APPARATUS FOR RECEIVING SUBSTRATE

- Samsung Electronics

An apparatus for receiving a substrate is disclosed. The apparatus for receiving a substrate in accordance with an embodiment of the present invention includes: a frame configured to form a space for receiving the substrate inside thereof; a substrate supporting part coupled to one side of the frame and configured to support the substrate inserted in the space for receiving the substrate; and a shock-absorbing part arranged at one side of the frame and configured to mitigate a drop impact of the substrate.

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Description
CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of Korean Patent Application No. 10-2013-0124125, filed with the Korean Intellectual Property Office on Oct. 17, 2013, the disclosure of which is incorporated herein by reference in its entirety.

BACKGROUND

1. Technical Field

The present invention relates to an apparatus for receiving a substrate.

2. Background Art

As today's electronic devices become thinner, the printed circuit board, in which electronic parts are installed, has increasingly become thinner.

The printed circuit board is used for an electronic device by forming a circuit pattern on one or both surfaces of a substrate, which is made of synthetic resin, and then arranging an electronic part on the substrate. Several fabrication processes are undertaken for the printed circuit board in order to form the circuit pattern. Here, the printed circuit board is received by an apparatus for receiving a substrate for transportation and handling of the printed circuit board in between the processes.

However, the thin printed circuit board is easily destroyed by an impact when the printed circuit board is received by the apparatus for receiving a substrate.

The related art of the present invention is disclosed in Korea Patent Publication No. 2010-0068754 (A BASKET FOR SUPPORTING A SUBSTRATE; laid open on Jun. 24, 2010).

SUMMARY

The present invention provides an apparatus for receiving a substrate that can mitigate a drop impact of the substrate.

An aspect of the present invention features an apparatus for receiving a substrate, which includes: a frame configured to form a space for receiving the substrate inside thereof; a substrate supporting part coupled to one side of the frame and configured to support the substrate inserted in the space for receiving the substrate; and a shock-absorbing part arranged at one side of the frame and configured to mitigate a drop impact of the substrate.

The shock-absorbing part can include: a frame supporting part arranged in a lower area of the frame and configured to support the frame; and a shock-absorbing member coupled to the frame supporting part and arranged in parallel to the substrate supporting part in the space for receiving the substrate.

The frame supporting part can also include a receiving groove in which the shock-absorbing member is received.

The shock-absorbing part can also include an elastic member arranged in the receiving groove and configured to support the shock-absorbing part.

The frame can include a plurality of row bars and a plurality of column bars that are connected with one another to form a hexahedral shape having an open upper face.

The substrate supporting part can be connected to the row bars facing each other or the column bars facing each other at a lower end of the frame.

The apparatus for receiving a substrate can also include a substrate guide part installed on a lateral side of the frame and configured to guide a path through which the substrate is inserted.

The substrate guide part can be formed by being bent so as to form a guide groove in which the substrate is inserted.

The substrate guide part can include a first bent part and a second bent part that are bent to form the guide groove.

An angle of bend between the first bent part and the second bent part of the substrate guide part can be varied along a lengthwise direction of the substrate guide part.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a disassembled state of an apparatus for receiving a substrate in accordance with an embodiment of the present invention.

FIG. 2 shows an assembled state of the apparatus for receiving a substrate in accordance with an embodiment of the present invention.

FIG. 3 shows the structure of a shock-absorbing part in accordance with another embodiment of the present invention.

FIGS. 4 and 5 show the structure of a substrate guide part in accordance with another embodiment of the present invention.

FIG. 6 is a cross-sectional view of FIG. 5 along the I-I′ line.

FIG. 7 is a cross-sectional view of FIG. 5 along the II-II′ line.

DETAILED DESCRIPTION

Since there can be a variety of permutations and embodiments of the present invention, certain embodiments will be illustrated and described with reference to the accompanying drawings. This, however, is by no means to restrict the present invention to certain embodiments, and shall be construed as including all permutations, equivalents and substitutes covered by the ideas and scope of the present invention. Throughout the description of the present invention, when describing a certain technology is determined to evade the point of the present invention, the pertinent detailed description will be omitted.

Terms such as “first” and “second” can be used in describing various elements, but the above elements shall not be restricted to the above terms. The above terms are used only to distinguish one element from the other.

