Abstract: A method of operating a memory device comprises receiving a first row address corresponding to a first word line in the first sub bank array and corresponding to a first word line in the second sub bank array, determining whether at least one of the first word lines has been replaced with a spare word line, (a) when neither of the first word lines has been replaced, receiving a first number of row addresses for refresh operations in order to refresh adjacent word lines to the first word lines, and (b) when at least one of the first word lines has been replaced with a spare word line, receiving a second number of row addresses for refresh operations in order to refresh adjacent word lines to any non-replaced first word and any spare word lines, wherein the second number is greater than the first number.

Abstract: A method of operating a memory device comprises receiving a first row address corresponding to a first word line in the first sub bank array and corresponding to a first word line in the second sub bank array, determining whether at least one of the first word lines has been replaced with a spare word line, (a) when neither of the first word lines has been replaced, receiving a first number of row addresses for refresh operations in order to refresh adjacent word lines to the first word lines, and (b) when at least one of the first word lines has been replaced with a spare word line, receiving a second number of row addresses for refresh operations in order to refresh adjacent word lines to any non-replaced first word and any spare word lines, wherein the second number is greater than the first number.

Abstract: A semiconductor memory device having improved refresh characteristics includes a memory array including a plurality of memory cells; a test unit configured to test refresh characteristics of the memory array and generate a first fail address signal; a storage unit configured to store the first fail address signal; and a refresh unit configured to perform a refresh operation on the memory array, wherein the refresh unit is configured to receive the first fail address signal from the storage unit, perform the refresh operation on a first memory cell that does not correspond to the first fail address signal according to a first period, and perform the refresh operation on a second memory cell that corresponds to the first fail address signal according to a second period that is shorter than the first period.

Abstract: A semiconductor memory device having improved refresh characteristics includes a memory array including a plurality of memory cells; a test unit configured to test refresh characteristics of the memory array and generate a first fail address signal; a storage unit configured to store the first fail address signal; and a refresh unit configured to perform a refresh operation on the memory array, wherein the refresh unit is configured to receive the first fail address signal from the storage unit, perform the refresh operation on a first memory cell that does not correspond to the first fail address signal according to a first period, and perform the refresh operation on a second memory cell that corresponds to the first fail address signal according to a second period that is shorter than the first period.

Abstract: In an embodiment, a semiconductor memory device includes a clock latency that can be controlled responsive to whether or not an output order of burst data is reordered. The semiconductor memory device may comprise a control unit and a latency control unit. The control unit may generate a latency control signal having a logic level that varies depending on whether or not an output order of burst data is reordered. The latency control unit may control a latency value in response to the latency control signal. The semiconductor memory device and the method of controlling the latency value responsive to a reordering of the burst data allow for an optimally fast memory access time.

Abstract: A driver circuit for an integrated circuit device includes a transistor that has a gate terminal, a source terminal, and a bulk substrate terminal. The source terminal is connected to the bulk substrate terminal. A pull-up circuit is connected between a power supply node and the source terminal. The pull up circuit is configured to increase a voltage at the source terminal and the bulk substrate terminal of the transistor responsive to a control signal.

Abstract: A data output circuit includes a sense amplifier and first and second latches. The sense amplifier is for amplifying differential data to generate amplified differential data. The first latch is for latching the amplified differential data to generate first latched data having a same phase as the amplified differential data. The second latch is for latching the amplified differential data to generate second latched data having an opposite phase from the amplified differential data. The amplified differential data from outputs of the sense amplifier are applied substantially simultaneously to inputs of the first and second latches.

Abstract: A data output circuit includes a sense amplifier and first and second latches. The sense amplifier is for amplifying differential data to generate amplified differential data. The first latch is for latching the amplified differential data to generate first latched data having a same phase as the amplified differential data. The second latch is for latching the amplified differential data to generate second latched data having an opposite phase from the amplified differential data. The amplified differential data from outputs of the sense amplifier are applied substantially simultaneously to inputs of the first and second latches.

