Abstract: A storage server and a method of driving the storage server are provided. The storage server includes a processor configured to: generate a plurality of flush write commands based on a write command of first data provided from a host, provide a replication command corresponding to the write command to an external storage server, and receive an operation completion signal of the replication command from the external storage server; a memory storing a program of a log file to which the plurality of flush write commands are logged; and a storage device configured to receive a multi-offset write command including one or more flush write commands logged to the log file, and perform a flush operation on the multi-offset write command. The processor is further configured to provide the multi-offset write command to the storage device based on the log file after receiving the operation completion signal.

Abstract: A semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface. A semiconductor chip is on the first surface of the substrate. A passive element is on the second surface of the substrate. The substrate includes a first passive element pad and a second passive element pad that are exposed by the second surface. A dam extends downwardly from the second surface. The dam includes a first dam and a second dam. The passive element is disposed between the first dam and the second dam. The passive element includes a first electrode portion electrically connected to the first passive element pad. A second electrode portion is electrically connected to the second passive element pad.

Abstract: A method of controlling a first memory controller that controls a non-volatile memory device includes: the first memory controller receiving first data and a first physical address from a second memory controller via a first interface of the first memory controller; the first memory controller storing the first data in a non-volatile memory buffer of the first memory controller; and the first memory controller programming the first data stored in the non-volatile memory buffer in a first physical region of the non-volatile memory device corresponding to the first physical address.

Abstract: Provided are a memory controller with improved data reliability, a memory system including the memory controller, and a method of operating the memory controller. The memory controller includes an error correction code (ECC) circuit configured to perform an error detection on a codeword read from a memory device; and a processor configured to set at least one memory chip from among a plurality of memory chips as an indicator chip, monitor an error occurrence in the indicator chip based on a result of the error detection, and output reliability deterioration information indicating that the reliability of the memory device is deteriorated based on a result of the monitoring.

Abstract: A memory system includes a memory device, a first controller, and a second controller. The first controller is configured to output a control signal for the memory device and data to be stored in the memory device based on a signal received from a host. The second controller includes a non-volatile memory configured to store the data. The second controller is configured to receive the control signal and the data from the first controller, and control the memory device based on the control signal.

Abstract: Provided are a memory controller with improved data reliability, a memory system including the memory controller, and a method of operating the memory controller. The memory controller includes an error correction code (ECC) circuit configured to perform an error detection on a codeword read from a memory device; and a processor configured to set at least one memory chip from among a plurality of memory chips as an indicator chip, monitor an error occurrence in the indicator chip based on a result of the error detection, and output reliability deterioration information indicating that the reliability of the memory device is deteriorated based on a result of the monitoring.

Abstract: A measurement device includes an emitter configured to emit an electromagnetic signal to an object to be measured. A first detector is disposed to measure a first portion of the electromagnetic signal that is reflected by the object to be measured. A second detector is disposed to measure a second portion of the electromagnetic signal that is transmitted through the object to be measured. The emitter is configured to emit the electromagnetic signal in a direction substantially perpendicular to a surface of the object to be measured.

Abstract: A memory system includes a memory device, a first controller, and a second controller. The first controller is configured to output a control signal for the memory device and data to be stored in the memory device based on a signal received from a host. The second controller includes a non-volatile memory configured to store the data. The second controller is configured to receive the control signal and the data from the first controller, and control the memory device based on the control signal.

Abstract: A method of controlling a first memory controller that controls a non-volatile memory device includes: the first memory controller receiving first data and a first physical address from a second memory controller via a first interface of the first memory controller; the first memory controller storing the first data in a non-volatile memory buffer of the first memory controller; and the first memory controller programming the first data stored in the non-volatile memory buffer in a first physical region of the non-volatile memory device corresponding to the first physical address.

Abstract: Provided are a memory controller with improved data reliability, a memory system including the memory controller, and a method of operating the memory controller. The memory controller includes an error correction code (ECC) circuit configured to perform an error detection on a codeword read from a memory device; and a processor configured to set at least one memory chip from among a plurality of memory chips as an indicator chip, monitor an error occurrence in the indicator chip based on a result of the error detection, and output reliability deterioration information indicating that the reliability of the memory device is deteriorated based on a result of the monitoring.