The terms used in the description are intended to describe certain embodiments only, and shall by no means restrict the present invention. Unless clearly used otherwise, expressions in a singular form include a meaning of a plural form. In the present description, an expression such as “comprising” or “including” is intended to designate a characteristic, a number, a step, an operation, an element, a part or combinations thereof, and shall not be construed to preclude any presence or possibility of one or more other characteristics, numbers, steps, operations, elements, parts or combinations thereof.

Hereinafter, certain embodiments of an apparatus for receiving a substrate in accordance with the present invention will be described in detail with reference to the accompanying drawings. In describing certain embodiments of the present invention with reference to the accompanying drawings, any identical or corresponding elements will be assigned with same reference numerals, and their redundant description will not be provided.

FIG. 1 shows a disassembled state of an apparatus for receiving a substrate in accordance with an embodiment of the present invention, and FIG. 2 shows an assembled state of the apparatus for receiving a substrate in accordance with an embodiment of the present invention.

Referring to FIGS. 1 and 2, the apparatus for receiving a substrate in accordance with an embodiment of the present invention includes a frame 110, a substrate supporting part 120, a substrate guide part 130 and a shock-absorbing part 140.

The frame 110 provides space for receiving the substrate inside thereof. Here, the frame 110 can include a plurality of row bars 112, a plurality of column bars 114 and a plurality of posts 116 that are connected to one another. The frame 110 can be cubically formed by having the plurality of row bars 112, the plurality of column bars 114 and the plurality of posts 116 connected to one another.

The row bars 112 and the column bars 114 can be connected with one another to form a top frame and a bottom frame, each having the shape of a rectangular frame. The posts 116 connect the top frame to the bottom frame to form a hexahedron. Here, each of the row bars 112, column bars 114 and posts 116 can have a cross-sectional girth shape of a circle, ellipse or polygon. Moreover, in order to accommodate a substrate 50 being inserted from above, the frame 110 can be formed in such a way that the posts 116 are longer than a width and a height of the substrate 50.

In case the apparatus for receiving a substrate in accordance with an embodiment of the present invention is used in an etching process of the substrate, the frame 110 can be made of a material that cannot be etched by an etchant. For example, the frame 110 can be made of a metal that is not etched by an etchant, but the material for the frame 110 is not restricted to what is described herein, and the frame 110 can be made of a variety of materials.

The substrate supporting part 120 is coupled to one side of the frame 110 to support the inserted substrate 50 in the space for receiving the substrate. Specifically, at least one substrate supporting part 120 can be installed in a lower end of the frame 110. Moreover, the substrate supporting part 120 can support a lower end of the substrate 50 being inserted. Here, the substrate supporting part 120 can be extended in one direction and connected to the row bars 112 facing each other or the column bars 114 facing each other at the lower end of the frame 110.

The substrate supporting part 120 can include a fastening groove 125, to which the substrate 50 is inserted. The fastening groove 125 can be formed in an orthogonal direction to the lengthwise direction of the substrate supporting part 120. The substrate supporting part 120 can fasten the substrate 50 inserted in the fastening groove 125. The substrate supporting part 120 can prevent the substrate 50 inserted in the fastening groove 125 from moving in the lengthwise direction of the substrate supporting part 120. Moreover, the substrate supporting part 120 can support a plurality of inserted substrates 50 by keeping the substrates 50 separated so as not to collide with one another.

In case the apparatus for receiving a substrate in accordance with an embodiment of the present invention is used in an etching process of the substrate, the substrate supporting part 120 can be made of a material that cannot be etched by an etchant. For example, the substrate supporting part 120 can be made of a metal that is not etched by an etchant, but the material for the substrate supporting part 120 is not restricted to what is described herein, and the substrate supporting part 120 can be made of a variety of materials.

The substrate guide part 130 provides a path through which the substrate 50 is inserted. The substrate guide part 130 can be installed in plurality facing one another on lateral sides of the frame 110. The substrate guide part 130 can be arranged in parallel with the post 116 and guide the substrate 50 being inserted from an upper side of the frame 110. For this, the substrate guide part 130 can be bent in such a way that a guide groove 135, in which the substrate 50 is inserted, is formed. For example, the substrate guide part 130 can be formed by being bent in such a way that the cross-section orthogonal to the lengthwise direction of the substrate guide part 130 has a “U” shape. Here, the guide groove 135 can be extended in the lengthwise direction of the substrate guide part 130.

