Abstract: Disclosed is an electronic device including a communication interface configured to establish a communication channel with at least one another electronic device, and a processor configured to control a communication connection establishment with the at least one another electronic device through the communication interface, wherein when a specified electronic device is connected to the electronic device, the processor transmits additional connection information of the at least one another electronic device connectible to the at least one another electronic device to which the specified electronic device is already connected, to the specified electronic device.

Abstract: A semiconductor package including a stress mitigation unit that mitigates stress to the semiconductor chip. The semiconductor package includes a substrate, a semiconductor chip on the substrate, an encapsulation member formed on the substrate and covering the first semiconductor chip, and the stress mitigation unit mitigating stress from a circumference of the first semiconductor chip to the first semiconductor chip. The stress mitigation unit includes at least one groove formed in the encapsulation member.

Abstract: An apparatus and a method for manufacturing a transparent synthetic resin vessel with an integrated handle are provided. The transparent synthetic resin vessel manufacturing apparatus includes: an upper mold being vertically movable and having a core and a core block; a fixing plate having rib members; a rotating plate being vertically movable together with the upper mold and having a rotating device for simultaneously molding the handle on one side of a preform and manufacturing a transparent synthetic resin vessel; a fixing member for joining the fixing plate with the rotating plate; a lower mold supplied with molten resin at one side thereof so as to injection-mold the handle; an injection mold for forming the preform into a transparent synthetic resin vessel; and a vessel separator for separating the transparent synthetic resin vessel from the vessel manufacturing apparatus.

Abstract: An apparatus and method operative in a portable terminal, for connecting with a Bluetooth or other short range protocol device are disclosed. The portable terminal searches for the presence of accessories such as a headset or printer within a short range. The terminal pairs with at least one discovered accessory in a pairing process and acquires and stores connection information associated with each paired accessory in the pairing process. The connection information includes at least one of a Bluetooth address, a WiFi address, a security key, and function information for the paired accessory. The connection information is then shared with at least one peer terminal to facilitate subsequent pairing between the at least one peer terminal and the accessory.

Abstract: A method for storing X-ray data includes acquiring the X-ray data by using an X-ray detection module; and transmitting all or some of the acquired X-ray data to other X-ray detection module which is different from the X-ray detection module that has acquired the X-ray data.

Abstract: Disclosed are a method for producing an oxide film using a low temperature process, an oxide film and an electronic device. The method for producing an oxide film according to an embodiment of the present invention includes the steps of coating a substrate with an oxide solution, and irradiating the oxide solution coat with ultraviolet rays under an inert gas atmosphere.

Abstract: An X-ray detector and an X-ray imaging apparatus including the X-ray detector are provided. The X-ray detector includes a detector element including a cathode electrode and an anode electrode which are spaced apart from each other and a photoconductive layer located between the cathode electrode and the anode electrode and configured to absorb X-rays and generate electric charges, a first temperature controller configured to contact a first surface of the detector element and is configured to control a temperature of the cathode electrode, and a second temperature controller configured to contact a second surface of the detector element opposite to the first surface of the detector element and configured to control a temperature of the anode electrode.

Abstract: An apparatus and a method for manufacturing a transparent synthetic resin vessel with an integrated handle are provided. The transparent synthetic resin vessel manufacturing apparatus includes: an upper mold being vertically movable and having a core and a core block; a fixing plate having rib members; a rotating plate being vertically movable together with the upper mold and having a rotating device for simultaneously molding the handle on one side of a preform and manufacturing a transparent synthetic resin vessel; a fixing member for joining the fixing plate with the rotating plate; a lower mold supplied with molten resin at one side thereof so as to injection-mold the handle; an injection mold for forming the preform into a transparent synthetic resin vessel; and a vessel separator for separating the transparent synthetic resin vessel from the vessel manufacturing apparatus.

Abstract: According to one or more embodiments, an inverter provides a light source with an input voltage. A protection circuit shuts down the inverter based on an overvoltage protection level that is detected based on the input voltage. A protection circuit control part shuts down the operation of the protection circuit during a predetermined interval. Abnormal operation of the protection circuit caused by a high voltage provided when the light source is turned on may be prevented. Therefore, a turn-on defect of the light source may be prevented.

Abstract: A backlight unit includes; a light source, an inverter which provides the light source with an input voltage, and a printed circuit board (“PCB”) connected to the light source, wherein the PCB includes a protection circuit which detects an open-lamp-protection voltage which varies according to a change of the input voltage and changes a reference voltage according to the change of the input voltage, wherein the protection circuit turns off the inverter when the detected open-lamp-protection voltage is higher than the changed reference voltage.

