Abstract: A circuit board according to an embodiment includes a first insulating layer including a first region and a second region; and a first circuit pattern layer disposed on the first insulating layer; wherein the first circuit pattern layer includes a first electrode disposed on the first region of the first insulating layer and including a first opening, and wherein the first opening pass through upper and lower surfaces of the first electrode.

Abstract: A circuit board according to an embodiment includes an insulating layer including an upper surface and a lower surface, and having a via hole passing through the upper surface and the lower surface in a thickness direction from the upper surface to the lower surface, wherein the via hole includes: a first via part adjacent to the upper surface and having a constant inclination angle along the thickness direction; a second via part adjacent to the lower surface and having a constant inclination angle along the vertical direction; and a third via part disposed between the first via part and the second via part and having an inclination angle different from an inclination angle of the first via part and an inclination angle of the second via part.

Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; a first via portion disposed in the first insulating layer; and a second via portion disposed in the second insulating layer; wherein the first via portion includes: a first via part passing through the first insulating layer; a first-first pad disposed on an upper surface of the first insulating layer and connected to an upper surface of the first via part; and a first-second pad disposed on a lower surface of the first insulating layer and connected to a lower surface of the first via part; wherein the second via portion includes: a second via part passing through the second insulating layer and having a lower surface connected to an upper surface of the first-first pad; a second pad disposed on an upper surface of the second insulating layer and connected to an upper surface of the second via part; wherein a width of the first-first pad is smaller than or e

Abstract: A printed circuit board according to an embodiment includes an insulating layer; and a via portion disposed on the insulating layer; wherein the via portion includes: a first pad disposed under the insulating layer; a second pad disposed on the insulating layer; and a via part disposed between the first and second pads in the insulating layer; and wherein a width of the first pad is less than or equal to a width of a lower surface of the via part.

Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; and a cavity formed in the first and second insulating layers; wherein the cavity includes a first portion formed in the second insulating layer; and a second portion formed in the first insulating layer; wherein the first portion has a first cross-sectional shape, and wherein the second part has a second cross-sectional shape different from the first cross-sectional shape.

Abstract: The printed circuit board, according to one embodiment, comprises: an insulation substrate; a pad formed on at least one side of the insulation substrate; a protection layer which is formed on the insulation substrate and exposes an upper surface of the pad; and a bump formed on the pad exposed by the protection layer, wherein the bump comprises a plurality of solder layers having melting points different from each other.

Abstract: A semiconductor package substrate includes an insulating substrate, a circuit pattern on the insulating substrate, a protective layer formed on the insulating substrate to cover the circuit pattern on the insulating substrate, a pad formed on the protective layer while protruding from a surface of the protective layer, and an adhesive member on the pad.

Abstract: A printed circuit board includes an insulating substrate, a plurality of pads on a top surface of the insulating substrate, a protective layer formed on the insulating substrate and having an opening to expose top surfaces of the pads, a bump formed on at least one of the pads and protruding upward of a surface of the protective layer. The bump has a curved lateral side.

Abstract: Provided are a printed circuit board which can be used as a substrate for a package, a method of manufacturing the printed circuit board, and a semiconductor package using the printed circuit board, the printed circuit board including: a first substrate having a first mounting area for mounting a package substrate and a second mounting area for mounting a semiconductor element; a single layer or multi-layered circuit pattern of the first substrate; and a post bump connected to the circuit pattern, provided on an external insulating layer of the first mounting area, and having a concave upper surface.

Abstract: A printed circuit board according the present embodiment includes an insulating layer; at least one circuit pattern or pad formed on the insulating layer; a solder resist having an opening section exposing the upper surface of the pad and formed on the insulating layer and a bump formed on the pad exposed through the opening section of the solder resist and having a lower area narrower than the upper area.

Abstract: A semiconductor package includes: an upper package to which an element is mounted, and which includes a metal pad portion; a metal post connected to the metal pad portion; and a lower package to which an element is mounted, and which is connected to the metal post.

Abstract: The printed circuit board, according to one embodiment, comprises: an insulation substrate; a pad formed on at least one side of the insulation substrate; a protection layer which is formed on the insulation substrate and exposes an upper surface of the pad; and a bump formed on the pad exposed by the protection layer, wherein the bump comprises a plurality of solder layers having melting points different from each other.

Abstract: A printed circuit board according to the present invention comprises: an insulating substrate; a plurality of pads formed on the upper surface of the insulating substrate; a protective layer which comprises an opening part for exposing the upper surfaces of the plurality of pads, and is formed on the insulating substrate; and a metal bump which is formed on the first pad and the second pad in the plurality of pads, and projects above the surface of the protective layer, and, here, the first pad is formed to the left of the central upper part of the insulating substrate, while the second pad is formed to the right of the central upper part of the insulating substrate.

Abstract: A semiconductor package substrate includes an insulating substrate; a circuit pattern on the insulating substrate; a protective layer on the insulating substrate, the protective layer covering the circuit pattern on the insulating substrate; a pad on the protective layer; and an adhesive member on the protective layer, wherein the pad includes a first pad buried in the protective layer, and a second pad on the first pad, the second pad protruding over the protective layer.

Abstract: A printed circuit board according to an embodiment of the present invention includes an insulating layer, a pad formed on the insulating layer and exposed through an opening section of a solder resist, a bump formed by filling an opening portion of the solder resist from top of the pad and having an narrow width than the opening of the solder resist.

Abstract: A semiconductor package includes: an upper package to which an element is mounted, and which includes a metal pad portion; a metal post connected to the metal pad portion; and a lower package to which an element is mounted, and which is connected to the metal post.

Abstract: Provided is a semiconductor package, including: a lower package to which elements are mounted; a metal post connected to the lower package and including at least one metal material portion; and an upper package to which elements is mounted, and which is connected to the metal post via a solder ball.

Abstract: A printed circuit board includes an insulating substrate, a plurality of pads on a top surface of the insulating substrate, a protective layer formed on the insulating substrate and having an opening to expose top surfaces of the pads, a bump formed on at least one of the pads and protruding upward of a surface of the protective layer. The bump has a curved lateral side.

Abstract: A semiconductor package substrate includes an insulating substrate, a circuit pattern on the insulating substrate, a protective layer formed on the insulating substrate to cover the circuit pattern on the insulating substrate, a pad formed on the protective layer while protruding from a surface of the protective layer, and an adhesive member on the pad.

Abstract: A semiconductor package substrate includes an insulating substrate; a circuit pattern on the insulating substrate; a protective layer on the insulating substrate, the protective layer covering the circuit pattern on the insulating substrate; a pad on the protective layer; and an adhesive member on the protective layer, wherein the pad includes a first pad buried in the protective layer, and a second pad on the first pad, the second pad protruding over the protective layer.