The shock-absorbing part 140 is arranged on one side of the frame 110 and mitigates a drop impact of the substrate 50. Specifically, the shock-absorbing part 140 can include a frame supporting part 142, which is arranged in a lower portion of the frame 110 and supports the frame 110, and a shock-absorbing member 150, which is coupled to the frame supporting part 142 and mitigates the drop impact.

The frame supporting part 142 supports the frame 110 and the shock-absorbing member 150 from the lower portion of the frame 110. Here, the frame supporting part 142 can have an area corresponding to the frame 110 so as to support the frame 110.

The shock-absorbing member 150 can be extended in one direction, and at least one of the shock-absorbing member 150 can be arranged in the lower portion of the frame 110. Here, the shock-absorbing part 150 can be coupled to the frame supporting part 142 to be arranged in parallel with the substrate supporting part 120. Alternatively, the shock-absorbing part 150 can be received in a receiving groove 145, which is formed in the frame supporting part 142, to be arranged in parallel with the substrate supporting part 120. For this, the frame supporting part 142 can be formed in such a way that the receiving groove 145 in which the shock-absorbing member 150 is received is extended in parallel with the frame supporting part 120. Here, the receiving groove 145 can be formed to be bigger than the shock-absorbing part 140 so that the shock-absorbing part 140 is inserted therein. Alternatively, the receiving groove 145 can be stepped so that only a portion of the shock-absorbing part 140 is inserted therein.

The shock-absorbing member 150 is arranged to be parallel to the substrate supporting part 120 and can mitigate the drop impact when the substrate 50 is inserted to the fastening groove 125 of the substrate supporting part 120. Moreover, the shock-absorbing member 150 can be formed to be slightly higher than a floor of the fastening groove 125 of the substrate supporting part 120 in order to mitigate the drop impact of the substrate 50. For example, as shown in FIG. 1, a height H2 of the shock-absorbing member 150 can be higher than a floor height H1 of the fastening groove 125 of the substrate supporting member 120. Accordingly, the substrate 50 makes contact with the shock-absorbing member 150 before hitting the floor of the fastening groove 125, thereby slowing the dropping speed of the substrate 50 and dispersing the impact given to the substrate 50.

The shock-absorbing member 150 can be made of an elastic material so as to absorb a shock. Here, the shock-absorbing member 150 can be made of a shock-absorbing polymer material, such as rubber or sponge, but the material for the shock-absorbing member 150 is not restricted to what is described herein, and the shock-absorbing member 150 can be made of a variety of materials.

The apparatus for receiving a substrate in accordance with an embodiment of the present invention can mitigate the drop impact of the substrate 50, prevent the substrate 50 from being damaged and prevent foreign substances from being generated, by arranging the shock-absorbing part 140 in the lower portion of the frame 110.

FIG. 3 shows the structure of a shock-absorbing part in accordance with another embodiment of the present invention.

Referring to FIG. 3, the shock-absorbing part 140 in accordance with another embodiment of the present invention includes a frame supporting part 142, in which a receiving groove 145 configured to receive a shock-absorbing member 150 is formed, and an elastic member 160, which is received in the receiving groove 145 and elastically supports the shock-absorbing member 150.

At least one elastic member 160 can be arranged in the receiving groove 145. Moreover, the elastic member 160 can be made of an elastic material that disperses a shock received by the shock-absorbing member 150 and supports the sock-absorbing member 150. For example, the elastic member 160 can include an elastic material such as spring.

The shock-absorbing part 140 in accordance with another embodiment of the present invention can mitigate the drop impact of the substrate 50 more effectively.

FIGS. 4 and 5 show the structure of a substrate guide part in accordance with another embodiment of the present invention. FIG. 6 is a cross-sectional view of FIG. 5 along the I-I′ line. FIG. 7 is a cross-sectional view of FIG. 5 along the II-II′ line.

Referring to FIGS. 4 to 7, a substrate guide part 130 in accordance with another embodiment of the present invention includes a first bent part 132 and a second bent part 134 that are bent to form a guide groove 135.

