and fourth internal electrodes of opposite polarity. The first to fourth internal electrodes each have one lead. The first to fourth external electrodes are respectively connected to the leads of the first to fourth internal electrodes. A series resonance frequency of the first capacitor part is different from that of the second capacitor part. Equivalent series resistance (ESR1) of the first capacitor part and the equivalent series resistance (ESR2) of the second capacitor part satisfy ERS1?20 m? and 0.7(ESR1)?ESR2?1.

Abstract: A multilayer chip capacitor includes a capacitor body including a stack of a plurality of dielectric layers and having first and second side faces and first and second end faces, a plurality of external electrodes of opposite polarity alternated on each of the first and second side faces, and a plurality of internal electrodes each including one or two leads extending to an outer face of the capacitor body and respectively connected to the external electrodes. A horizontal distance between leads of the internal electrodes of opposite polarity adjacent to each other in a stack direction is longer than a pitch between the external electrodes of opposite polarity adjacent to each other on the same side face of the capacitor body.

Abstract: There are disclosed a nanocomposite powder for an inner electrode of a multilayer ceramic electronic device and a manufacturing method thereof. The nanocomposite powder for an inner electrode of a multilayer ceramic electronic device includes a first metal particle having electrical conductivity, and a second metal coating layer formed on a top surface or a bottom surface of the first metal particle and having a higher melting point than that of the first metal particle.

Abstract: There is provided a multilayer chip capacitor a multilayer chip capacitor including: a capacitor body including first and second capacitor units arranged therein; and first to fourth outer electrodes, wherein the first capacitor unit includes first and second inner electrodes, and the first capacitor unit includes a plurality of capacitor elements each having a pair of the first and second inner electrodes repeatedly laminated, the second capacitor unit includes third and fourth inner electrodes, and the second capacitor unit includes at least one capacitor element having a pair of the third and fourth inner electrodes repeatedly laminated, and at least one of the capacitor elements of the first capacitor unit is different from the other capacitor elements of the first capacitor unit in a lamination number of the first and second inner electrodes or a resonant frequency.

Abstract: A multilayer chip capacitor includes a capacitor body including first and second longer side surfaces facing each other and first and second shorter side surfaces facing each other, first and second external electrodes respectively disposed at the first and second longer side surfaces, one or more first internal electrode pairs each including first and second internal electrodes, and one or more second internal electrode pairs each including third and fourth internal electrodes. The first to fourth internal electrodes each have one lead and are sequentially disposed in a stacked direction. The first to fourth internal electrodes have first to fourth leads respectively extending to first to fourth corners or portions adjacent thereto, and alternately connected with the first and second external electrodes. The first internal electrode pair and the second internal electrode pair cause a current to diagonally flow in opposite directions with respect to a long side direction.

Abstract: There are disclosed a method of manufacturing fine metal powder and fine metal powder manufactured by using the same. The method of manufacturing fine metal powder includes forming a pattern having a predetermined size and shape on a base substrate, forming a metal film on the pattern, and separating the metal film from the pattern to obtain individual metal particles having a predetermined size and shape. The fine metal powder manufactured by the method has a uniform shape and a uniform particle size distribution. The fine metal powder is in the form of flakes, having a large ratio of particle diameter to thickness.

Abstract: There are provided an apparatus and method for manufacturing a board for the production of a metal flake. The apparatus includes: a base board supplying part; a patterning part forming a pattern layer on a base board supplied from the base board supplying part; a coating part forming a sacrificial layer on the base board having the pattern layer formed thereon, the sacrificial layer being decomposable by a solvent; and a base board recovering part recovering the base board having the sacrificial layer formed thereon.

Abstract: There is provided a multilayer capacitor including: a capacitor body where a plurality of dielectric layers are laminated, the capacitor body including first and second surfaces opposing each other in a laminated direction, wherein the first surface provides a mounting surface; a plurality of first and second inner electrodes; an inner connecting conductor; and a plurality of first and second outer electrodes formed on an outer surface of the body, wherein a corresponding one of the outer electrodes having identical polarity to the inner connecting conductor includes at least one outer terminal formed on the first surface of the body to connect to the inner connecting conductor, and at least one outer connecting conductor formed on the second surface of the body to connect a corresponding one of the inner electrodes of identical polarity to the inner connecting conductor.

Abstract: Provided is an electrode pad for mounting an electronic component on a surface of a circuit board. The electrode pad includes first and second electrode parts facing each other, and third and fourth electrode parts facing each other. The third and fourth electrode parts are disposed adjacent to the first and second electrode parts for forming corners of the electrode pad together with the first and second electrode parts. At least one of the first to fourth electrode parts includes a chamfered surface formed by cutting a corner of the at least one of the first to fourth electrode parts forming the corner of the electrode pad. Therefore, when the electrode pad is used for mounting an electronic component, the width of an outer electrode of the electronic component can be sufficiently increased, and thus the shape or size of the outer electrode can be easily adjusted.

Abstract: Disclosed are a method of manufacturing ultra fine metal powder used for an electrode for an MLCC and ultra fine metal powder manufactured by the same. The method of manufacturing ultra fine metal powder includes: preparing a master mold in which a pattern is formed; forming a sacrificial layer by applying a polymer material on the pattern; forming a metal layer on the sacrificial layer; and forming individual ultra fine metal powder by removing the sacrificial layer and separating the metal layer from the master mold.

Abstract: There is provided a multilayer chip capacitor including: a capacitor body including first and second capacitor units arranged in a laminated direction; and first to fourth outer electrodes formed on side surfaces of the capacitor body, respectively, wherein the first capacitor unit includes first and second inner electrodes of different polarities alternately arranged in the capacitor body to oppose each other while interposing a corresponding one of dielectric layers, the second capacitor unit includes third and fourth inner electrodes of different polarities alternately arranged in the capacitor body to oppose each other while interposing another corresponding one of the dielectric layers, the first and second capacitor units are electrically insulated from each other, and the first capacitor unit operates in a first frequency range and the second capacitor unit operates in a second frequency range lower than the first frequency range.

Abstract: A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second polarity inner electrodes, first and second outer electrodes, and a third outer electrode, wherein the first and second power lines are separately disposed on the mounting area, connected to the first and second outer electrodes, and electrically connected to each other only by the vertical MLCC, and the ground pad is disposed between the first and second power lines and connected to the third outer electrode.

Abstract: Disclosed is a method of implementing controlled equivalent series resistance (ESR) having low equivalent series inductance (ESL) of a multi-layer chip capacitor which includes a plurality of internal electrodes each having first polarity or second polarity which is opposite to the first polarity, and dielectric layers each disposed between the internal electrodes of the first polarity and the second polarity, wherein the internal electrodes having the first polarity and the internal electrodes having the second polarity are alternated at least once to form one or more blocks being stacked.