Abstract: In an embodiment, a semiconductor memory device includes a clock latency that can be controlled responsive to whether or not an output order of burst data is reordered. The semiconductor memory device may comprise a control unit and a latency control unit. The control unit may generate a latency control signal having a logic level that varies depending on whether or not an output order of burst data is reordered. The latency control unit may control a latency value in response to the latency control signal. The semiconductor memory device and the method of controlling the latency value responsive to a reordering of the burst data allow for an optimally fast memory access time.

Abstract: A driver circuit for an integrated circuit device includes a transistor that has a gate terminal, a source terminal, and a bulk substrate terminal. The source terminal is connected to the bulk substrate terminal. A pull-up circuit is connected between a power supply node and the source terminal. The pull up circuit is configured to increase a voltage at the source terminal and the bulk substrate terminal of the transistor responsive to a control signal.

Abstract: An apparatus and method for measuring the electrical characteristics of a semiconductor device in a packaged state, which includes an electrical characteristic measurer which is connected to an electrical element whose electrical characteristics are to be measured and to one pad of the semiconductor device. The measurer is driven in response to a control signal, and outputs a value indicative of the electrical characteristics of the electrical element to the pad. The measurer includes at least an NMOS threshold voltage measurer, an NMOS saturation current measurer, a PMOS threshold voltage measurer, a PMOS saturation current measurer, and a resistance measurer. An accurate electrical characteristic value can be obtained by measuring the characteristics of the element within a semiconductor device in a finished packaged product. In view of the accurate measurement, degradation of characteristics of the semiconductor device and malfunction thereof can be prevented.

Abstract: Output drivers in semiconductor memory devices such as Rambus DRAM prevent degradation of the signal characteristics of a channel bus line in a memory module equipped with the semiconductor memory devices. Each semiconductor memory device includes blocks of memory cells. The data of a memory cell in a block is transmitted to a data input/output line through an output driver for the block. The output driver includes a first transistor connected to a reference voltage (ground) and a second transistor. The first transistor is responsive to the data from the selected block. The second transistor selectively connects the first transistor to the data input/output line in response to a column cycle signal for selecting the block or a read control signal containing calibration information about the characteristics of the data input/output line. Data from the selected block is transmitted to the data input/output line via the first and second transistors when the second transistor responds to the column cycle signal.

Abstract: A semiconductor memory device having a mesh-type structure of a precharge voltage line is provided. The semiconductor memory device includes a plurality of memory cell arrays, a plurality of bit line precharge circuit units, and a first precharge voltage line and a second precharge voltage line. Each of the plurality of memory cell arrays include a plurality of memory cells and a plurality of bit line pairs for outputting and receiving data to and from each of the memory cells and are arranged in a matrix. The plurality of bit line precharge circuit units precharge and equalize corresponding bit line pairs of the memory cell arrays into predetermined precharge voltages. The first precharge voltage line and the second precharge voltage line are arranged in a mesh in each region between the plurality of memory cell arrays.

Abstract: A semiconductor memory device having a mesh-type structure of a precharge voltage line is provided. The semiconductor memory device includes a plurality of memory cell arrays, a plurality of bit line precharge circuit units, and a first precharge voltage line and a second precharge voltage line. Each of the plurality of memory cell arrays include a plurality of memory cells and a plurality of bit line pairs for outputting and receiving data to and from each of the memory cells and are arranged in a matrix. The plurality of bit line precharge circuit units precharge and equalize corresponding bit line pairs of the memory cell arrays into predetermined precharge voltages. The first precharge voltage line and the second precharge voltage line are arranged in a mesh in each region between the plurality of memory cell arrays.