Abstract: A package substrate includes a substrate including a top surface and a bottom surface facing each other, the top surface including a first region where a semiconductor chip is mounted and a second region surrounding the first region, and a dummy post on the second region of the top surface to protrude upward from the top surface.

Abstract: A headset, a method and a system for operating the headset, and a portable terminal using the same are provided. A method for operating a headset, includes: receiving one of a voice call connection request message or an image call connection request message requested from another portable terminal through a mobile communication system by a portable terminal; generating a call connection request signal corresponding to the received call connection request message by the portable terminal; transmitting the generated call connection request signal to a headset connected through a near distance communication channel by the portable terminal; receiving the call connection request signal indicating a voice call or an image call from the portable terminal through the near distance communication channel by the headset; and outputting an alarm specified according to a type of the received call connection request signal by the headset.

Abstract: A radiography imaging apparatus comprises a radiation source to generate radiation for irradiation of a patient. A radiation detection unit comprises a plurality of detection modules to detect radiation having passed through the patient and to convert the radiation into an electrical signal and to convert the electrical signal into a digital signal to provide digital data. A data collection unit collects the digital data from the plurality of detection modules for use in generation of a radiography image of the patient, wherein each of the plurality of detection modules transmits the digital data to a neighboring detection module, and at least one of the plurality of detection modules transmits cumulative digital data acquired from the plurality of detection modules to the data collection unit.

Abstract: A semiconductor package includes a substrate having first and second surfaces which face each other, a semiconductor chip mounted on the first surface, a first encapsulant formed on the first surface and at least partially encapsulating the semiconductor chip. A second encapsulant is formed on the second surface and first external connection terminals formed on the second surface to penetrate the second encapsulant. The external connection terminals have first ends in contact with the second surface. Second external connection terminals are attached to second ends of the first external connection terminals.

Abstract: An apparatus and method operative in a portable terminal, for connecting with a Bluetooth or other short range protocol device are disclosed. The portable terminal searches for the presence of accessories such as a headset or printer within a short range. The terminal pairs with at least one discovered accessory in a pairing process and acquires and stores connection information associated with each paired accessory in the pairing process. The connection information includes at least one of a Bluetooth address, a WiFi address, a security key, and function information for the paired accessory. The connection information is then shared with at least one peer terminal to facilitate subsequent pairing between the at least one peer terminal and the accessory.

Abstract: Provided are a semiconductor package and a method for fabricating the same. The semiconductor package includes a lower package comprising a lower substrate, a lower semiconductor chip mounted on the lower substrate and comprising a redistribution, and a molding layer molding the lower semiconductor chip, an upper package comprising an upper substrate and an upper semiconductor chip mounted on the upper substrate, with the upper package being stacked on the lower package. The semiconductor package further includes an electrical interconnector extending from the upper substrate into the molding layer and connected to the redistribution to electrically connect the upper and lower packages to each other, and a dummy interconnector extending from the upper substrate into the molding layer to physically couple the upper and lower packages to each other.

Abstract: A Bluetooth connection establishment method and system is provided for facilitating establishment of a communication channel between a master device and a target slave device. The method has the steps of broadcasting an inquiry signal for discovering a slave device and transmitting an inquiry response signal. The inquiry response signal is communicated from the slave device to a master device and the inquiry response signal indicates that the inquiry signal has been received by the slave device. The method requests at the master device that the at least one slave device transmits identification information. A slave device list is displayed. An alarm is transmitted by the at least one slave device that received the inquiry signal and a second alarm is transmitted by a target slave device selected from the slave device list in response to an alarm trigger signal transmitted by the master device.

Abstract: An example ultrasound device, such as a transducer array, includes a plurality of ultrasound transducers, each ultrasound transducer having a first electrode, a second electrode, a thin piezoelectric film located between the electrodes, and a substrate supporting the plurality of ultrasound transducers. In some examples, the electrode separation is less than 10 microns, facilitating lower voltage operation than conventional ultrasound transducers.

Abstract: A semiconductor package including a stress mitigation unit that mitigates stress to the semiconductor chip. The semiconductor package includes a substrate, a semiconductor chip on the substrate, an encapsulation member formed on the substrate and covering the first semiconductor chip, and the stress mitigation unit mitigating stress from a circumference of the first semiconductor chip to the first semiconductor chip. The stress mitigation unit includes at least one groove formed in the encapsulation member.

Abstract: A transformer including; a bobbin, a coil wound to the bobbin, a core inserted within the bobbin and a soldering pin disposed connected to the bobbin, wherein the soldering pin has at least one first hole.