Abstract: Disclosed is a side stream flow-type reverse osmosis membrane filter with an increased purified water recovery rate. The filter comprises: a filter housing with a raw water port, a purified water port, and a concentrated water port; an RO filter to purify raw water, thereby sending purified water to an inside thereof and discharging concentrated water, which is filtered out; a central tube for collecting the purified water; a raw water pipe arranged in the central tube and provided with a raw water flow channel in a center portion thereof, with a purified water flow channel formed between the raw water pipe and the central tube; and a raw water distributor for supplying supply a portion of raw water to the upper end of the RO filter and a portion of the raw water the lower end of the RO filter and supplying the purified water to the purified water port.

Abstract: Disclosed is a reverse osmosis membrane filter for increasing a recovery rate of purified water by extending a residence time of raw water on a reverse osmosis sheet. The reverse osmosis membrane filter having a fluid channel formed on a side surface thereof, according to the present invention, comprises: a central tube having a purified water inflow hole radially formed therein; a guide tube that is coupled to the outside of the central tube and has a raw water moving passage formed in the longitudinal direction thereof and a raw water outflow hole radially formed therein which communicates with the raw water moving passage; a reverse osmosis membrane sheet that filters a foreign substance contained in raw water and supplies the filtered purified water into the central tube through the purified water inflow hole; and a filter housing that accommodates the reverse osmosis membrane sheet.

Abstract: A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a surface of the insulation layer. The printed circuit board and method thereof also include a bump formed on the connection terminal of the electronic component and exposed on the surface of the insulation layer.

Abstract: Embodiments of the invention provide a printed circuit board having a structure in which a plurality of insulating layers having a metal wiring formed on one surface thereof are stacked, wherein a metal layer is interposed in the insulating layers, in order to improve warpage property of the board.

Abstract: The present invention relates to a substrate raw material such as a copper clad laminate for manufacturing a circuit board. A substrate raw material in accordance with an embodiment of the present invention includes an insulating layer and an organic fiber cloth disposed in the insulating layer.

Abstract: An apparatus for receiving a substrate is disclosed. The apparatus for receiving a substrate in accordance with an embodiment of the present invention includes: a frame configured to form a space for receiving the substrate inside thereof; a substrate supporting part coupled to one side of the frame and configured to support the substrate inserted in the space for receiving the substrate; and a shock-absorbing part arranged at one side of the frame and configured to mitigate a drop impact of the substrate.

Abstract: The present invention relates to a jig unit for fixing a substrate and a substrate transfer apparatus including the same. In accordance with an embodiment of the present invention, a jig unit for fixing a substrate including: a support part for supporting an edge-side lower portion of a substrate; a hinge part having a hinge formed at a predetermined height from an upper surface of the substrate supported to the support part and rotating so that a rotation range by the hinge applies a force to the edge side of the substrate beyond the range that vertically presses the upper surface of the substrate; and a substrate fixing part for fixing the substrate to the support unit flatly by applying tension to the edge side of the substrate simultaneously with pressing the upper surface of the substrate is provided.

Abstract: Disclosed herein are a dielectric composition of a multilayered circuit board including two types of inorganic fillers of 10 to 60 parts by weight with respect to an epoxy resin of 100 parts by weight, a multilayered printed circuit board including a dielectric layer manufactured of the dielectric composition, and a method for preparing the multilayered printed circuit board. According to the present invention, by mixing two types of inorganic fillers such as SiO2 and CaCO3 in manufacturing the dielectric layer of the multilayered circuit board, a high adhesive strength to a plating layer can be achieved without using a fluoride-based solution including 3NH4HF2 as an oxidant while etching the dielectric layer and furthermore, an environmentally hazardous substance can be prevented from being discharged.

Abstract: Disclosed herein is a slitter. The slitter according to the exemplary embodiment of the present invention includes an unwinding part from which an insulating film is consecutively taken out; a plurality of transfer rollers that transfer the insulating film supplied from the unwinding part in one direction; a wheel knife that senses an air pocket formed on the insulating film taken out from the unwinding part to form fine holes on the insulating film; a cutter that is disposed between the transfer rollers and cuts, at a predetermined interval, the insulating film transferred in one direction through the transfer roller; and a winding part individually winding the insulating film divided at a predetermined interval by the cutter.

Abstract: Disclosed herein is an operating module of a display device with a touch panel. The operating module includes a touch input unit for a user to input a value through a touch unit; a pattern input unit to which the same pattern image as patterns of a transparent electrode formed on the touch panel having the touch input unit is input; a control unit coupling each image signal into a single image signal according to an output value having a complementary pattern image value with the pattern image value input to the pattern input unit and an output value according to the input of the touch input unit; and an output unit outputting an image signal by the control unit.

Abstract: A capacitor and a method of manufacturing the capacitor are disclosed. The capacitor may include a board, a polymer layer formed on one side of the board, a circuit pattern selectively formed over the polymer layer, and a titania nanosheet corresponding with the circuit pattern. Embodiments of the invention can provide flatness in the board, and allows the copper of the board to maintain its functionality as an electrode while increasing the adhesion to the titania nanosheet. The titania nanosheet may thus be implemented on a patterned board in a desired shape, number of layers, and thickness.

Abstract: Disclosed herein is an apparatus for supplying a source for constantly maintaining a film source water level in a source reservoir. The apparatus for supplying a source according to the present invention includes a source reservoir into which a liquid-phase film source is injected; a carrier film that is horizontally delivered from one side of the source reservoir; a casting roller that is rotated along the delivery direction of the carrier film and applies the liquid-phase film source injected into the source reservoir to the carrier film; a water level control plate that is vertically driven in the source reservoir to control the liquid-phase film source level; and a plate driving unit that moves the water level control plate up and down.

Abstract: Disclosed herein is an apparatus for manufacturing a substrate, including: a first chamber supplying an insulation layer; a second chamber including a roughening roller roughening at least one side of the insulation layer supplied from the first chamber, an evaporator depositing a metal layer on the roughened insulation layer, and a pressing roller pressing the insulation layer and the metal layer; and a third chamber storing the insulation layer including the metal layer formed thereon, the insulation layer being taken out from the second chamber. The apparatus for manufacturing a substrate is advantageous in that substrates are continuously produced, thus increasing the productivity of the substrates and preventing the substrates from being contaminated by the air.

Abstract: Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a ?-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

Abstract: Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a ?-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.