Abstract: An apparatus and method for measuring the electrical characteristics of a semiconductor device in a packaged state, which includes an electrical characteristic measurer which is connected to an electrical element whose electrical characteristics are to be measured and to one pad of the semiconductor device. The measurer is driven in response to a control signal, and outputs a value indicative of the electrical characteristics of the electrical element to the pad. The measurer includes at least an NMOS threshold voltage measurer, an NMOS saturation current measurer, a PMOS threshold voltage measurer, a PMOS saturation current measurer, and a resistance measurer. An accurate electrical characteristic value can be obtained by measuring the characteristics of the element within a semiconductor device in a finished packaged product. In view of the accurate measurement, degradation of characteristics of the semiconductor device and malfunction thereof can be prevented.

Abstract: A phase difference between clock signals in an integrated circuit is determined after the integrated circuit is packaged. The phase difference can thereby be adjusted so that the effect of the unequal loading on the clock signal timing may be reduced. Determining the phase difference after the integrated circuit is packaged may reduce the cost of fabricating the integrated circuit by reducing the amount of compensation which may need to be performed during the fabrication process. The phase difference may be provided by a selection means which can include at least one fuse that is cut by a laser or an RC circuit controlled by a voltage level applied to at least one pin of the integrated circuit. The phase may be adjusted as described above in input pipelines that receive data, output pipelines that output data from the integrated circuit, and in interface circuits that control operation of the integrated circuit.

Abstract: Output drivers in semiconductor memory devices such as Rambus DRAM prevent degradation of the signal characteristics of a channel bus line in a memory module equipped with the semiconductor memory devices. Each semiconductor memory device includes blocks of memory cells. The data of a memory cell in a block is transmitted to a data input/output line through an output driver for the block. The output driver includes a first transistor connected to a reference voltage (ground) and a second transistor. The first transistor is responsive to the data from the selected block. The second transistor selectively connects the first transistor to the data input/output line in response to a column cycle signal for selecting the block or a read control signal containing calibration information about the characteristics of the data input/output line. Data from the selected block is transmitted to the data input/output line via the first and second transistors when the second transistor responds to the column cycle signal.

Abstract: A phase difference between clock signals in an integrated circuit is determined after the integrated circuit is packaged. The phase difference can thereby be adjusted so that the effect of the unequal loading on the clock signal timing may be reduced. Determining the phase difference after the integrated circuit is packaged may reduce the cost of fabricating the integrated circuit by reducing the amount of compensation which may need to be performed during the fabrication process. The phase difference may be provided by a selection circuit which can include at least one fuse that is cut by a laser or an RC circuit controlled by a voltage level applied to at least one pin of the integrated circuit. The phase may be adjusted as described above in input pipelines that receive data, output pipelines that output data from the integrated circuit, and in interface circuits that control operation of the integrated circuit.

Abstract: A local column selection line driving circuit in a multi-bank memory device is shown which includes a first transistor coupled between a bank selection line and a circuit node and wherein a gate of the first transistor is coupled to a power supply voltage such that a non-inverting bank selection signal received on the bank selection line precharges the circuit node to a first voltage level. The local column selection line driving circuit also includes a second transistor coupled between a global column selection line and a local column selection line and having a gate terminal coupled to the circuit node such that a global column selection signal received on the global column selection line boosts the circuit node to a voltage level higher than the first voltage level. The circuit node then drives the global column selection signal onto the local column selection line through the second transistor.

Abstract: A semiconductor memory with an extended data output mode and the semiconductor memory includes a data output buffer, being always in enable state in the extended mode, for connecting between data output lines and an output terminal; a sense amplifier for sensing and amplifying the data read from a cell and transmitting the amplified data to inner input-output buses; a bus controller, being between the inner input-output buses and the data output lines, for switching connection between the inner input-output buses and data output lines in response to a data path control signal in order to store the data transmitted from the sense amplifier to the inner input-output buses and transmit the stored data to the data output buffer even after occurrence of a column address strobe signal; and a control signal generator for generating the data path control signal which is the combined signal of the signal gained by delaying the front of the column address strobe signal by a first delay time and the signal gained by del