Abstract: Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package comprises a lower semiconductor chip on a lower substrate, a lower molding layer covering the lower semiconductor chip on the lower substrate and including a molding cavity that extends toward the lower semiconductor chip from a top surface of the lower molding layer, an interposer substrate on the top surface of the lower molding layer and including a substrate opening that penetrates the interposer substrate and overlaps the molding cavity, and an upper package on the interposer substrate. The molding cavity has a floor surface spaced apart from the upper package across a substantially hollow space.

Abstract: Provided are an X-ray detecting apparatus which is capable of controlling an electric power supplied to an X-ray detector module while an X-ray tomography scanning is being performed, and a method for operating the X-ray detecting apparatus. The X-ray detecting apparatus includes an X-ray detector module which has a heat dissipation structure.

Abstract: A measurement device includes an emitter configured to emit an electromagnetic signal to an object to be measured. A first detector is disposed to measure a first portion of the electromagnetic signal that is reflected by the object to be measured. A second detector is disposed to measure a second portion of the electromagnetic signal that is transmitted through the object to be measured. The emitter is configured to emit the electromagnetic signal in a direction substantially perpendicular to a surface of the object to be measured.

Abstract: Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package comprises a lower semiconductor chip on a lower substrate, a lower molding layer covering the lower semiconductor chip on the lower substrate and including a molding cavity that extends toward the lower semiconductor chip from a top surface of the lower molding layer, an interposer substrate on the top surface of the lower molding layer and including a substrate opening that penetrates the interposer substrate and overlaps the molding cavity, and an upper package on the interposer substrate. The molding cavity has a floor surface spaced apart from the upper package across a substantially hollow space.

Abstract: Disclosed are a method for producing an oxide film using a low temperature process, an oxide film and an electronic device. The method for producing an oxide film according to an embodiment of the present invention includes the steps of coating a substrate with an oxide solution, and irradiating the oxide solution coat with ultraviolet rays under an inert gas atmosphere.

Abstract: An audio output device controls the application of active noise cancellation (ANC) levels based on a current status of the device. The audio output device includes a communication interface configured to provide a wired or wireless connection to a playback device, a signal detector configured to detect an audio signal provided through the communication interface, an ANC module configured to apply a first-level ANC to the audio signal, and a control unit configured to determine a level of the ANC to be applied by the ANC module. Upon determining that the audio signal is not provided based on information provided from at least one of the communication interface or the signal detector, the control unit instructs the ANC module to perform a second-level ANC.

Abstract: Provided are an X-ray detecting apparatus which is capable of controlling an electric power supplied to an X-ray detector module while an X-ray tomography scanning is being performed, and a method for operating the X-ray detecting apparatus. The X-ray detecting apparatus includes an X-ray detector module which has a heat dissipation structure.

Abstract: A method for storing X-ray data includes acquiring the X-ray data by using an X-ray detection module; and transmitting all or some of the acquired X-ray data to other X-ray detection module which is different from the X-ray detection module that has acquired the X-ray data.

Abstract: An X-ray detector and an X-ray imaging apparatus including the X-ray detector are provided. The X-ray detector includes a detector element including a cathode electrode and an anode electrode which are spaced apart from each other and a photoconductive layer located between the cathode electrode and the anode electrode and configured to absorb X-rays and generate electric charges, a first temperature controller configured to contact a first surface of the detector element and is configured to control a temperature of the cathode electrode, and a second temperature controller configured to contact a second surface of the detector element opposite to the first surface of the detector element and configured to control a temperature of the anode electrode.

Abstract: An audio output device controls the application of active noise cancellation (ANC) levels based on a current status of the device. The audio output device includes a communication interface configured to provide a wired or wireless connection to a playback device, a signal detector configured to detect an audio signal provided through the communication interface, an ANC module configured to apply a first-level ANC to the audio signal, and a control unit configured to determine a level of the ANC to be applied by the ANC module. Upon determining that the audio signal is not provided based on information provided from at least one of the communication interface or the signal detector, the control unit instructs the ANC module to perform a second-level ANC.