Here, the first bent part 132 and the second bent part 134 of the substrate guide part 130 can be bent to a predetermined angle. Moreover, the angle of bend between the first bent part 132 and the second bent part 134 at a cross-section orthogonal to the lengthwise direction of the substrate guide part 130 can be varied along the lengthwise direction of the substrate guide part 130.

Specifically, as shown in FIG. 6, which illustrates a cross-section at an upper area of the substrate guide part 130, the angle of bend between the first bent part 132 and the second bent part 134 can be set as a first angle (θ1), and the distance between and end part of the first bent part 132 and an end part of the second bent part 134 can be set as a first distance (L1). Moreover, as shown in FIG. 7, which illustrates a cross-section at a lower area of the substrate guide part 130, the angle of bend between the first bent part 132 and the second bent part 134 can be set as a second angle (θ2), and the distance between and end part of the first bent part 132 and an end part of the second bent part 134 can be set as a first distance (L2).

Here, in the substrate guide part 130 in accordance with another embodiment of the present invention, the second angle (θ2) can be smaller than the first angle (θ1). Moreover, the second distance (L2) can be smaller than the first distance (L1).

In the substrate guide part 130 in accordance with another embodiment of the present invention, a cross-sectional area thereof orthogonal to the lengthwise direction of the guide groove 135 can be gradually smaller toward the lower area of the substrate guide part 130, making it possible to slow down the dropping speed of the inserted substrate. Therefore, the substrate guide part 130 in accordance with another embodiment of the present invention can mitigate the drop impact of the substrate.

Although certain embodiments of the present invention have been described, it shall be appreciated that there can be a very large number of permutations and modification of the present invention by those who are ordinarily skilled in the art to which the present invention pertains without departing from the technical ideas and boundaries of the present invention, which shall be defined by the claims appended below.

It shall be also appreciated that many other embodiments other than the embodiments described above are included in the claims of the present invention.

Claims

1. An apparatus for receiving a substrate, comprising:

a frame configured to form a space for receiving the substrate inside thereof;
a substrate supporting part coupled to one side of the frame and configured to support the substrate inserted in the space for receiving the substrate; and
a shock-absorbing part arranged at one side of the frame and configured to mitigate a drop impact of the substrate.

2. The apparatus of claim 1, wherein the shock-absorbing part comprises:

a frame supporting part arranged in a lower area of the frame and configured to support the frame; and
a shock-absorbing member coupled to the frame supporting part and arranged in parallel to the substrate supporting part in the space for receiving the substrate.

3. The apparatus of claim 2, wherein the frame supporting part further comprises a receiving groove in which the shock-absorbing member is received.

4. The apparatus of claim 2, wherein the shock-absorbing part further comprises an elastic member arranged in the receiving groove and configured to support the shock-absorbing part.

5. The apparatus of claim 1, wherein the frame comprises a plurality of row bars and a plurality of column bars that are connected with one another to form a hexahedral shape having an open upper face.

6. The apparatus of claim 5, wherein the substrate supporting part is connected to the row bars facing each other or the column bars facing each other at a lower end of the frame.

7. The apparatus of claim 1, further comprising a substrate guide part installed on a lateral side of the frame and configured to guide a path through which the substrate is inserted.

8. The apparatus of claim 7, wherein the substrate guide part is formed by being bent so as to form a guide groove in which the substrate is inserted.

9. The apparatus of claim 8, wherein the substrate guide part comprises a first bent part and a second bent part, the first bent part and the second bent part being bent to form the guide groove.

10. The apparatus of claim 9, wherein an angle of bend between the first bent part and the second bent part of the substrate guide part is varied along a lengthwise direction of the substrate guide part.

Patent History
Publication number: 20150108029
Type: Application
Filed: Jan 8, 2014
Publication Date: Apr 23, 2015
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD. (Suwon-si)
Inventors: Sung-Taek LIM (Suwon-si), Dong-Hoon KIM (Suwon-si), Sang-Youp LEE (Suwon-si)
Application Number: 14/150,520
Classifications
Current U.S. Class: Shock Protection Type (e.g., Free Fall) (206/521)
International Classification: B65D 81/107 (20060101);